Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; No. of Words Code: 16K; Technology: CMOS; Maximum Access Time: 450 ns;
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$725.000
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1+ parts
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$498.000
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Verical
Digiode
$964.250
Vyrian
Anansix
Flip Electronics
Resion
Electronic Expediters
Odi Ramu Company
QIE Inc.
MARBEL Systems
$2.981
Texas Native Microelectronics
$3.426
$3.289
$3.186
$3.015
Kenton Components
$4.111
$3.618
Qasali Group International
$9.250
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Corphita
$913.500
Component Stockers USA
$1,115.940
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EPROM 8510201YA attributes and parameters. Explore more EPROM devices from NXP Semiconductors
Maximum Access Time:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Organization:
Package Body Material:
Package Style (Meter):
Technology:
Terminal Position:
8510201YA Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
NSN
5962-01-314-0726, 5962013140726, 5962-01-314-0728, 5962013140728, 5962-01-243-3610, 5962012433610, 5962-01-290-5577, 5962012905577, 5962-01-394-8388, 5962013948388, 5962-01-353-3056, 5962013533056, 5962-01-345-6452, 5962013456452, 5962-01-314-0727, 5962013140727, 5962-01-444-1143, 5962014441143, 5962-01-338-3727, 5962013383727, 5962-01-313-9921, 5962013139921, 5962-01-356-8609, 5962013568609, 5962-01-531-1579, 5962015311579, 5962-01-441-2771, 5962014412771, 5962-01-441-2769, 5962014412769
NIIN
013140726, 013140728, 012433610, 012905577, 013948388, 013533056, 013456452, 013140727, 014441143, 013383727, 013139921, 013568609, 015311579, 014412771, 014412769
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
1N4148
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
BAV99
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
EU2B-YS303C
Idec
ROTARY SWITCH;
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
Diotec Semiconductor Ag
LL4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ISO1050DUBR
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
TMS27C512-3JE4
TMS27C512-3JE4 by Texas Instruments is a 64KX8 EPROM with 300 ns access time, 5V supply voltage, and 524288-bit memory density. It operates in industrial temperature range and has through-hole terminals. Commonly used for storing firmware in embedded systems due to its high memory capacity and fast access speed.
TMS27C128-25JL
TMS27C128-25JL by Texas Instruments is a 16KX8 EPROM with 250ns access time, 5V supply voltage, and 3-STATE output. It is used in commercial applications requiring non-volatile memory storage in a rectangular ceramic package.
5962-8961406QXX
The Texas Instruments 5962-8961406QXX is a MILITARY-grade EPROM with 128KX8 organization, CMOS technology, and 120 ns access time. It operates at temperatures from -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
TMS27C020-100JL4
TMS27C020-100JL4 by Texas Instruments is a 256KX8 EPROM with 100 ns access time, 3-STATE output, and operates at 5V. It is commonly used in commercial applications requiring fast memory access and reliable data storage.
TMS27C128-12JL4
TMS27C128-12JL4 by Texas Instruments is a 16KX8 EPROM with 120ns access time, 5V supply voltage, and 3-STATE output. It is used in commercial applications requiring reliable memory storage in a rectangular ceramic package.
TMS27C210A-120JE4
TMS27C210A-120JE4 by Texas Instruments is a 64KX16 EPROM with 120 ns access time, operating at 5V. It features a 3-STATE output and is ideal for industrial applications requiring reliable non-volatile memory storage in a ceramic, glass-sealed package.
TMS27C210A-200JL4
TMS27C210A-200JL4 by Texas Instruments is a 64KX16 EPROM with 3-STATE output, operating at 5V. It has a max access time of 200ns and is ideal for commercial applications requiring UVPROM memory technology in a ceramic, glass-sealed package.
TMS27C32-2JL4
TMS27C32-2JL4 by Texas Instruments is a 4KX8 EPROM with 3-STATE output, operating at 5V. It has a max access time of 200ns and memory density of 32768 bit. Commonly used in commercial applications requiring fast parallel memory access.
TMS27C020-15JL4
TMS27C020-15JL4 by Texas Instruments is a 256KX8 EPROM with 150 ns access time, 5V supply voltage, and 32 terminals. It is used in commercial applications for storing data in parallel format with a memory density of 2097152 bit.
TMS27C210A-15JE
TMS27C210A-15JE by Texas Instruments is a 64KX16 EPROM with 3-STATE output, operating at -40 to 85 °C. It has a supply voltage of 4.5-5.5V and max access time of 150ns. Ideal for industrial applications requiring reliable non-volatile memory storage in parallel configuration.
5962-9175205MXA
The Texas Instruments 5962-9175205MXA is a military-grade EPROM with 512KX8 organization, CMOS technology, and 524288 words. It operates asynchronously at temperatures ranging from -55 to 125 °C and has a max access time of 120 ns. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
M27C1001-12F1
STMicroelectronics
The STMicroelectronics M27C1001-12F1 is a 128KX8 EPROM with 120 ns access time, operating at 5V. It features a CMOS technology, 3-STATE output characteristics, and through-hole terminal form. Ideal for applications requiring reliable non-volatile memory storage in commercial temperature environments.
EPC2LI20N
Intel
EPC2LI20N by Intel is a 20-terminal EPROM chip with synchronous operation and 3-STATE output. It operates at a voltage of 3.3V, suitable for industrial applications with a temperature range of -40 to 85°C. With a memory density of 1695680 bits, it is ideal for configuration memory in electronic devices.
EPC2TC32
Altera
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Parallel or Serial: SERIAL;
TMS27C256-20JE4
TMS27C256-20JE4 by Texas Instruments is a 32KX8 EPROM with 3-STATE output, operating at 5V. It has a max access time of 200ns and memory density of 262144 bit. Ideal for industrial applications requiring reliable non-volatile memory storage.
TMS2764-20JL
TMS2764-20JL by Texas Instruments is an 8KX8 EPROM with 70°C max temp, 200ns access time, and 5V supply. It's used in commercial applications for memory storage due to its 65536-bit density and parallel interface.
5962-8751501LA
5962-8751501LA by STMicroelectronics is a military-grade EPROM with a 5V supply, featuring an asynchronous operation mode and a max access time of 45 ns. It has an organization of 8Kx8 and operates b/w -55 °C to 125°C. Ideal for reliable data storage in harsh environments.
NTE2716
Nte Electronics
NTE2716 by Nte Electronics is a 2KX8 EPROM with a memory density of 16384 bit. It operates asynchronously with a max access time of 350 ns and has a nominal voltage of 5V. This memory IC type is commonly used in commercial applications requiring fast and reliable data storage.
SMJ27C128-30JM
SMJ27C128-30JM by Texas Instruments is a 16KX8 EPROM with 125°C max temp, -55°C min temp, and 300 ns access time. Ideal for military applications due to MIL screening level and UVPROM memory IC type. Operating at 5V with 28 terminals in an IN-LINE package style.
TMS27C128-3JL
TMS27C128-3JL by Texas Instruments is a 16KX8 EPROM with 131072 bit memory density. It operates at 5V, has an access time of 300ns, and supports asynchronous mode. Commonly used in commercial applications for storing data due to its 3-STATE output characteristics.
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8510201ZA
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; No. of Functions: 1;
Qp Semiconductor
UVPROM; No. of Terminals: 28; Qualification: Not Qualified; Package Style (Meter): IN-LINE; No. of Words Code: 16K; Memory Width: 8;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Surface Mount: YES;
Defense Logistics Agency
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
NXP Semiconductors
UVPROM; No. of Terminals: 28; No. of Words: 16384 words; Maximum Access Time: 450 ns; Memory Density: 131072 bit; Terminal Position: DUAL;
Teledyne E2v (Uk)
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; No. of Words: 16384 words;
8510202YA
UVPROM; No. of Terminals: 28; Maximum Access Time: 450 ns; No. of Words Code: 16K; Organization: 16KX8; Terminal Position: DUAL;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
National Semiconductor
UVPROM; No. of Terminals: 28; Technology: CMOS; Terminal Position: DUAL; Organization: 16KX8; No. of Words: 16384 words;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16K;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
UVPROM; No. of Terminals: 28; Memory Width: 8; Organization: 16KX8; Package Style (Meter): IN-LINE; Terminal Position: DUAL;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;
8510202YX
UVPROM; No. of Terminals: 28; Technology: CMOS; Memory Density: 131072 bit; No. of Functions: 1; Organization: 16KX8;
8510202ZA
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; Technology: CMOS; No. of Words Code: 16K; Terminal Position: DUAL;
8510201ZX
UVPROM; No. of Terminals: 28; Package Body Material: CERAMIC, GLASS-SEALED; Technology: CMOS; No. of Words: 16384 words; Memory Width: 8;
8510202ZX
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; Package Body Material: CERAMIC, GLASS-SEALED; Technology: CMOS; Memory Width: 8;
8510201YX
UVPROM; No. of Terminals: 28; Package Body Material: CERAMIC, GLASS-SEALED; No. of Functions: 1; Memory Density: 131072 bit; No. of Words: 16384 words;
8510203YA
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 65536 bit;
UVPROM; No. of Terminals: 28; Organization: 16KX8; Memory Width: 8; Memory Density: 131072 bit; Maximum Access Time: 450 ns;
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