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MT48LC4M32B2B5-6A:L

Micron Technology

MT48LC4M32B2B5-6A:L by Micron Technology

MT48LC4M32B2B5-6A:L by Micron Technology is a 4MX32 Synchronous DRAM with a memory density of 134217728 bit. It operates at a voltage of 3.3V and has a max access time of 5.4 ns. This memory module is commonly used in applications that require high-speed data storage and retrieval, such as computer systems and networking devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Dynamic Solutions

Germany . 4,000 parts In-Stock

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4,000

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Vyrian

USA . 3,728 parts In-Stock

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3,728

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Cyclops Electronics Ltd

UK . 2,756 parts In-Stock

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2,756

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Chip Stock

USA . 2,630 parts In-Stock

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2,630

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Digiode

USA . 2,209 parts In-Stock

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2,209

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Nova Conductors

Japan . 450 parts In-Stock

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450

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ComSIT Distribution GmbH

Germany . 180 parts In-Stock

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180

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Bristol Electronics

USA . 43 parts In-Stock

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43

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Atlantic Semiconductor

USA . 43 parts In-Stock

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43

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LWI Electronics Inc

India . 20 parts In-Stock

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20

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Flip Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,089 parts In-Stock

1+ parts

$3.000

100+ parts

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1,089

$3.000

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Andel Nordic

Denmark . 3,550 parts In-Stock

1+ parts

$6.068

100+ parts

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$5.825

10k+ parts

$5.825

3,550

$6.068

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$5.825

$5.825

AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$9.369

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384

$9.369

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Component Stockers USA

USA . 2,551 parts In-Stock

1+ parts

$16.750

100+ parts

$15.920

1k+ parts

$15.410

10k+ parts

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2,551

$16.750

$15.920

$15.410

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Perfect Parts

USA . 7,974 parts In-Stock

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7,974

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A-Z Elektronik GmbH

Germany . 6,686 parts In-Stock

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6,686

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Argo Parts USA

USA . 2,184 parts In-Stock

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Corphita

USA . 2,132 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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RC Electronics

USA . 1,841 parts In-Stock

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1,841

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Continental Prestige Electronics

USA . 1,685 parts In-Stock

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1,685

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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Benley Electronics

USA . 522 parts In-Stock

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522

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Infinite Electronics LLP (Excess)

. 520 parts In-Stock

1+ parts

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520

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Computer Components Inc. - USA

USA . 198 parts In-Stock

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198

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Overview

Experience the power of high-quality memory with the MT48LC4M32B2B5-6A:L by Micron Technology. As a leading manufacturer in the industry, Micron Technology delivers top-notch products that meet the needs of various applications. This DRAM module offers exceptional performance and reliability, making it ideal for a wide range of uses. With its synchronous operation and self-refresh capabilities, this memory module ensures smooth and efficient data processing. The compact package design and surface mount feature add convenience and versatility to your projects. Upgrade your system with Micron Technology's MT48LC4M32B2B5-6A:L and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the DRAM, making it a reliable choice for various applications.

Surface Mount: YES

With surface mount capability, this DRAM can easily be soldered onto circuit boards, allowing for efficient and space-saving integration.

No. of Functions: 1

With a single function, this DRAM simplifies the design process and reduces complexity, making it easier to implement in different systems.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard mounting techniques, enabling easy deployment and replacement of the DRAM.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures synchronized data transfers, resulting in faster and more reliable performance, which is vital for high-speed applications.

Self Refresh: YES

The self-refresh capability allows the DRAM to automatically refresh its data without external intervention, reducing the burden on the system and increasing overall efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this DRAM provides efficient power consumption while maintaining high performance.

No. of Terminals: 90

With 90 terminals, this DRAM offers a sufficient number of connections for seamless communication with the system, facilitating data transfer and integration.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style combined with a very thin profile and fine pitch ensures excellent electrical performance and space efficiency for compact designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this DRAM can withstand demanding environmental conditions, making it suitable for use in various industries.

Organization: 4MX32

With an organizational structure of 4MX32, this DRAM provides a large memory capacity of 4 megabits, enabling extensive data storage and processing capabilities.

Minimum Operating Temperature: 0 °C

The DRAM's ability to operate reliably even at low temperatures down to 0°C makes it suitable for applications in challenging environments.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish enhances the electrical conductivity and corrosion resistance of the DRAM, ensuring stable and reliable connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and allows for easy integration into systems, streamlining the assembly process.

No. of Ports: 1

With one port, this DRAM offers single-channel data access, making it suitable for applications where simultaneous memory access is not required.

Maximum Seated Height: 1 mm

The low seated height of 1mm allows for compact designs and efficient space utilization, especially in systems with height restrictions.

Width: 8 mm

With a width of 8mm, this DRAM module provides versatility in fitting into different system designs, offering flexibility in implementation.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V, this DRAM module ensures compatibility with a wide range of systems while maintaining stability and performance.

Length: 13 mm

The length of 13mm provides a compact form factor, allowing for efficient use of space in various applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures optimal performance within a standard temperature range, making this DRAM suitable for typical commercial applications.

Access Mode: FOUR BANK PAGE BURST

The four bank page burst access mode enables rapid data retrieval from different memory banks, enhancing processing speed and overall system performance.

Technology: CMOS

Built using CMOS technology, this DRAM offers low power consumption, high speed, and high integration density, making it a desirable choice for energy-efficient devices.

Terminal Form: BALL

The ball terminal form allows for reliable electrical connections, making it easier to assemble and install this DRAM in various systems.

No. of Words: 4194304 words

With a large number of words (addresses), this DRAM offers extensive memory capacity to store and process vast amounts of data, meeting the needs of memory-intensive applications.

Memory Width: 32

The 32-bit memory width provides a wide data path for efficient data transfer, enabling faster processing and enhancing system performance.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch ensures close spacing between terminals, offering high-density integration and compatibility with modern circuit board designs.

No. of Words Code: 4M

The "4M" words code indicates a memory capacity of 4 megabits, allowing for substantial data storage and retrieval capability.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this DRAM can accommodate a wide range of voltage fluctuations, ensuring stable operation in various power supply conditions.

Memory Density: 134217728 bit

This DRAM's memory density of 134,217,728 bits enables the storage of extensive data, making it highly suitable for memory-intensive applications.

Memory IC Type: SYNCHRONOUS DRAM

Being a synchronous DRAM, this memory IC offers fast and synchronized data access, excellent burst transfer rates, and efficient memory management, making it an excellent choice for high-performance systems.

Maximum Access Time: 5.4 ns

With a maximum access time of 5.4 nanoseconds, this DRAM module ensures speedy data retrieval, reducing latency and enabling responsive system performance.

Technical Specifications

DRAM MT48LC4M32B2B5-6A:L attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PBGA-B90

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

90

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4MX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

MT48LC4M32B2B5-6A:L Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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