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FZ600R12KE3HOSA1

Infineon Technologies

FZ600R12KE3HOSA1 by Infineon Technologies

FZ600R12KE3HOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 900A max collector current, and 830ns turn off time. It is used for power control applications due to its single configuration with built-in diode and silicon transistor element material.

Median Price

$134.390

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$102.770

100+ parts

$100.720

1k+ parts

$98.670

10k+ parts

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1

$102.770

$100.720

$98.670

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Farnell

UK . 452 parts In-Stock

1+ parts

$110.140

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-

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452

$110.140

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DigiKey

USA . 49 parts In-Stock

1+ parts

$134.390

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49

$134.390

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Newark

USA . 191 parts In-Stock

1+ parts

$154.100

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191

$154.100

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Element14

Singapore . 452 parts In-Stock

1+ parts

$197.350

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452

$197.350

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Verical

USA . 10 parts In-Stock

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10

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Digiode

USA . 281 parts In-Stock

1+ parts

$135.299

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-

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281

$135.299

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Galco

USA . 60 parts In-Stock

1+ parts

$205.800

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60

$205.800

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Vyrian

USA . 5,049 parts In-Stock

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5,049

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 14,752 parts In-Stock

1+ parts

$0.993

100+ parts

$0.953

1k+ parts

$0.914

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14,752

$0.993

$0.953

$0.914

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Corohmni

South Africa . 225 parts In-Stock

1+ parts

$1.355

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225

$1.355

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Ampacity Inc.

Singapore . 97 parts In-Stock

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$121.060

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97

$121.060

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Corphita

USA . 742 parts In-Stock

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$128.178

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742

$128.178

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Continental Prestige Electronics

USA . 448 parts In-Stock

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$149.000

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448

$149.000

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Microchip USA

USA . 7,310 parts In-Stock

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$268.650

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7,310

$268.650

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Robosynatics

Brazil . 24,544 parts In-Stock

1+ parts

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100+ parts

$1.807

1k+ parts

$1.770

10k+ parts

$1.770

24,544

-

$1.807

$1.770

$1.770

Lucentia Tech

USA . 24,544 parts In-Stock

1+ parts

-

100+ parts

$1.807

1k+ parts

$1.770

10k+ parts

$1.770

24,544

-

$1.807

$1.770

$1.770

Argo Parts USA

USA . 2,392 parts In-Stock

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2,392

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Unleash the power of innovation with the FZ600R12KE3HOSA1 by Infineon Technologies. This insulated gate bipolar transistor (IGBT) offers unmatched quality and reliability, making it the ideal choice for power control applications. With a maximum collector-emitter voltage of 1200V and a nominal turn-off time of 830ns, this N-channel transistor provides exceptional performance in a compact package. Experience the benefits of superior technology and efficiency with the FZ600R12KE3HOSA1 - revolutionize your power control solutions today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drop and faster switching speeds compared to P-CHANNEL IGBTs, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in providing a more compact and integrated solution for power control applications, reducing the overall system complexity.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable and efficient performance in controlling high power levels.

Package Shape: RECTANGULAR

Rectangular package shape allows for easier mounting and integration into electronic systems, saving space and simplifying installation.

Nominal Turn Off Time (toff): 830 ns

Fast turn-off time of 830 ns allows for quick switching and efficient power control, reducing power dissipation and improving overall system performance.

No. of Terminals: 3

Three terminals provide necessary connections for control and power inputs, enabling easy interfacing with external circuits for power control applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure and stable mounting options, ensuring reliable operation in high vibration environments.

Maximum Operating Temperature: 175 °C

High maximum operating temperature of 175°C allows for operation in demanding environments without risking damage or reduced performance.

Maximum Collector-Emitter Voltage: 1200 V

High maximum collector-emitter voltage of 1200 V enables handling of high voltage levels, making it suitable for power control applications requiring high voltage operation.

Transistor Element Material: SILICON

Silicon material provides good thermal and electrical properties, ensuring reliable and efficient operation of the IGBT in power control applications.

Maximum Collector Current (IC): 900 A

High maximum collector current of 900 A allows for handling large power levels, making it suitable for high-power applications such as motor control and power inverters.

Terminal Position: UPPER

Upper terminal position simplifies connections and provides easy access for interfacing with external circuits, facilitating installation and maintenance of the IGBT.

Case Connection: ISOLATED

Isolated case connection helps in preventing short circuits and improves reliability by providing electrical insulation between the case and other components in the system.

Nominal Turn On Time (ton): 400 ns

Fast turn-on time of 400 ns ensures quick response and efficient power switching, enhancing the dynamic performance of the IGBT in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ600R12KE3HOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

830 ns

Nominal Turn On Time (ton):

400 ns

Trade Compliance

FZ600R12KE3HOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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