Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; Package Body Material: CERAMIC, GLASS-SEALED; Technology: CMOS; Memory Width: 8;
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EPROM 8510202ZX attributes and parameters. Explore more EPROM devices from NXP Semiconductors
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Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
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8510202ZX Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
NSN
5962-01-247-5647, 5962012475647
NIIN
012475647
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148WS
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
2N2222A
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
TCA6424ARGJR
Texas Instruments
TCA6424ARGJR by Texas Instruments is a CMOS parallel I/O port with 24 bits and 3 ports. It operates b/w -40 to 85°C, suitable for industrial applications. With a max clock frequency of 0.4 MHz, it offers low power consumption at only 0.03 mA supply current.
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
1N4148WT
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
Kec
TMS27C240-100JL4
TMS27C240-100JL4 by Texas Instruments is a 256KX16 EPROM with 100 ns access time, 3-STATE output, and CMOS technology. It operates at 5V and has a memory density of 4194304 bit. Commonly used in commercial applications requiring fast parallel memory access.
5962-8765004KX
STMicroelectronics
5962-8765004KX by STMicroelectronics is a military-grade EPROM with a ceramic, glass-sealed package. It operates asynchronously at 5V, featuring a max temp of 125 °C and 2048 words (2Kx8) organization. Ideal for reliable data storage in harsh environments.
EPC2LI20N
Intel
EPC2LI20N by Intel is a 20-terminal EPROM chip with synchronous operation and 3-STATE output. It operates at a voltage of 3.3V, suitable for industrial applications with a temperature range of -40 to 85°C. With a memory density of 1695680 bits, it is ideal for configuration memory in electronic devices.
NMC27C16BQ200
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: WDIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T24;
TMS27C256-1JE
TMS27C256-1JE by Texas Instruments is a 32KX8 EPROM with 3-STATE output, operating at 5V. It has an access time of 170ns and is ideal for industrial applications requiring reliable non-volatile memory storage in a ceramic, glass-sealed package.
TMS27C010A-10JL
TMS27C010A-10JL by Texas Instruments is a 128KX8 EPROM with 100ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and IN-LINE package style. Commonly used in commercial applications requiring non-volatile memory storage with parallel interface.
SMJ27C128-120JM
The Texas Instruments SMJ27C128-120JM is a 16KX8 EPROM with 125°C max temp, 120 ns access time, and 5V supply. Ideal for military applications due to its MIL-Grade tech, it offers 131072-bit memory density in a ceramic-metal package with through-hole terminals.
TMS27C020-150JE4
TMS27C020-150JE4 by Texas Instruments is a 256KX8 EPROM with 150 ns access time, operating at 5V. It features 3-STATE output and INDUSTRIAL temperature grade suitable for parallel applications. The UVPROM memory IC has a memory density of 2097152 bit and consumes up to 30 mA supply current.
TMS27C64-15JL
TMS27C64-15JL by Texas Instruments is an 8KX8 EPROM with 70°C max temp, 150 ns access time, and 5V supply. Commonly used in commercial applications for memory storage due to its 65536 bit density and parallel interface.
TMS27C32-25JE
TMS27C32-25JE by Texas Instruments is a 4KX8 EPROM with 3-STATE output, operating at -40 to 85 °C. It has a supply voltage of 4.5-5.5V and max access time of 250ns. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
M27C1001-15XL1XTR
STMicroelectronics' M27C1001-15XL1XTR is a 128Kx8 EPROM with 120ns access time, operating b/w 0-70 °C. It features 32 terminals in a chip carrier package, suitable for common I/O applications. With a memory density of 1048576 bits and low standby current of 0.0001A, it's ideal for commercial-grade CMOS technology projects.
TMS27C510-120JL
TMS27C510-120JL by Texas Instruments is a 64KX8 EPROM with 120 ns access time, operating at 5V. It features a 3-STATE output and common I/O type, suitable for commercial applications requiring fast memory access in a ceramic package.
TMS27C510-15JL
TMS27C510-15JL by Texas Instruments is a 64KX8 EPROM with 150 ns access time, operating at 5V. It features 3-STATE output characteristics and uses CMOS technology for parallel data transfer applications. The package style is IN-LINE, WINDOW, making it suitable for commercial temperature grade environments.
EPC1441PC8
Altera
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TMS27C512-12JL
TMS27C512-12JL by Texas Instruments is a 64KX8 EPROM with 120 ns access time, operating at 5V. It features 3-STATE output characteristics and is ideal for applications requiring fast and reliable non-volatile memory storage in commercial temperature environments.
TMS27C292-45JL
TMS27C292-45JL by Texas Instruments is a 2KX8 EPROM with 45 ns access time, 5V supply voltage, and 3-STATE output. It is ideal for commercial applications requiring fast memory access in a compact IN-LINE package with through-hole terminals.
TMS27C128-25JE4
TMS27C128-25JE4 by Texas Instruments is a 16KX8 EPROM with 250ns access time, 5V supply voltage, and 3-STATE output. Commonly used in industrial applications for memory storage due to its 131072-bit density and CMOS technology.
MBM27256-25
Fujitsu Semiconductor America
MBM27256-25 by Fujitsu is a 32KX8 EPROM with 262144 bit memory density. Operating at 5V, it offers 250 ns access time and features a 3-STATE output. Suitable for commercial applications, this chip carrier has a rectangular shape and is surface mountable.
TMS2764-35JL
TMS2764-35JL by Texas Instruments is an EPROM with 8KX8 organization, 65536 bit memory density, and 350 ns max access time. It operates at a nominal voltage of 5V and has a programming voltage of 21V. Commonly used in commercial applications requiring fast memory access and reliable data storage.
TMX27C512-4JL
TMX27C512-4JL by Texas Instruments is a 64KX8 EPROM with 5V supply, 450 ns access time, and 3-STATE output. It is used in commercial applications requiring reliable non-volatile memory storage in a rectangular ceramic package.
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8510201ZA
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; No. of Functions: 1;
Qp Semiconductor
UVPROM; No. of Terminals: 28; Qualification: Not Qualified; Package Style (Meter): IN-LINE; No. of Words Code: 16K; Memory Width: 8;
Rochester Electronics
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Surface Mount: YES;
Defense Logistics Agency
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
NXP Semiconductors
UVPROM; No. of Terminals: 28; No. of Words: 16384 words; Maximum Access Time: 450 ns; Memory Density: 131072 bit; Terminal Position: DUAL;
Teledyne E2v (Uk)
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR; No. of Words: 16384 words;
8510202YA
UVPROM; No. of Terminals: 28; Maximum Access Time: 450 ns; No. of Words Code: 16K; Organization: 16KX8; Terminal Position: DUAL;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
UVPROM; No. of Terminals: 28; Technology: CMOS; Terminal Position: DUAL; Organization: 16KX8; No. of Words: 16384 words;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16K;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
UVPROM; No. of Terminals: 28; Memory Width: 8; Organization: 16KX8; Package Style (Meter): IN-LINE; Terminal Position: DUAL;
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;
8510202YX
UVPROM; No. of Terminals: 28; Technology: CMOS; Memory Density: 131072 bit; No. of Functions: 1; Organization: 16KX8;
8510202ZA
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; Technology: CMOS; No. of Words Code: 16K; Terminal Position: DUAL;
8510201ZX
UVPROM; No. of Terminals: 28; Package Body Material: CERAMIC, GLASS-SEALED; Technology: CMOS; No. of Words: 16384 words; Memory Width: 8;
8510201YA
UVPROM; No. of Terminals: 28; Package Style (Meter): IN-LINE; No. of Words Code: 16K; Technology: CMOS; Maximum Access Time: 450 ns;
8510201YX
UVPROM; No. of Terminals: 28; Package Body Material: CERAMIC, GLASS-SEALED; No. of Functions: 1; Memory Density: 131072 bit; No. of Words: 16384 words;
8510203YA
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 65536 bit;
8510202ZX
UVPROM; No. of Terminals: 28; Organization: 16KX8; No. of Functions: 1; No. of Words Code: 16K; Technology: CMOS;
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