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FZ800R12KS4B2NOSA1

Infineon Technologies

FZ800R12KS4B2NOSA1 by Infineon Technologies

FZ800R12KS4B2NOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 1200V max collector-emitter voltage and 1200A max collector current. It has a complex configuration, 660ns turn-off time, and 225ns turn-on time. Ideal for high-power applications requiring fast switching capabilities in industrial equipment and power electronics systems.

Median Price

$1,047.994

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$931.550

100+ parts

$875.660

1k+ parts

$819.760

10k+ parts

-

2

$931.550

$875.660

$819.760

-

Verical

USA . 2 parts In-Stock

1+ parts

$1,164.438

100+ parts

$1,094.575

1k+ parts

$1,024.700

10k+ parts

-

2

$1,164.438

$1,094.575

$1,024.700

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 277 parts In-Stock

1+ parts

$1,030.123

100+ parts

-

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277

$1,030.123

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Vyrian

USA . 8,477 parts In-Stock

1+ parts

-

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-

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8,477

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 134 parts In-Stock

1+ parts

$0.042

100+ parts

-

1k+ parts

-

10k+ parts

$0.041

134

$0.042

-

-

$0.041

Modulus Dynamics

Lithuania . 19,743 parts In-Stock

1+ parts

$0.534

100+ parts

$0.513

1k+ parts

$0.491

10k+ parts

-

19,743

$0.534

$0.513

$0.491

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AZTECH Wire

Italy . 36 parts In-Stock

1+ parts

$16.110

100+ parts

-

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-

10k+ parts

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36

$16.110

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Corphita

USA . 578 parts In-Stock

1+ parts

$975.906

100+ parts

-

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578

$975.906

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Microchip USA

USA . 4,642 parts In-Stock

1+ parts

-

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4,642

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Northwest PG Solutions

USA . 1,437 parts In-Stock

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1,437

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Overview

Experience the power of the FZ800R12KS4B2NOSA1 by Infineon Technologies, a top-tier manufacturer known for producing high-quality Insulated Gate Bipolar Transistors (IGBTs). With its N-CHANNEL polarity and complex configuration, this rectangular package with 7 terminals offers incredible performance and reliability. Ideal for applications requiring a maximum collector-emitter voltage of 1200V and a collector current of 1200A, this IGBT ensures efficient operation and superior functionality. Elevate your projects with the unmatched value and benefits that the FZ800R12KS4B2NOSA1 brings to the table.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and better efficiency compared to P-channel IGBTs, making them suitable for high power applications.

Configuration: COMPLEX

Complex configuration allows for better control and performance in complex circuit arrangements, making it versatile for various applications.

Package Shape: RECTANGULAR

Rectangular package shape typically provides better thermal dissipation and easier mounting options, ensuring better performance and reliability.

No. of Elements: 2

Having 2 elements allows for higher current carrying capacity and better power handling capability, ideal for high-power applications.

Nominal Turn Off Time (toff): 660 ns

Fast turn off time helps in reducing switching losses and improving efficiency in power electronic systems.

No. of Terminals: 7

With 7 terminals, this IGBT offers more control and flexibility in circuit connections, enabling better customization and performance optimization.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy and secure mounting options, ensuring stability and ease of installation in various applications.

Maximum Collector-Emitter Voltage: 1200 V

High maximum collector-emitter voltage rating makes this IGBT suitable for high voltage applications, providing robustness and reliability.

Transistor Element Material: SILICON

Silicon-based transistor element material offers better performance, lower leakage current, and higher switching speeds, making it a reliable choice for power applications.

Maximum Collector Current (IC): 1200 A

With a high maximum collector current rating, this IGBT can handle large current loads, making it suitable for high power applications.

Terminal Position: UPPER

Upper terminal position allows for easy and efficient circuit layout and connection, ensuring convenient installation and maintenance.

Case Connection: ISOLATED

Isolated case connection helps in preventing electrical short circuits and improving safety, making this IGBT suitable for critical applications.

Nominal Turn On Time (ton): 225 ns

Fast turn on time enables quick switching and efficient operation, enhancing performance and reliability in power electronic systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ800R12KS4B2NOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

660 ns

Nominal Turn On Time (ton):

225 ns

Trade Compliance

FZ800R12KS4B2NOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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