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CBTL06122AHF

NXP Semiconductors

CBTL06122AHF by NXP Semiconductors

MULTIPLEXER; Terminal Form: NO LEAD; No. of Terminals: 56; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; JESD-30 Code: R-PQCC-N56;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,151 parts In-Stock

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A2Z Electronics, Inc.

USA . 1,320 parts In-Stock

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Digiode

USA . 951 parts In-Stock

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Vyrian

USA . 419 parts In-Stock

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J2 Sourcing AB

Sweden . 41 parts In-Stock

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One Stop Electronics

USA . 1,427 parts In-Stock

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$50.000

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A-Z Elektronik GmbH

Germany . 4,941 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,294 parts In-Stock

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Kepictronics

USA . 2,617 parts In-Stock

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Northwest PG Solutions

USA . 1,925 parts In-Stock

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Corphita

USA . 1,766 parts In-Stock

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Native Components

USA . 976 parts In-Stock

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UNI Independent Distributors

Spain . 819 parts In-Stock

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Technical Specifications

Multiplexer & Demultiplexer CBTL06122AHF attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PQCC-N56

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

56

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

CBTL06122AHF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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