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CBTL03SB212BS,515

NXP Semiconductors

CBTL03SB212BS,515 by NXP Semiconductors

Multiplexer/Demultiplexers; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,468 parts In-Stock

1+ parts

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1k+ parts

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2,468

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Digiode

USA . 1,586 parts In-Stock

1+ parts

-

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1,586

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Vyrian

USA . 87 parts In-Stock

1+ parts

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87

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 640 parts In-Stock

1+ parts

$0.310

100+ parts

-

1k+ parts

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10k+ parts

$0.298

640

$0.310

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-

$0.298

Northwest PG Solutions

USA . 810 parts In-Stock

1+ parts

$0.341

100+ parts

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10k+ parts

$0.301

810

$0.341

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-

$0.301

One Stop Electronics

USA . 1,074 parts In-Stock

1+ parts

$34.000

100+ parts

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1,074

$34.000

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Component Stockers USA

USA . 623 parts In-Stock

1+ parts

$99.990

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623

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,931 parts In-Stock

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8,931

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Microchip USA

USA . 4,106 parts In-Stock

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4,106

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Corphita

USA . 2,172 parts In-Stock

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2,172

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UNI Independent Distributors

Spain . 1,924 parts In-Stock

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1,924

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Technical Specifications

Multiplexer & Demultiplexer CBTL03SB212BS,515 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Terminal Finish:

MATTE TIN

Trade Compliance

CBTL03SB212BS,515 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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Authentic purchasing experiences

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