Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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74HC7403D-Q100,518 by NXP is a CMOS FIFO memory with a 64x4 organization, operating asynchronously at up to 12 MHz. It features a wide temperature range from -40 °C to 125 °C and supports automotive applications with AEC-Q100 screening. This compact, surface-mount device ensures efficient data handling in demanding environments.
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This durable material ensures protection against environmental factors, making the product reliable for various applications.
Surface mount technology allows for a compact design and ease of integration into modern devices.
Meets automotive quality standards, enhancing reliability and performance in automotive applications.
The rectangular shape optimizes space usage on the PCB, facilitating efficient layout and design.
Asynchronous operation enables seamless data handling, improving performance in various applications.
Flexible power supply options allow for adaptability in different circuit designs.
A sufficient number of terminals supports a wide range of connections and functionalities.
The small outline package is ideal for space-constrained applications, enhancing design flexibility.
High-temperature tolerance makes this product suitable for demanding environments.
The organization structure enables efficient storage and retrieval of data, catering to various application needs.
Wide temperature range allows for reliable performance in extreme conditions.
Dual terminal positioning enhances PCB layout versatility and connection options.
Speed capabilities of 12 MHz facilitate high-speed data processing and transfer.
This specification ensures robustness during the soldering process, avoiding thermal damage.
High peak reflow temperature allows compatibility with various assembly processes, increasing production efficiency.
Designed for automotive applications, ensuring durability and reliability in challenging environments.
CMOS technology provides low power consumption and high noise immunity, making it efficient for various tasks.
Gull wing terminals facilitate easy soldering and connection, enhancing manufacturing efficiency.
Low supply current enhances energy efficiency, making it suitable for battery-powered devices.
This memory capacity strikes a balance between performance and resource management for various applications.
A memory width of 4 bits allows for efficient data handling and processing.
Standard terminal pitch enhances compatibility with a wide range of PCB designs.
This indicates a versatile configuration for effective data storage and processing needs.
Moderate moisture sensitivity ensures product integrity during storage and handling.
The FIFO architecture provides efficient data buffering, suitable for a variety of applications.
Fast access time increases system responsiveness and overall performance.
FIFO 74HC7403D-Q100,518 attributes and parameters. Explore more FIFO devices from NXP Semiconductors
Maximum Access Time:
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No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
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Peak Reflow Temperature (C):
Power Supplies (V):
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74HC7403D-Q100,518 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Obsolescence/ EOL - Multiple Devices 15/Mar/2015
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LP2950CDT-3.3G
Onsemi
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
BAV99
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Vishay Sprague
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
1N4148WS
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MMBT3904-7-F
Diodes Incorporated
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT/NOPB
Texas Instruments
LM7805CT/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a package style of flange mount, and offers low line/load regulation making it ideal for various electronic applications requiring stable power supply.
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
2N2222A
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
72V3622L10PFG8
Integrated Device Technology
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
IDT72V7280L15BB
IDT72V7280L15BB by Integrated Device Technology is a 16Kx72 FIFO with 15ns cycle time, operating at 66.7MHz clock frequency. Suitable for commercial applications, it features synchronous operation, 256 terminals in a grid array package style, and a memory density of 1179648 bits.
72V851L10PFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Cycle Time: 10 ns;
SN74ACT7206L50RJ
SN74ACT7206L50RJ by Texas Instruments is a FIFO chip with 16Kx9 organization, operating at 15 MHz with a cycle time of 65 ns. It has a memory density of 147456 bits and is suitable for applications requiring fast asynchronous data transfer in commercial temperature environments.
72V265LA10PFG8
Renesas Electronics
72V265LA10PFG8 by Renesas Electronics is a FIFO with 16Kx18 organization, operating at 100MHz clock frequency. It has a cycle time of 10ns and operates in synchronous mode. This device is suitable for applications requiring fast data processing and memory management in commercial-grade environments.
SN74ACT3638-20PQ
SN74ACT3638-20PQ by Texas Instruments is a 512x32 FIFO with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and GULL WING terminal form. Ideal for applications requiring high-speed data buffering in commercial temperature environments up to 70°C.
SN74ABT7819-20PH
SN74ABT7819-20PH by Texas Instruments is a 512x18 FIFO with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max clock frequency of 50MHz. Ideal for applications requiring high-speed data buffering in commercial temperature environments.
7200L15SOGI8
Renesas Electronics 7200L15SOGI8 FIFO operates asynchronously at 5V, with 256x9 organization and 40MHz clock frequency. Ideal for industrial applications requiring fast access times and low standby current.
72V241L15PFGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3 V;
72V2111L15PFGI8
Renesas Electronics' 72V2111L15PFGI8 FIFO operates synchronously with a cycle time of 15 ns and clock frequency up to 66.7 MHz. It features a memory density of 4718592 bit, suitable for industrial applications requiring fast data processing and parallel operation at temperatures ranging from -40 to 85°C.
7201LA15JI8
7201LA15JI8 by Integrated Device Technology is a FIFO chip with 512x9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can handle a max supply voltage of 5.5 V. Ideal for industrial applications requiring fast data processing and storage in parallel mode.
IDT72V2111L10PFG8
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN74ACT7203-50FM
SN74ACT7203-50FM by Texas Instruments is a FIFO chip with 2Kx9 organization, 18432-bit memory density, and 15 MHz clock frequency. It operates asynchronously at temperatures from 0 to 70°C and is ideal for commercial applications requiring fast data storage and retrieval.
SN74ACT72235-20PAGR
SN74ACT72235-20PAGR by Texas Instruments is a FIFO with 1KX9 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and parallel data transfer. The device features a thin profile flatpack package with gull wing terminals for surface mount assembly.
IDT72V3650L6PFG8
IDT72V3650L6PFG8 by Renesas Electronics is a FIFO with 2Kx36 organization, operating at 166 MHz clock frequency. It features synchronous operation, 3.3V nominal voltage, and 6ns cycle time. Ideal for applications requiring high-speed data buffering and retrieval in commercial temperature environments.
SN74ACT7206-50RJ
SN74ACT7206-50RJ by Texas Instruments is a 16Kx9 FIFO chip carrier with 3-state output, operating at 5V. It features asynchronous mode, CMOS technology, and parallel organization. Ideal for applications requiring high-speed data transfer and temporary storage in electronic systems.
IDT7202LA15SOGI8
IDT7202LA15SOGI8 by Renesas Electronics is a FIFO with 1KX9 organization, 25 ns cycle time, and operates at 5V. It is used in industrial applications requiring fast parallel access memory with a memory density of 9216 bits and max access time of 15 ns.
7201LA15JGI
Renesas Electronics 7201LA15JGI FIFO chip carrier operates at 40MHz with 512x9 organization. Suitable for industrial applications, it has a cycle time of 25ns and operates on a 5V supply voltage.
SN54ACT7881PN
SN54ACT7881PN by Texas Instruments is a FIFO with 1KX18 organization, operating at 5V. It features a cycle time of 20ns, output enable function, and 3-STATE output characteristics. Ideal for military applications due to its temperature grade and CMOS technology.
SN74ABT7819-30PN
SN74ABT7819-30PN by Texas Instruments is a FIFO memory with 512x18 organization, operating at 33.3 MHz clock frequency and 30.03 ns cycle time. It is suitable for applications requiring fast data storage and retrieval in synchronous mode with a supply voltage of 5V.
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74HC40105D,652
NXP Semiconductors
74HC40105D,652 by NXP Semiconductors is a FIFO memory IC with a cycle time of 71.428 ns and an operating mode of asynchronous. It is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
74HC40105D,653
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 9.9 mm;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 14 MHz;
74HC40105DB,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
74HC40105N
Philips Semiconductors
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;
74HC40105N,652
74HC40105N,652 by NXP Semiconductors is a FIFO IC with 16x4 organization, operating at 14 MHz clock frequency. It has a cycle time of 71.428 ns and supports an asynchronous mode. This CMOS technology device is ideal for automotive applications due to its wide temperature range and memory width of 4 bits.
74HC40105PW,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
74HC40105PW,118
74HC40105PW,118 by NXP Semiconductors is a FIFO device with a cycle time of 71.428 ns and an operating mode of asynchronous. It has a memory width of 4 and can be used in automotive applications due to its temperature grade.
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
74HC7403D,512
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 98 ns;
74HC40105NB
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;
74HC40105D
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
74HC40105PW
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
74HC40105PW-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
74HC40105DB,118
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
74HC40105DB-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;
74HC40105D-T
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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