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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC3S200-4FT256I by Xilinx

XC3S200-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Width: 17 mm;

FPGA

4320

173

173

480

200000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400-4FT256C by Xilinx

XC3S400-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

173

173

896

400000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400-4FT256I by Xilinx

XC3S400-4FT256I

Xilinx

Xilinx XC3S400-4FT256I FPGA features 8064 logic cells, 896 CLBs, and 400000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for industrial applications requiring high-speed processing in a compact package. Operating temperature ranges from -40 to 100°C with low profile grid array packaging.

FPGA

8064

173

173

896

400000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400-5FT256C by Xilinx

XC3S400-5FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

173

173

896

400000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1400A-4FT256I by Xilinx

XC3S1400A-4FT256I

Xilinx

Xilinx XC3S1400A-4FT256I FPGA offers 25344 logic cells, 2816 CLBs, and 1400000 gates. With a max clock frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. Operating b/w -40 to 100°C, this FPGA is suitable for various electronic systems.

FPGA

25344

161

148

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1400A-4FTG256I by Xilinx

XC3S1400A-4FTG256I

Xilinx

Xilinx XC3S1400A-4FTG256I is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 gates. Operating at max frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range of -40 to 100°C. Package style: Grid Array, Low Profile.

FPGA

25344

161

148

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S1400A-5FTG256C by Xilinx

XC3S1400A-5FTG256C

Xilinx

The Xilinx XC3S1400A-5FTG256C is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 gates. It operates at max frequency of 770 MHz, ideal for high-speed applications like signal processing and telecommunications due to its low profile grid array package style. With a combinatorial delay of 0.62 ns per CLB, it offers efficient performance in various electronic systems.

FPGA

25344

161

148

2816

1400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S700A-4FT256I by Xilinx

XC3S700A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

13248

161

148

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S700A-5FTG256C by Xilinx

XC3S700A-5FTG256C

Xilinx

Xilinx XC3S700A-5FTG256C FPGA offers 13248 logic cells, 1472 CLBs, and 700000 gates. Ideal for applications requiring high clock frequency up to 770 MHz, with a max operating temperature of 85°C. Package style: Grid Array, low profile; technology: CMOS; suitable for various electronic designs.

FPGA

13248

161

148

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S1000-4FTG256I by Xilinx

XC3S1000-4FTG256I

Xilinx

XC3S1000-4FTG256I by Xilinx is a CMOS FPGA with 17280 logic cells and 1920 CLBs. It operates at a max clock frequency of 630 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.

FPGA

17280

173

173

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S1000-5FTG256C by Xilinx

XC3S1000-5FTG256C

Xilinx

The Xilinx XC3S1000-5FTG256C is a FPGA with 17280 logic cells, 1920 CLBs, and 1M equivalent gates. It operates at max frequency of 725MHz, suitable for high-speed applications like telecommunications and signal processing. With a low profile grid array package style, it's ideal for compact designs requiring high performance.

FPGA

17280

173

173

1920

1000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S200-4FTG256I by Xilinx

XC3S200-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

4320

173

173

480

200000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S200-5FTG256C by Xilinx

XC3S200-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4320

173

173

480

200000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S400-5FTG256C by Xilinx

XC3S400-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

173

173

896

400000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XA3S400-4FTG256Q by Xilinx

XA3S400-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

264

264

896

400000

125 MHz

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XC4028XLA-09BGG352C by Xilinx

XC4028XLA-09BGG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1024

18000

227 MHz

1.1 ns

CMOS

1024 CLBS, 18000 Gates

Can also use 50000 gates

3.3

3 V

3.6 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

1.27 mm

352

S-PBGA-B352

e1

No

XC4085XLA-09BGG352C by Xilinx

XC4085XLA-09BGG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

3136

55000

227 MHz

1.1 ns

CMOS

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1.27 mm

352

S-PBGA-B352

e1

No

XC3S1200E-4FT256C by Xilinx

XC3S1200E-4FT256C

Xilinx

Xilinx XC3S1200E-4FT256C FPGA features 19512 logic cells, 2168 CLBs, and 1200000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

19512

190

150

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1200E-4FT256I by Xilinx

XC3S1200E-4FT256I

Xilinx

XC3S1200E-4FT256I by Xilinx is a FPGA with 19512 logic cells, 2168 CLBs, and 1200000 gates. Operating at max frequency of 572 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range (-40 to 100°C) and low profile grid array package style, it offers versatility in various environments.

FPGA

19512

190

150

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1200E-4FTG256I by Xilinx

XC3S1200E-4FTG256I

Xilinx

Xilinx XC3S1200E-4FTG256I FPGA features 19512 logic cells, 2168 CLBs, and 1200000 gates. With a max clock frequency of 572 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC flexibility in a compact grid array package.

FPGA

19512

190

150

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S1200E-5FT256C by Xilinx

XC3S1200E-5FT256C

Xilinx

Xilinx XC3S1200E-5FT256C FPGA offers 19512 logic cells, 2168 CLBs, and 1200000 gates. It operates at a max frequency of 657 MHz with a supply voltage of 1.2V. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

19512

190

150

2168

1200000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1200E-5FTG256C by Xilinx

XC3S1200E-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

19512

190

150

2168

1200000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S250E-4FT256C by Xilinx

XC3S250E-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5508

172

132

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S250E-4FT256I by Xilinx

XC3S250E-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5508

172

132

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S250E-4FTG256C by Xilinx

XC3S250E-4FTG256C

Xilinx

Xilinx XC3S250E-4FTG256C FPGA features 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

5508

172

132

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S250E-4FTG256I by Xilinx

XC3S250E-4FTG256I

Xilinx

Xilinx XC3S250E-4FTG256I FPGA features 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package. Operating temperature ranges from -40 to 100°C with low combinatorial delay of 0.76 ns.

FPGA

5508

172

132

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S250E-5FTG256C by Xilinx

XC3S250E-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5508

172

132

612

250000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S500E-4FT256C by Xilinx

XC3S500E-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10476

190

149

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S500E-4FT256I by Xilinx

XC3S500E-4FT256I

Xilinx

Xilinx XC3S500E-4FT256I FPGA offers 10476 logic cells, 1164 CLBs, and 500000 equivalent gates. Ideal for industrial applications with a max clock frequency of 572 MHz and operating temperature range from -40 to 100 °C.

FPGA

10476

190

149

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S500E-4FTG256I by Xilinx

XC3S500E-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10476

190

149

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S500E-5FTG256C by Xilinx

XC3S500E-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10476

190

149

1164

500000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S1000L-4FTG256C by Xilinx

XC3S1000L-4FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

17280

173

173

1920

1000000

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LAXP2-17E-5FTN256E by Lattice Semiconductor

LAXP2-17E-5FTN256E

Lattice Semiconductor

Lattice Semiconductor's LAXP2-17E-5FTN256E FPGA offers 17000 logic cells, 201 inputs/outputs, and a max clock frequency of 435MHz. Ideal for applications requiring high-speed processing in automotive electronics, with AEC-Q100 screening level for reliability in harsh environments.

FPGA

17000

201

201

17000

435 MHz

Field Programmable Gate Arrays

17000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

LFE3-17EA-6FTN256C by Lattice Semiconductor

LFE3-17EA-6FTN256C

Lattice Semiconductor

Lattice Semiconductor's LFE3-17EA-6FTN256C FPGA features 17000 logic cells, 133 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact square package with low profile grid array style.

FPGA

17000

133

133

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE3-17EA-6FTN256I by Lattice Semiconductor

LFE3-17EA-6FTN256I

Lattice Semiconductor

LFE3-17EA-6FTN256I by Lattice Semiconductor is a 17000 logic cell FPGA with 133 inputs/outputs, operating at max frequency of 375 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.

FPGA

17000

133

133

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE3-17EA-7FTN256C by Lattice Semiconductor

LFE3-17EA-7FTN256C

Lattice Semiconductor

Lattice Semiconductor's LFE3-17EA-7FTN256C FPGA features 17000 logic cells, 133 inputs/outputs, and a max clock frequency of 420 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

17000

133

133

420 MHz

0.335 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE3-17EA-8FTN256C by Lattice Semiconductor

LFE3-17EA-8FTN256C

Lattice Semiconductor

LFE3-17EA-8FTN256C by Lattice Semiconductor is a 17000 logic cell FPGA with 133 inputs/outputs, operating at up to 500 MHz. It features a max supply voltage of 1.26V and is suitable for applications requiring high-speed processing in compact electronic systems.

FPGA

17000

133

133

500 MHz

0.281 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE3-17EA-8FTN256I by Lattice Semiconductor

LFE3-17EA-8FTN256I

Lattice Semiconductor

LFE3-17EA-8FTN256I by Lattice Semiconductor is a 17000 logic cell FPGA with 133 inputs/outputs, operating at max 500 MHz. It features a low profile grid array package suitable for industrial applications requiring high-speed processing and programmable IC flexibility.

FPGA

17000

133

133

500 MHz

0.281 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE3-35EA-6FTN256C by Lattice Semiconductor

LFE3-35EA-6FTN256C

Lattice Semiconductor

Lattice Semiconductor's LFE3-35EA-6FTN256C FPGA offers 33,000 logic cells, 133 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

33000

133

133

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE3-35EA-6FTN256I by Lattice Semiconductor

LFE3-35EA-6FTN256I

Lattice Semiconductor

LFE3-35EA-6FTN256I by Lattice Semiconductor is a 33000 logic cell FPGA with 133 inputs/outputs, operating at max frequency of 375 MHz. Ideal for industrial applications due to its low profile grid array package and wide temperature range (-40 to 100°C).

FPGA

33000

133

133

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE3-35EA-8FTN256C by Lattice Semiconductor

LFE3-35EA-8FTN256C

Lattice Semiconductor

Lattice Semiconductor's LFE3-35EA-8FTN256C FPGA offers 33,000 logic cells, operates at a max frequency of 500 MHz, and has 133 inputs/outputs. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

33000

133

133

500 MHz

0.281 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO1200C-5FTN256C by Lattice Semiconductor

LCMXO1200C-5FTN256C

Lattice Semiconductor

LCMXO1200C-5FTN256C by Lattice Semiconductor is a 1200 Logic Cells FPGA with 150 CLBs and 211 Inputs/Outputs. Operating at 1.8V, it's ideal for applications requiring high-speed processing in compact designs like IoT devices and consumer electronics.

FPGA

1200

211

211

150

Field Programmable Gate Arrays

150 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.7 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

LCMXO1200E-3FTN256C by Lattice Semiconductor

LCMXO1200E-3FTN256C

Lattice Semiconductor

LCMXO1200E-3FTN256C by Lattice Semiconductor is a 1200 Logic Cells FPGA with 150 CLBs and 211 Inputs/Outputs. Operating at 1.2V, it has a package style of Grid Array for applications requiring low profile, such as industrial automation and telecommunications.

FPGA

1200

211

211

150

Field Programmable Gate Arrays

150 CLBS

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.7 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

LCMXO2280C-3FTN256I by Lattice Semiconductor

LCMXO2280C-3FTN256I

Lattice Semiconductor

LCMXO2280C-3FTN256I by Lattice Semiconductor is a 2280 Logic Cell FPGA with 285 CLBs and 211 Inputs/Outputs. Operating at 1.8V, it's ideal for industrial applications requiring high-performance programmable ICs in a compact square package.

FPGA

2280

211

211

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.7 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

LCMXO2280E-4FTN256C by Lattice Semiconductor

LCMXO2280E-4FTN256C

Lattice Semiconductor

LCMXO2280E-4FTN256C by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 211 inputs/outputs. It operates at 1.2V, has a package style of grid array, low profile, and is suitable for applications requiring programmable gate arrays in various industries.

FPGA

2280

211

211

285

Field Programmable Gate Arrays

285 CLBS

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.7 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

LCMXO640C-3FT256I by Lattice Semiconductor

LCMXO640C-3FT256I

Lattice Semiconductor

LCMXO640C-3FT256I by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 159 Inputs/Outputs. Operating at 1.71V to 3.465V, it's ideal for industrial applications requiring high-performance and low-profile grid array packages.

FPGA

640

159

159

80

Field Programmable Gate Arrays

80 CLBS

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.7 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

LCMXO640C-3FTN256C by Lattice Semiconductor

LCMXO640C-3FTN256C

Lattice Semiconductor

LCMXO640C-3FTN256C by Lattice Semiconductor is a FPGA with 640 logic cells, 80 CLBs, and 159 inputs/outputs. It operates at supply voltages of 1.71V to 3.465V and temperatures from 0°C to 85°C. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

640

159

159

80

Field Programmable Gate Arrays

80 CLBS

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.7 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

LCMXO640C-3FTN256I by Lattice Semiconductor

LCMXO640C-3FTN256I

Lattice Semiconductor

LCMXO640C-3FTN256I by Lattice Semiconductor is a FPGA with 640 logic cells, 80 CLBs, and 159 inputs/outputs. It operates at a max voltage of 3.465V and supports supply voltages of 1.8/2.5/3.3V. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package with low profile design.

FPGA

640

159

159

80

Field Programmable Gate Arrays

80 CLBS

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.7 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No