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CBTL01023GM

NXP Semiconductors

CBTL01023GM by NXP Semiconductors

CBTL01023GM by NXP Semiconductors is a CMOS multiplexer with 2 inputs, designed for industrial applications. It operates b/w -40 °C and 85 °C, with a nominal voltage of 3.3V. Its compact chip carrier design ensures efficient surface mounting in space-constrained environments.

Median Price

$0.803

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 5,465 parts In-Stock

1+ parts

$0.803

100+ parts

$0.462

1k+ parts

$0.429

10k+ parts

$0.377

5,465

$0.803

$0.462

$0.429

$0.377

Cyclops Electronics Ltd

UK . 20,000 parts In-Stock

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20,000

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Digiode

USA . 3,098 parts In-Stock

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3,098

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Vyrian

USA . 207 parts In-Stock

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207

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Anansix

USA . 156 parts In-Stock

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156

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Distributors (Availability)

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One Stop Electronics

USA . 1,522 parts In-Stock

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$59.000

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1,522

$59.000

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GreenTree Electronics

Israel . 31,591 parts In-Stock

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Kepictronics

USA . 21,837 parts In-Stock

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Perfect Parts

USA . 16,800 parts In-Stock

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16,800

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A-Z Elektronik GmbH

Germany . 13,000 parts In-Stock

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13,000

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UNI Independent Distributors

Spain . 8,043 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Northwest PG Solutions

USA . 2,263 parts In-Stock

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$3.528

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2,263

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$3.528

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

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2,000

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Corphita

USA . 309 parts In-Stock

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309

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Native Components

USA . 267 parts In-Stock

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$3.492

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267

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Overview

Elevate your designs with the CBTL01023GM from NXP Semiconductors, a cutting-edge multiplexer that combines superior performance with exceptional reliability. Designed for diverse applications, this device ensures seamless data management while thriving in challenging environments with its robust temperature range. With its compact, thin profile and high-quality materials, the CBTL01023GM not only enhances efficiency but also drives innovation, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight and cost-effective packaging, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on printed circuit boards.

No. of Inputs: 2

With 2 inputs, the product can efficiently handle simple multiplexing tasks, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for better board layout and can fit in tight spaces.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal supply voltage of 3.3 V aligns with common voltage levels in modern digital circuits, facilitating easy integration.

No. of Terminals: 10

Ten terminals provide flexibility in connection options, accommodating various design requirements.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile of the chip carrier helps save space in densely populated circuit boards and enhances thermal performance.

Maximum Operating Temperature: 85 °C

The high operating temperature tolerance enables use in industrial applications where heat is a concern.

Output Characteristics: 3-STATE

3-state output characteristics allow for more versatile design in controlling multiple outputs without interference.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this product ideal for harsh environments found in industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish improves conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing on PCB, providing design flexibility.

Maximum Seated Height: 0.5 mm

The low seated height ensures compatibility with low-profile designs and helps save space.

Width: 1.55 mm

A compact width allows for the utilization in space-constrained designs without sacrificing performance.

Output Polarity: TRUE

True output polarity is vital for ensuring correct logic levels in digital circuits, enhancing reliability.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum of 3 V enhances versatility, allowing use in varying supply voltage scenarios.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes in surface mount technology.

Peak Reflow Temperature: 260 °C

High peak reflow temperature tolerance allows for durability during assembly and reflow soldering.

Length: 2 mm

The short length contributes to a compact design, allowing for denser arrangements on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures consistent performance in demanding environments with temperature fluctuations.

Technology: CMOS

CMOS technology offers low power consumption, making this product ideal for battery-operated devices.

Terminal Form: NO LEAD

No-lead design reduces the footprint and enhances the reliability of solder joints, ideal for high-density applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is suitable for modern compact boards, allowing for efficient use of space.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with various power supply designs, catering to diverse applications.

Technical Specifications

Multiplexer & Demultiplexer CBTL01023GM attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PQCC-N10

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.55 mm

Trade Compliance

CBTL01023GM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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