Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; No. of Words Code: 16K; Technology: CMOS; Maximum Access Time: 450 ns;
Median Price
$725.000
Lifecycle Status
Suppliers In-Stock
10
In-Stock Inventory
1k+
Arrow
1+ parts
100+ parts
$498.000
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10k+ parts
Verical
Digiode
$964.250
Vyrian
Anansix
Flip Electronics
Resion
Electronic Expediters
Odi Ramu Company
QIE Inc.
MARBEL Systems
$2.981
Texas Native Microelectronics
$3.426
$3.289
$3.186
$3.015
Kenton Components
$4.111
$3.618
Qasali Group International
$9.250
$8.603
$8.140
Corphita
$913.500
Component Stockers USA
$1,115.940
UNI Independent Distributors
Northwest PG Solutions
Native Components
EPROM 8510201YA attributes and parameters. Explore more EPROM devices from NXP Semiconductors
Maximum Access Time:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Organization:
Package Body Material:
Package Style (Meter):
Technology:
Terminal Position:
8510201YA Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
NSN
5962-01-314-0726, 5962013140726, 5962-01-314-0728, 5962013140728, 5962-01-243-3610, 5962012433610, 5962-01-290-5577, 5962012905577, 5962-01-394-8388, 5962013948388, 5962-01-353-3056, 5962013533056, 5962-01-345-6452, 5962013456452, 5962-01-314-0727, 5962013140727, 5962-01-444-1143, 5962014441143, 5962-01-338-3727, 5962013383727, 5962-01-313-9921, 5962013139921, 5962-01-356-8609, 5962013568609, 5962-01-531-1579, 5962015311579, 5962-01-441-2771, 5962014412771, 5962-01-441-2769, 5962014412769
NIIN
013140726, 013140728, 012433610, 012905577, 013948388, 013533056, 013456452, 013140727, 014441143, 013383727, 013139921, 013568609, 015311579, 014412771, 014412769
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jiangsu Jiejie Microelectronics
Yangzhou Yangjie Electronics
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
Secos
BAV99
Motorola
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; JESD-609 Code: e0;
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
Taiwan Semiconductor
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
LL4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Comchip Technology
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
EPC1PI8
Intel
EPC1PI8 by Intel is an EPROM with 1046496X1 organization, 3-STATE output, and SERIAL technology. It operates at 3.3V with a max temperature of 85°C. Ideal for configuration memory applications due to its high memory density and low standby current of 0.0001Amp.
TMS27C49-45JTL
Texas Instruments
TMS27C49-45JTL by Texas Instruments is an 8KX8 EPROM with 65536 bit memory density. It operates at 5V, has a max access time of 45ns, and offers 3-STATE output characteristics. Ideal for commercial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
SMJ27C256-120JM
SMJ27C256-120JM by Texas Instruments is a 32KX8 EPROM with 125°C max temp, -55°C min temp, and 120 ns access time. Ideal for military applications requiring 262144 bit memory density and 3-STATE output characteristics.
TMS27C400-12JL
TMS27C400-12JL by Texas Instruments is a 512KX8 EPROM with 120ns access time, 3-STATE output, and operates at 5V. Commonly used in commercial applications for memory storage due to its 524288 words capacity and CMOS technology.
M27C64A-20F6
STMicroelectronics
M27C64A-20F6 by STMicroelectronics is an 8KX8 EPROM with 65536 bit memory density, operating at 5V. It features a max access time of 200ns and is ideal for industrial applications requiring reliable non-volatile memory storage. The device has a parallel interface with 28 terminals in an in-line package style, suitable for various embedded systems.
M27C1001-15XF1L
M27C1001-15XF1L EPROM by STMicroelectronics features 128KX8 organization, 150 ns access time, and 1048576 bit memory density. It is used in applications requiring reliable non-volatile memory storage with a parallel interface.
5962-8961406QXA
Texas Instruments' 5962-8961406QXA EPROM operates asynchronously with 128KX8 organization, featuring a 125°C max temp and -55°C min temp. Ideal for military applications due to its CMOS technology, it offers 1048576 bit memory density and a max access time of 120 ns.
TMX27C512-30JL
TMX27C512-30JL by Texas Instruments is a 64KX8 EPROM with 300 ns access time, operating at 5V. It features 3-STATE output and CMOS technology, suitable for commercial applications requiring fast parallel memory access in a compact IN-LINE package.
M27C1001-20F3X
M27C1001-20F3X EPROM by STMicroelectronics features 128Kx8 organization, 120ns max access time, and 5V nominal voltage. Ideal for automotive applications, this CMOS technology memory IC offers a memory density of 1048576 bits in a rectangular ceramic package with through-hole terminals.
TMS27C32-25JE
TMS27C32-25JE by Texas Instruments is a 4KX8 EPROM with 3-STATE output, operating at -40 to 85 °C. It has a supply voltage of 4.5-5.5V and max access time of 250ns. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
TMS27C010A-12JL4
TMS27C010A-12JL4 EPROM by Texas Instruments features 128KX8 organization, 120 ns access time, and 1048576 bit memory density. It is commonly used in commercial applications requiring a 5V nominal voltage and asynchronous operating mode.
TMS27C040-100JE4
TMS27C040-100JE4 by Texas Instruments is a 512KX8 EPROM with 100 ns access time, operating at 5V. It features 3-STATE output and INDUSTRIAL temperature grade. Ideal for applications requiring fast parallel memory access in industrial environments.
M27C1001-20XL6
M27C1001-20XL6 by STMicroelectronics is an EPROM chip with 128KX8 organization, 120 ns access time, and 3-STATE output characteristics. It operates at a temperature range of -40 to 85 °C and is commonly used in industrial applications requiring non-volatile memory storage.
TMS27C210A-20JL4
TMS27C210A-20JL4 by Texas Instruments is a 64KX16 EPROM with 3-STATE output, operating at 5V. It has a max access time of 200ns and memory density of 1048576 bit. Commonly used in commercial applications requiring reliable non-volatile memory storage.
D27C256
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;
NMC27C16BQ200
National Semiconductor
NMC27C16BQ200 by National Semiconductor is a 2KX8 EPROM with 16384 bit memory density. It operates at 5V, has a max access time of 200ns, and features a 3-STATE output. Commonly used in commercial applications requiring reliable non-volatile memory storage.
TMS276425JP4
TMS276425JP4 by Texas Instruments is an 8Kx8 EPROM with 65536 bit memory density. Operating at 5V, it offers a max access time of 250ns and features a 3-STATE output. Ideal for applications requiring non-volatile memory storage in devices such as industrial control systems and embedded electronics.
TMS27C256-17JL4
TMS27C256-17JL4 by Texas Instruments is a 32KX8 EPROM with 170ns access time, 262144-bit memory density, and operates at 5V. It is used in commercial applications for storing data securely due to its UVPROM technology and through-hole terminal form.
TMS27C210A-200JL
TMS27C210A-200JL by Texas Instruments is a 64KX16 EPROM with 200 ns access time, 3-STATE output, and CMOS technology. It operates at 5V and has a memory density of 1048576 bit. Ideal for applications requiring fast data retrieval in commercial temperature environments.
TMS27C010A-200JE
TMS27C010A-200JE by Texas Instruments is a 128KX8 EPROM with 3-STATE output, operating at 5V. It has a max access time of 200ns and is ideal for industrial applications requiring reliable non-volatile memory storage in a ceramic, glass-sealed package.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
8510201ZA
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; No. of Functions: 1;
Qp Semiconductor
UVPROM; No. of Terminals: 28; Qualification: Not Qualified; Package Style (Meter): IN-LINE; No. of Words Code: 16K; Memory Width: 8;
Rochester Electronics
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Surface Mount: YES;
Defense Logistics Agency
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
NXP Semiconductors
UVPROM; No. of Terminals: 28; No. of Words: 16384 words; Maximum Access Time: 450 ns; Memory Density: 131072 bit; Terminal Position: DUAL;
Teledyne E2v (Uk)
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; No. of Words: 16384 words;
8510202YA
UVPROM; No. of Terminals: 28; Maximum Access Time: 450 ns; No. of Words Code: 16K; Organization: 16KX8; Terminal Position: DUAL;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
UVPROM; No. of Terminals: 28; Technology: CMOS; Terminal Position: DUAL; Organization: 16KX8; No. of Words: 16384 words;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16K;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
UVPROM; No. of Terminals: 28; Memory Width: 8; Organization: 16KX8; Package Style (Meter): IN-LINE; Terminal Position: DUAL;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;
8510202YX
UVPROM; No. of Terminals: 28; Technology: CMOS; Memory Density: 131072 bit; No. of Functions: 1; Organization: 16KX8;
8510202ZA
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; Technology: CMOS; No. of Words Code: 16K; Terminal Position: DUAL;
8510201ZX
UVPROM; No. of Terminals: 28; Package Body Material: CERAMIC, GLASS-SEALED; Technology: CMOS; No. of Words: 16384 words; Memory Width: 8;
8510202ZX
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; Package Body Material: CERAMIC, GLASS-SEALED; Technology: CMOS; Memory Width: 8;
8510201YX
UVPROM; No. of Terminals: 28; Package Body Material: CERAMIC, GLASS-SEALED; No. of Functions: 1; Memory Density: 131072 bit; No. of Words: 16384 words;
8510203YA
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 65536 bit;
UVPROM; No. of Terminals: 28; Organization: 16KX8; Memory Width: 8; Memory Density: 131072 bit; Maximum Access Time: 450 ns;
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