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M2732A-2F1

STMicroelectronics

M2732A-2F1 by STMicroelectronics

M2732A-2F1 EPROM by STMicroelectronics features 4KX8 organization, 3-STATE output, and 5V nominal voltage. It is commonly used in commercial applications requiring a memory density of 32768 bit with a max access time of 200 ns.

Median Price

$7.110

Lifecycle Status

Suppliers In-Stock

41

In-Stock Inventory

1k+

Distributors (In-Stock)

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Forefront Electronics and Design

USA . 53 parts In-Stock

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$4.900

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TEDSS.com

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Component Electronics Inc.

Canada . 1,108 parts In-Stock

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American Microsemiconductor Inc.

USA . 33 parts In-Stock

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Bristol Electronics

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MRC Electronics

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Vyrian

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Digiode

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LWI Electronics Inc

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Vectronix, Inc

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Pegasus Components GmbH

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Connector Distribution Corp

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Right Parts Inc.

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Lakeview Electronics

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Q Components

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Semi Source

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Atlantic Semiconductor

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Electronic Expediters

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Manoshevitz Elec. Sales

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ComSIT Distribution GmbH

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Prism Electronics

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J & M Industries LLC

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ABC Electronics Ltd.

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Classic Components Corporation

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Mil-Aero Solutions, Inc.

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Whistler Technology

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GES GmbH

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Nova Conductors

Japan . 10 parts In-Stock

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LIBRA Elektronik GmbH

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Electronics Depot

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Inventory MP

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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EPE Components Inc.

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 864 parts In-Stock

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$4.590

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$4.131

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Corohmni

South Africa . 696 parts In-Stock

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$4.788

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Ampacity Inc.

Singapore . 810 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 293 parts In-Stock

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$7.721

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MKK Technologies

India . 1,265 parts In-Stock

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$8.631

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$8.631

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DigiPath Technology Company

USA . 1,265 parts In-Stock

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$8.631

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Lixinc

USA . 18,716 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,248 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,832 parts In-Stock

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Corphita

USA . 3,187 parts In-Stock

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Continental Prestige Electronics

USA . 2,277 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 1,593 parts In-Stock

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$5.488

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$5.488

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Argo Parts USA

USA . 116 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Assy Fe

Spain . 1 parts In-Stock

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Overview

Unlock endless possibilities with the STMicroelectronics M2732A-2F1 EPROM. Crafted with precision using top-quality materials, this rectangular ceramic glass-sealed package offers unparalleled performance and reliability in various applications. Boasting a 4Kx8 organization and a 3-STATE output, this product guarantees seamless operation and efficient data storage. With a programming voltage of 21V and a maximum access time of 200ns, the M2732A-2F1 provides exceptional value and benefits to customers seeking high-quality memory solutions for their projects. Elevate your designs with the trusted expertise of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: CERAMIC

Provides durability and reliability, making it suitable for long-term use.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs.

Operating Mode: ASYNCHRONOUS

Allows for flexible and independent operation, enhancing overall performance.

Input/Output Type: COMMON

Simplifies connectivity and communication with other components.

Nominal Supply Voltage: 5V

Compatible with standard power supplies, ensuring ease of use.

No. of Terminals: 24

Offers sufficient connectivity options for versatile applications.

Package Style: IN-LINE

Saves space and allows for efficient PCB layout designs.

Maximum Operating Temperature: 70 °C

Suitable for a wide range of operating environments.

Organization: 4KX8

Provides a balance between storage capacity and access speed.

Output Characteristics: 3-STATE

Allows for high-speed data output with low power consumption.

Minimum Operating Temperature: 0 °C

Ensures reliability even in colder environments.

Terminal Finish: TIN LEAD

Ensures robust and reliable connections with other components.

Maximum Seated Height: 5.715 mm

Allows for compact and space-efficient device designs.

Width: 15.24 mm

Fits well within standard PCB dimensions.

Minimum Supply Voltage: 4.75V

Provides a stable operating voltage with a narrow tolerance range.

Length: 31.75 mm

Offers a balanced form factor for various applications.

Programming Voltage: 21V

Enables efficient programming and reprogramming of memory.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Technology: NMOS

Provides fast access times and low power consumption.

Parallel or Serial: PARALLEL

Enables simultaneous data transfer for enhanced performance.

Terminal Form: THROUGH-HOLE

Facilitates secure and robust mounting on PCBs.

Maximum Supply Current: 125 mA

Ensures stable and reliable operation without overloading power supplies.

No. of Words: 4096 words

Offers ample storage capacity for data and instructions.

Memory Width: 8

Supports efficient data processing and storage in byte-wide format.

Terminal Pitch: 2.54 mm

Enables easy and consistent connections on standard PCB layouts.

No. of Words Code: 4K

Provides a convenient reference for memory capacity.

Maximum Supply Voltage: 5.25V

Allows for a slight voltage margin for stable operation.

Memory Density: 32768 bit

Offers a high data storage capacity in a compact form factor.

Memory IC Type: UVPROM

Combines the benefits of EPROM with added security features.

Maximum Access Time: 200 ns

Ensures fast and responsive data retrieval for efficient operation.

Technical Specifications

EPROM M2732A-2F1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

200 ns

Additional Features:

21V PROGRAMMING VOLTAGE

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T24

JESD-609 Code:

e0

Length:

31.75 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

21

Qualification:

Not Qualified

Maximum Seated Height:

5.715 mm

Sub-Category:

EPROMs

Maximum Supply Current:

125 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

NMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M2732A-2F1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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