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CBTL03SB212BS

NXP Semiconductors

CBTL03SB212BS by NXP Semiconductors

CBTL03SB212BS from NXP Semiconductors is a versatile multiplexer/demultiplexer in a compact square chip carrier package. It features 20 terminals, surface mount capability, and no lead design for efficient space utilization. Ideal for signal routing in advanced electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,494 parts In-Stock

1+ parts

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2,494

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Digiode

USA . 2,020 parts In-Stock

1+ parts

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2,020

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Vyrian

USA . 459 parts In-Stock

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459

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 41 parts In-Stock

1+ parts

$0.041

100+ parts

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1k+ parts

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10k+ parts

$0.040

41

$0.041

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$0.040

One Stop Electronics

USA . 447 parts In-Stock

1+ parts

$22.000

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447

$22.000

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UNI Independent Distributors

Spain . 7,442 parts In-Stock

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7,442

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Corphita

USA . 1,378 parts In-Stock

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1,378

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Northwest PG Solutions

USA . 169 parts In-Stock

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169

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Overview

Unlock superior performance with the CBTL03SB212BS by NXP Semiconductors, a leader in innovative solutions. This versatile multiplexer/demultiplexer excels in enhancing signal integrity across various applications, from consumer electronics to automotive systems. NXP's commitment to quality ensures reliability and longevity, empowering customers to achieve seamless connectivity. Experience unmatched value and benefits that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mount compatible allows for efficient PCB design, saving space and enabling high-density layouts, which is essential in modern electronics.

Package Shape: SQUARE

The square package shape optimizes the use of board space and facilitates uniform heat distribution, enhancing performance reliability.

No. of Terminals: 20

With 20 terminals, this multiplexer/demultiplexer provides ample connectivity options for various signal routing configurations, ensuring versatility in design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for easier handling and soldering during assembly, making it a user-friendly choice for manufacturing.

Terminal Position: QUAD

The quad terminal position improves access for connections, which is beneficial in applications requiring compact and efficient layouts.

Terminal Form: NO LEAD

The no lead terminal form enhances the device's profile for surface mounting, reduces PCB space, and meets environmental standards by minimizing lead content.

Technical Specifications

Multiplexer & Demultiplexer CBTL03SB212BS attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N20

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

CBTL03SB212BS Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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