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FZ600R12KE3

Infineon Technologies

FZ600R12KE3 by Infineon Technologies

FZ600R12KE3 by Infineon Technologies is an N-CHANNEL IGBT with a max VCEsat of 2.15V and a max IC of 900A, ideal for POWER CONTROL applications. It features a nominal toff of 830ns, ton of 400ns, and can operate at temperatures up to 175°C. The device comes in a RECTANGULAR package style with FLANGE MOUNT for easy installation.

Median Price

$172.600

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Mouser Electronics

USA . 1 parts In-Stock

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Digiode

USA . 916 parts In-Stock

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$143.146

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Vyrian

USA . 8,847 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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Connector Distribution Corp

USA . 6 parts In-Stock

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Right Parts Inc.

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Semi Source

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Tech-Mark Corp

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Native Components

USA . 773 parts In-Stock

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$0.173

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$0.166

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Northwest PG Solutions

USA . 2,135 parts In-Stock

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$0.190

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$0.168

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Modulus Dynamics

Lithuania . 10,016 parts In-Stock

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$1.983

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$1.904

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$1.824

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Corphita

USA . 928 parts In-Stock

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Microchip USA

USA . 8,119 parts In-Stock

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$180.530

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A-Z Elektronik GmbH

Germany . 6,518 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

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Perfect Parts

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S.R.D Solutions

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Overview

Enhance your power control systems with the FZ600R12KE3 by Infineon Technologies, a top-tier manufacturer known for delivering high-quality Insulated Gate Bipolar Transistors. With its N-CHANNEL configuration and built-in diode, this transistor provides exceptional performance in a wide range of applications. From industrial machinery to renewable energy systems, the FZ600R12KE3 offers unparalleled reliability and efficiency, making it a valuable asset for customers seeking superior power control solutions. Experience the benefits of Infineon's cutting-edge technology and elevate your projects to new heights with the FZ600R12KE3.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have higher electron mobility and conduction capabilities, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient commutation, reducing switching losses and improving overall device performance.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and efficient operation in high-power systems.

Maximum VCEsat: 2.15 V

Low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to higher efficiency and lower power dissipation.

Package Shape: RECTANGULAR

Rectangular packages are commonly used for high-power devices due to their efficient heat dissipation and ease of mounting.

Nominal Turn Off Time (toff): 830 ns

Fast turn-off time results in reduced switching losses and improved efficiency in power control applications.

Maximum Power Dissipation (Abs): 2750 W

High power dissipation capability allows the device to handle large power loads without overheating or damage.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide secure mounting and efficient thermal conduction, ideal for high-power applications.

Maximum Operating Temperature: 175 °C

High operating temperature rating ensures reliable performance in demanding environments without risk of overheating.

Maximum Collector-Emitter Voltage: 1200 V

High maximum voltage rating allows the device to handle high voltage levels, making it suitable for various power control applications.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high switching speeds, low conduction losses, and high breakdown voltage, making them ideal for power control applications.

Maximum Gate-Emitter Voltage: 20 V

Low gate-emitter voltage ensures safe operation and reliable switching performance in high-power applications.

Maximum Collector Current (IC): 900 A

High collector current rating allows the device to handle large current loads, making it suitable for high-power applications.

Terminal Position: UPPER

Upper terminal position provides convenient connectivity and easy integration into power control circuits.

Case Connection: ISOLATED

Isolated case connection ensures safety and protection against electrical shocks, making the device suitable for high-voltage applications.

Nominal Turn On Time (ton): 400 ns

Fast turn-on time results in quick response and efficient switching operation in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ600R12KE3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

830 ns

Nominal Turn On Time (ton):

400 ns

Maximum VCEsat:

2.15 V

Trade Compliance

FZ600R12KE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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