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CBTL02042ABQ

NXP Semiconductors

CBTL02042ABQ by NXP Semiconductors

CBTL02042ABQ by NXP Semiconductors is a CMOS multiplexer with a 300 ns propagation delay and operates at a nominal voltage of 3.3V. It features a compact, no-lead design suitable for industrial applications. With 2 inputs and a max temp of 85 °C, it ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Chip Stock

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Flip Electronics

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Quantum Digital Technology

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Anansix

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Sensible Micro Corp

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Digiode

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Native Components

USA . 861 parts In-Stock

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Northwest PG Solutions

USA . 307 parts In-Stock

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One Stop Electronics

USA . 829 parts In-Stock

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Alle Elektronik GmbH

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Overview

Elevate your designs with the CBTL02042ABQ from NXP Semiconductors—a trusted name in innovative solutions. This high-quality multiplexer delivers exceptional performance, reliability, and versatility for your applications, whether in automotive, industrial, or consumer electronics. With a compact design and outstanding thermal stability, it ensures efficient signal routing while minimizing power consumption. Choose NXP for unmatched quality and empower your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 300 ns

A low propagation delay ensures fast switching speeds, which is crucial for high-speed digital applications.

Surface Mount: YES

Surface mount technology allows for a more compact design, optimizing PCB space and facilitating automated assembly processes.

No. of Inputs: 2

Having two inputs provides versatility for various multiplexing and demultiplexing tasks, allowing for efficient data routing.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for layout configurations, ensuring easy integration into existing circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V makes this product compatible with common logic levels in modern electronics.

Load Capacitance (CL): 50 pF

A low load capacitance ensures minimal signal degradation and faster switching times, improving overall circuit performance.

No. of Terminals: 20

With 20 terminals, the device provides ample connectivity options, accommodating various circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile enhances thermal performance and reduces space on PCB, making it ideal for compact devices.

Propagation Delay (tpd): 300 ns

Consistent propagation delay supports predictable and reliable performance in timing-sensitive applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature rating ensures reliability in demanding environments, suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output capability adds flexibility in data handling, allowing multiple devices to share the same lines without interference.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this product suitable for harsh environments and critical applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances solderability and corrosion resistance, ensuring better long-term reliability.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and enhances signal integrity over shorter distances.

Maximum Seated Height: 1 mm

A low seated height allows for additional space savings in designs where height is a constraint.

Width: 2.5 mm

A narrow width contributes to a compact design, making it a good fit for space-constrained applications.

Output Polarity: TRUE

True output polarity ensures consistency in signal integrity, crucial for proper functioning in logic circuits.

Minimum Supply Voltage (Vsup): 3 V

Lower minimum supply voltage expands the range of applications where this device can be effectively used.

Maximum Time At Peak Reflow Temperature (s): 30

This specification allows for convenient reflow soldering processes, reducing risks of thermal damage to the component.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with modern soldering techniques, enhancing manufacturing efficiency.

Length: 4.5 mm

A compact length is beneficial for applications needing miniaturization without sacrificing functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating guarantees performance and reliability in challenging environments.

Technology: CMOS

CMOS technology is energy-efficient and enables high-speed performance, making this product suitable for a wide range of applications.

Terminal Form: NO LEAD

No-lead design reduces parasitic inductance, allowing for better performance at high frequencies.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for dense layouts, making it perfect for high-density PCB designs.

Maximum Supply Voltage (Vsup): 3.6 V

Support for a maximum supply voltage of 3.6V ensures compatibility with a wide range of power supply designs.

Maximum Power Supply Current (ICC): 2.5 mA

A low maximum power supply current contributes to energy efficiency, making it suitable for battery-powered applications.

Technical Specifications

Multiplexer & Demultiplexer CBTL02042ABQ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

CBTLV/3B

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Load Capacitance (CL):

50 pF

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.1X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

2.5 mA

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

CBTL02042ABQ Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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