Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; Technology: CMOS; No. of Words Code: 16K; Terminal Position: DUAL;
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EPROM 8510202ZA attributes and parameters. Explore more EPROM devices from NXP Semiconductors
Maximum Access Time:
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Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
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8510202ZA Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
NSN
5962-01-247-5647, 5962012475647
NIIN
012475647
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
1N4148
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
Silicon Standard
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
BAV99
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
AH180-WG-7
AH180-WG-7 by Diodes Inc. is a magnetic field sensor with 1.5mT hysteresis, 0.30V output range, and 9mA max operating current. Ideal for applications requiring non-inverting analog voltage output in a compact rectangular package suitable for surface mount installations.
MMBF170LT1G
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
LL4148-GS08
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
TMS2764A-45JP4
Texas Instruments
TMS2764A-45JP4 by Texas Instruments is an 8KX8 EPROM with 65536 bit memory density. It operates at 5V, has a max access time of 450ns, and features a 3-STATE output. This UVPROM is commonly used in applications requiring non-volatile memory storage.
D27C256
Rochester Electronics
D27C256 EPROM by Rochester Electronics features 32KX8 organization, 3-STATE output, and 262144 bit memory density. It is commonly used in commercial applications requiring a 5V nominal voltage, with a max operating temperature of 70°C and programming voltage of 12.75V.
SMJ27C128-12JM
SMJ27C128-12JM by Texas Instruments is a 16KX8 EPROM with 125°C max temp, 120 ns access time, and 5V supply. Ideal for military applications due to MIL-STD screening and UVPROM memory type. Features include 3-STATE output, 28 terminals, and common I/O type in ceramic package.
TMS27C010A-150JE
TMS27C010A-150JE by Texas Instruments is a 128KX8 EPROM with 150 ns access time, operating at 5V. It features a CMOS technology, 32 terminals in an IN-LINE package style, and supports asynchronous operation. Ideal for industrial applications requiring reliable non-volatile memory storage.
TMS27C32-25JE4
TMS27C32-25JE4 by Texas Instruments is a 4KX8 EPROM with 3-STATE output, operating at 5V. It has a max access time of 250ns and memory density of 32768 bit. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.
TMS27C020-200JL
TMS27C020-200JL by Texas Instruments is a 256KX8 EPROM with 200 ns access time, operating at 5V. It features 3-STATE output and CMOS technology, suitable for commercial applications requiring reliable memory storage in a 32-terminal package style.
8510201ZA
NXP Semiconductors' 8510201ZA EPROM features 16KX8 organization, 16384 words memory width, and 131072 bit density. This UVPROM with a max access time of 450 ns is ideal for applications requiring fast and reliable non-volatile memory storage in CMOS technology.
5962-8961406QXX
The Texas Instruments 5962-8961406QXX is a MILITARY-grade EPROM with 128KX8 organization, CMOS technology, and 120 ns access time. It operates at temperatures from -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
TMS27C510-12JE4
TMS27C510-12JE4 by Texas Instruments is a 64KX8 EPROM with 120ns access time, operating at 5V. It features a 3-STATE output and operates in industrial temperature range. Commonly used for memory storage applications due to its high density and parallel interface.
M27C1001-20XL3XTR
STMicroelectronics
STMicroelectronics M27C1001-20XL3XTR is a 128Kx8 EPROM chip with 120ns access time, 1048576-bit memory density, and 32 terminals. Commonly used in automotive applications due to its CMOS technology and -40 to 125 °C operating temperature range.
CY27C256-55WC
CY27C256-55WC by Rochester Electronics is a 32KX8 EPROM with 262144 bit memory density. It operates at 5V, has an access time of 55ns, and is ideal for commercial applications requiring reliable non-volatile memory storage.
TMS27C291-3JL
TMS27C291-3JL by Texas Instruments is a 2KX8 EPROM with 35ns access time, 3-state output, and operates at 5V. It is used in commercial applications for memory storage due to its 2048 words capacity and CMOS technology.
SMJ27C128-1JM
SMJ27C128-1JM by Texas Instruments is a 16KX8 EPROM with 3-STATE output, operating at -55 to 125 °C. It has a programming voltage of 13V and memory density of 131072 bit. Ideal for military applications due to its MIL-Grade screening level and ceramic package material.
M27C512-12F3
M27C512-12F3 EPROM by STMicroelectronics features 64KX8 organization, 120 ns access time, and 5V nominal voltage. Commonly used in automotive applications, this CMOS technology memory IC has a memory density of 524288 bit and operates in parallel mode with a max standby current of 0.0001 Amp.
TMS27C040-12JE4
TMS27C040-12JE4 by Texas Instruments is a 512KX8 EPROM with 120ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and IN-LINE package style. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact form factor.
TMS27C010A-10JE
TMS27C010A-10JE by Texas Instruments is a 128KX8 EPROM with 100ns access time, operating at 5V. It features a 32-terminal IN-LINE package and supports asynchronous mode. Ideal for industrial applications requiring reliable memory storage in a compact form factor.
M27C1001-20L1X
STMicroelectronics M27C1001-20L1X is a 128Kx8 EPROM with 120ns access time, operating at 5V. It features asynchronous mode, 3-state output, and common I/O type. Widely used in commercial applications for memory storage due to its high density and parallel interface.
TMS27C128-25JL4
TMS27C128-25JL4 by Texas Instruments is a 16KX8 EPROM with 250ns access time, 5V supply voltage, and 3-STATE output. It is used in commercial applications for memory storage due to its 131072-bit density and CMOS technology.
UPD27C512D-15
Nec Electronics America
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Organization: 64KX8;
M27C1001-15F3
STMicroelectronics' M27C1001-15F3 EPROM features 128KX8 organization, 150 ns access time, and 1048576 bit memory density. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C with a supply voltage of 4.5-5.5 V.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
Intel
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; No. of Functions: 1;
Qp Semiconductor
UVPROM; No. of Terminals: 28; Qualification: Not Qualified; Package Style (Meter): IN-LINE; No. of Words Code: 16K; Memory Width: 8;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Surface Mount: YES;
Defense Logistics Agency
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
UVPROM; No. of Terminals: 28; No. of Words: 16384 words; Maximum Access Time: 450 ns; Memory Density: 131072 bit; Terminal Position: DUAL;
Teledyne E2v (Uk)
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; No. of Words: 16384 words;
8510202YA
UVPROM; No. of Terminals: 28; Maximum Access Time: 450 ns; No. of Words Code: 16K; Organization: 16KX8; Terminal Position: DUAL;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
National Semiconductor
UVPROM; No. of Terminals: 28; Technology: CMOS; Terminal Position: DUAL; Organization: 16KX8; No. of Words: 16384 words;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16K;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
UVPROM; No. of Terminals: 28; Memory Width: 8; Organization: 16KX8; Package Style (Meter): IN-LINE; Terminal Position: DUAL;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;
8510202YX
UVPROM; No. of Terminals: 28; Technology: CMOS; Memory Density: 131072 bit; No. of Functions: 1; Organization: 16KX8;
8510201ZX
UVPROM; No. of Terminals: 28; Package Body Material: CERAMIC, GLASS-SEALED; Technology: CMOS; No. of Words: 16384 words; Memory Width: 8;
8510202ZX
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; Package Body Material: CERAMIC, GLASS-SEALED; Technology: CMOS; Memory Width: 8;
8510201YA
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; No. of Words Code: 16K; Technology: CMOS; Maximum Access Time: 450 ns;
8510201YX
UVPROM; No. of Terminals: 28; Package Body Material: CERAMIC, GLASS-SEALED; No. of Functions: 1; Memory Density: 131072 bit; No. of Words: 16384 words;
8510203YA
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 65536 bit;
UVPROM; No. of Terminals: 28; Memory Density: 131072 bit; Package Style (Meter): IN-LINE; No. of Functions: 1; No. of Words: 16384 words;
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