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CBTL04DP211BS

NXP Semiconductors

CBTL04DP211BS by NXP Semiconductors

CBTL04DP211BS from NXP Semiconductors is a versatile multiplexer with 2 inputs, designed for industrial applications. It operates at a nominal voltage of 3.3V and withstands temperatures from -40 °C to 85 °C. Its compact size (6mm x 3mm) and no-lead design make it ideal for space-constrained environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

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Anansix

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Digiode

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Vyrian

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One Stop Electronics

USA . 806 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,324 parts In-Stock

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UNI Independent Distributors

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Alle Elektronik GmbH

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Corphita

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Authorized Procurement Solutions

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Native Components

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Northwest PG Solutions

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Overview

Unlock unparalleled performance with the CBTL04DP211BS from NXP Semiconductors! This high-quality multiplexer combines advanced technology with reliability, ensuring seamless functionality across diverse applications. Designed for demanding environments, it thrives at temperatures ranging from -40 °C to 85 °C. Elevate your projects with its compact structure and superior signal management, offering customers enhanced efficiency and versatility that stand out in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a range of applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly in modern electronic circuits.

No. of Inputs: 2

Having two inputs provides flexibility in design while maintaining simplicity for smaller applications.

Package Shape: RECTANGULAR

The rectangular shape contributes to efficient space utilization on PCBs, making it easier to fit into compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal 3.3 V makes it compatible with a wide range of digital circuits and power supplies.

No. of Terminals: 32

A higher number of terminals allows for increased functionality and the ability to connect multiple inputs and outputs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink design improve thermal management and space-saving in compact applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, it is suitable for industrial applications that require reliability in challenging environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures performance in extreme conditions, enhancing its application range.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and durability, ensuring long-term reliability in connections.

Terminal Position: QUAD

The quad terminal position allows for efficient layout on PCBs, enabling better routing of signals.

Maximum Seated Height: 1 mm

A low seated height facilitates integration into ultra-slim devices, catering to modern low-profile design requirements.

Width: 3 mm

The compact width enhances design flexibility, allowing it to fit in tight spaces on PCBs.

Output Polarity: CONFIGURABLE

Configurable output polarity provides greater design flexibility, making it adaptable for various applications.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage allows it to be powered by a wider array of power sources, maximizing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

A longer duration at peak reflow temperature ensures reliable soldering in assembly processes.

Peak Reflow Temperature °C: 260

With the ability to withstand high reflow temperatures, it is compatible with lead-free soldering processes.

Length: 6 mm

A compact length helps save space on the PCB layout, crucial for miniaturized applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, it is designed for reliability in demanding operational environments.

Terminal Form: NO LEAD

Leadless terminal form reduces the risks associated with lead contamination, aligning with modern manufacturing practices.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for higher density connections on PCBs, accommodating more functionalities in limited space.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that it can withstand some humidity, enhancing its reliability in various environments.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with slightly varied power supply outputs.

Technical Specifications

Multiplexer & Demultiplexer CBTL04DP211BS attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PQCC-N32

JESD-609 Code:

e4

Length:

6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

CONFIGURABLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

CBTL04DP211BS Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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