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8510201ZX

NXP Semiconductors

8510201ZX by NXP Semiconductors

UVPROM; No. of Terminals: 28; Package Body Material: CERAMIC, GLASS-SEALED; Technology: CMOS; No. of Words: 16384 words; Memory Width: 8;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,199 parts In-Stock

1+ parts

-

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1k+ parts

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4,199

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Anansix

USA . 1,609 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,609

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Vyrian

USA . 451 parts In-Stock

1+ parts

-

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451

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 5,389 parts In-Stock

1+ parts

$4.610

100+ parts

-

1k+ parts

-

10k+ parts

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5,389

$4.610

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Texas Native Microelectronics

USA . 120 parts In-Stock

1+ parts

$5.299

100+ parts

$5.087

1k+ parts

$4.928

10k+ parts

$4.663

120

$5.299

$5.087

$4.928

$4.663

Kenton Components

USA . 3,538 parts In-Stock

1+ parts

$6.359

100+ parts

-

1k+ parts

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10k+ parts

$5.596

3,538

$6.359

-

-

$5.596

Qasali Group International

UK . 364 parts In-Stock

1+ parts

$14.307

100+ parts

-

1k+ parts

$13.306

10k+ parts

$12.590

364

$14.307

-

$13.306

$12.590

One Stop Electronics

USA . 381 parts In-Stock

1+ parts

$26.000

100+ parts

-

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10k+ parts

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381

$26.000

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Native Components

USA . 182 parts In-Stock

1+ parts

$61.230

100+ parts

-

1k+ parts

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10k+ parts

$58.781

182

$61.230

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-

$58.781

Northwest PG Solutions

USA . 1,909 parts In-Stock

1+ parts

$67.353

100+ parts

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1,909

$67.353

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UNI Independent Distributors

Spain . 7,355 parts In-Stock

1+ parts

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7,355

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Corphita

USA . 3,386 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,386

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Technical Specifications

EPROM 8510201ZX attributes and parameters. Explore more EPROM devices from NXP Semiconductors

Specs

Maximum Access Time:

450 ns

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

16384 words

No. of Words Code:

16K

Organization:

16KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Style (Meter):

IN-LINE

Technology:

CMOS

Terminal Position:

DUAL

Trade Compliance

8510201ZX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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