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8510201YA

NXP Semiconductors

8510201YA by NXP Semiconductors

UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; No. of Words Code: 16K; Technology: CMOS; Maximum Access Time: 450 ns;

Median Price

$725.000

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 71 parts In-Stock

1+ parts

$725.000

100+ parts

$498.000

1k+ parts

-

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71

$725.000

$498.000

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Verical

USA . 71 parts In-Stock

1+ parts

$725.000

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$498.000

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-

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71

$725.000

$498.000

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,786 parts In-Stock

1+ parts

$964.250

100+ parts

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1,786

$964.250

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Vyrian

USA . 8,231 parts In-Stock

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8,231

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Anansix

USA . 3,577 parts In-Stock

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3,577

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Flip Electronics

USA . 80 parts In-Stock

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80

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Resion

USA . 12 parts In-Stock

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12

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Electronic Expediters

USA . 6 parts In-Stock

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6

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Odi Ramu Company

Canada . 4 parts In-Stock

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QIE Inc.

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 1,475 parts In-Stock

1+ parts

$2.981

100+ parts

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1,475

$2.981

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Texas Native Microelectronics

USA . 5,230 parts In-Stock

1+ parts

$3.426

100+ parts

$3.289

1k+ parts

$3.186

10k+ parts

$3.015

5,230

$3.426

$3.289

$3.186

$3.015

Kenton Components

USA . 5,095 parts In-Stock

1+ parts

$4.111

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-

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$3.618

5,095

$4.111

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$3.618

Qasali Group International

UK . 1,332 parts In-Stock

1+ parts

$9.250

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$8.603

10k+ parts

$8.140

1,332

$9.250

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$8.603

$8.140

Corphita

USA . 5,130 parts In-Stock

1+ parts

$913.500

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5,130

$913.500

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Component Stockers USA

USA . 231 parts In-Stock

1+ parts

$1,115.940

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231

$1,115.940

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UNI Independent Distributors

Spain . 7,007 parts In-Stock

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7,007

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Northwest PG Solutions

USA . 1,734 parts In-Stock

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1,734

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Native Components

USA . 612 parts In-Stock

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612

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Technical Specifications

EPROM 8510201YA attributes and parameters. Explore more EPROM devices from NXP Semiconductors

Specs

Maximum Access Time:

450 ns

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

16384 words

No. of Words Code:

16K

Organization:

16KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Style (Meter):

IN-LINE

Technology:

CMOS

Terminal Position:

DUAL

Trade Compliance

8510201YA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

NSN

5962-01-314-0726, 5962013140726, 5962-01-314-0728, 5962013140728, 5962-01-243-3610, 5962012433610, 5962-01-290-5577, 5962012905577, 5962-01-394-8388, 5962013948388, 5962-01-353-3056, 5962013533056, 5962-01-345-6452, 5962013456452, 5962-01-314-0727, 5962013140727, 5962-01-444-1143, 5962014441143, 5962-01-338-3727, 5962013383727, 5962-01-313-9921, 5962013139921, 5962-01-356-8609, 5962013568609, 5962-01-531-1579, 5962015311579, 5962-01-441-2771, 5962014412771, 5962-01-441-2769, 5962014412769

NIIN

013140726, 013140728, 012433610, 012905577, 013948388, 013533056, 013456452, 013140727, 014441143, 013383727, 013139921, 013568609, 015311579, 014412771, 014412769

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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