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M2732AF1

STMicroelectronics

M2732AF1 by STMicroelectronics

STMicroelectronics M2732AF1 is a 4KX8 EPROM with 3-STATE output, operating at 5V. It features an asynchronous mode and through-hole terminal form. Ideal for commercial applications requiring a memory density of 32768 bits and fast access time of 250 ns.

Median Price

$9.230

Lifecycle Status

Suppliers In-Stock

33

In-Stock Inventory

1k+

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Forefront Electronics and Design

USA . 82 parts In-Stock

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$8.330

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Vyrian

USA . 827 parts In-Stock

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$9.230

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Component Electronics Inc.

Canada . 6 parts In-Stock

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$9.230

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$6.920

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$6.000

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6

$9.230

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$6.000

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American Microsemiconductor Inc.

USA . 5 parts In-Stock

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$16.850

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Anansix

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Digiode

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Vectronix, Inc

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LWI Electronics Inc

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Pegasus Components GmbH

Germany . 210 parts In-Stock

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Freddi Giovanni

Italy . 177 parts In-Stock

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ICP Electronique

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LIBRA Elektronik GmbH

Germany . 85 parts In-Stock

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MRC Electronics

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Halfin

Belgium . 55 parts In-Stock

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ComSIT Distribution GmbH

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Prism Electronics

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Speed Components Ltd

Israel . 28 parts In-Stock

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Classic Components Corporation

USA . 24 parts In-Stock

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Electronics Depot

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ECAB

Sweden . 15 parts In-Stock

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Q Components

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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Electronic Expediters

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Inventory MP

USA . 8 parts In-Stock

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PC Components Company LLC

USA . 7 parts In-Stock

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Bristol Electronics

USA . 7 parts In-Stock

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LittleDiode

UK . 5 parts In-Stock

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R&J Components

USA . 5 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5 parts In-Stock

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Microfarads

USA . 4 parts In-Stock

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Resion

USA . 2 parts In-Stock

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M&R Communications

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Corel Iberica Componentes, S.L.

Spain . 1 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 478 parts In-Stock

1+ parts

$5.318

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$4.786

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478

$5.318

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$4.786

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$5.600

100+ parts

$5.544

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$5.320

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10

$5.600

$5.544

$5.320

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MKK Technologies

India . 926 parts In-Stock

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$9.999

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926

$9.999

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DigiPath Technology Company

USA . 926 parts In-Stock

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$9.999

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926

$9.999

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A-Z Elektronik GmbH

Germany . 6,215 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,143 parts In-Stock

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Corphita

USA . 3,444 parts In-Stock

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Parana Technologies

USA . 1,759 parts In-Stock

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$6.358

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Kepictronics

USA . 494 parts In-Stock

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Assy Fe

Spain . 68 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 2 parts In-Stock

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Overview

Unlock the power of innovation with the M2732AF1 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality EPROMs that are versatile and reliable. This rectangular package offers a seamless integration with its common input/output type and asynchronous operating mode. Ideal for a wide range of applications, this product provides 4Kx8 organization and 3-STATE output characteristics. With a nominal supply voltage of 5V and a maximum access time of 250ns, the M2732AF1 is designed to meet your needs efficiently and effectively. Experience the value and benefits this product brings to your projects today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the EPROM chip, making it a reliable option for long-term use.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides stability and compatibility with standard electronic systems.

Organisation: 4KX8

With a 4Kx8 organization, this EPROM chip offers a good balance of memory capacity and data width, suitable for various applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the chip to control the data bus effectively, reducing interference and improving overall system performance.

Technology: NMOS

Utilizing NMOS technology ensures efficient operation and low power consumption, making this EPROM a cost-effective and energy-efficient choice.

Memory Density: 32768 bit

With a high memory density of 32768 bits, this EPROM chip offers ample storage capacity for storing program and data information.

Technical Specifications

EPROM M2732AF1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

250 ns

Additional Features:

21V PROGRAMMING VOLTAGE

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T24

JESD-609 Code:

e0

Length:

31.75 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

21

Qualification:

Not Qualified

Maximum Seated Height:

5.715 mm

Sub-Category:

EPROMs

Maximum Supply Current:

125 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

NMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M2732AF1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

NSN

5962-01-413-5025, 5962014135025

NIIN

014135025

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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