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FZ800R45KL3B5NOSA2

Infineon Technologies

FZ800R45KL3B5NOSA2 by Infineon Technologies

FZ800R45KL3B5NOSA2 by Infineon Technologies is an N-CHANNEL IGBT with 4500V VCEsat, 9000W power dissipation, and 7350ns turn-off time. Ideal for power control applications, it features a complex configuration in a rectangular package with flange mount style for high-power operations up to 125°C.

Median Price

$1,414.438

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 47 parts In-Stock

1+ parts

$1,131.550

100+ parts

$1,063.660

1k+ parts

$995.760

10k+ parts

-

47

$1,131.550

$1,063.660

$995.760

-

Verical

USA . 25 parts In-Stock

1+ parts

$1,414.438

100+ parts

$1,329.575

1k+ parts

$1,244.700

10k+ parts

-

25

$1,414.438

$1,329.575

$1,244.700

-

DigiKey

USA . 47 parts In-Stock

1+ parts

$1,414.440

100+ parts

-

1k+ parts

-

10k+ parts

-

47

$1,414.440

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 336 parts In-Stock

1+ parts

$1,589.208

100+ parts

-

1k+ parts

-

10k+ parts

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336

$1,589.208

-

-

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Vyrian

USA . 6,388 parts In-Stock

1+ parts

-

100+ parts

-

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6,388

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

-

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-

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 8,738 parts In-Stock

1+ parts

$1.267

100+ parts

$1.216

1k+ parts

$1.166

10k+ parts

-

8,738

$1.267

$1.216

$1.166

-

Corohmni

South Africa . 295 parts In-Stock

1+ parts

$1.326

100+ parts

-

1k+ parts

-

10k+ parts

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295

$1.326

-

-

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$2.152

100+ parts

$1.958

1k+ parts

$1.765

10k+ parts

-

450

$2.152

$1.958

$1.765

-

Ampacity Inc.

Singapore . 26 parts In-Stock

1+ parts

$1,421.920

100+ parts

-

1k+ parts

-

10k+ parts

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26

$1,421.920

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-

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Corphita

USA . 29 parts In-Stock

1+ parts

$1,505.565

100+ parts

-

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29

$1,505.565

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Component Stockers USA

USA . 60 parts In-Stock

1+ parts

$1,617.630

100+ parts

-

1k+ parts

-

10k+ parts

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60

$1,617.630

-

-

-

Microchip USA

USA . 2,881 parts In-Stock

1+ parts

$1,735.030

100+ parts

-

1k+ parts

-

10k+ parts

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2,881

$1,735.030

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-

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Continental Prestige Electronics

USA . 3,460 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,460

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Argo Parts USA

USA . 1,434 parts In-Stock

1+ parts

-

100+ parts

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1,434

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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Overview

Elevate your power control applications with the FZ800R45KL3B5NOSA2 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers unparalleled quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). With a maximum operating temperature of 125°C and a maximum collector-emitter voltage of 4500V, this N-CHANNEL transistor offers exceptional performance and efficiency. Whether you're looking to enhance your power control systems or optimize energy consumption, the FZ800R45KL3B5NOSA2 provides the value, benefits, and advantages that customers need for their applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and allows for easy handling and mounting of the transistor.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower on-state voltage drop and faster switching speeds compared to P-Channel, making them more efficient for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and reliability in such scenarios.

Maximum VCEsat: 2.85 V

Low VCEsat minimizes power loss during operation, improving efficiency and reducing heat generation.

Maximum Power Dissipation (Abs): 9000 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating or getting damaged.

Maximum Collector-Emitter Voltage: 4500 V

High voltage rating enables the IGBT to be used in applications where high voltage levels are present, ensuring safety and reliability.

Nominal Turn On Time (ton): 1050 ns

Fast turn-on time improves switching speed and overall performance of the IGBT, making it suitable for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ800R45KL3B5NOSA2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

4500 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.6 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-50 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

7350 ns

Nominal Turn On Time (ton):

1050 ns

Maximum VCEsat:

2.85 V

Trade Compliance

FZ800R45KL3B5NOSA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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