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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCV400E-6BG432C by Xilinx

XCV400E-6BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

316

316

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV400E-7BG432C by Xilinx

XCV400E-7BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

316

316

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV400E-7BG432I by Xilinx

XCV400E-7BG432I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

10800

316

316

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV600E-6BG432C by Xilinx

XCV600E-6BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

316

316

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV600E-6BG432I by Xilinx

XCV600E-6BG432I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

15552

316

316

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV600E-7BG432C by Xilinx

XCV600E-7BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

316

316

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV600E-7BG432I by Xilinx

XCV600E-7BG432I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .42 ns;

FPGA

15552

316

316

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV1600E-8BG560C by Xilinx

XCV1600E-8BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

34992

404

404

7776

419904

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV2000E-8BG560C by Xilinx

XCV2000E-8BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

43200

404

404

9600

518400

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV300E-8BG432C by Xilinx

XCV300E-8BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

316

316

1536

82944

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV400E-8BG432C by Xilinx

XCV400E-8BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

316

316

2400

129600

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV600E-8BG432C by Xilinx

XCV600E-8BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

316

316

3456

186624

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV405E-6BG560C by Xilinx

XCV405E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV405E-6BG560I by Xilinx

XCV405E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV405E-7BG560C by Xilinx

XCV405E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV405E-7BG560I by Xilinx

XCV405E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV812E-6BG560C by Xilinx

XCV812E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

404

404

4704

254016

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 254016 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV812E-7BG560C by Xilinx

XCV812E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

404

404

4704

254016

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 254016 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV812E-8BG560C by Xilinx

XCV812E-8BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

404

404

4704

254016

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 254016 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV100E-6BG352C by Xilinx

XCV100E-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

2700

196

196

600

32400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV100E-6BG352I by Xilinx

XCV100E-6BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.89 V;

FPGA

2700

196

196

600

32400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV100E-7BG352C by Xilinx

XCV100E-7BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

2700

196

196

600

32400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-6BG352C by Xilinx

XCV200E-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

63504

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-7BG352C by Xilinx

XCV200E-7BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

63504

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-7BG352I by Xilinx

XCV200E-7BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37);

FPGA

5292

260

260

1176

63504

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-8BG352C by Xilinx

XCV200E-8BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

63504

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300E-6BG352C by Xilinx

XCV300E-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

260

260

1536

82944

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300E-6BG352I by Xilinx

XCV300E-6BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Organization: 1536 CLBS, 82944 GATES;

FPGA

6912

260

260

1536

82944

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300E-7BG352I by Xilinx

XCV300E-7BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; No. of Equivalent Gates: 82944;

FPGA

6912

260

260

1536

82944

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV400E-6BG560C by Xilinx

XCV400E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-6BG560I by Xilinx

XCV400E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; No. of Logic Cells: 10800;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-7BG560C by Xilinx

XCV400E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-7BG560I by Xilinx

XCV400E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.89 V;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-6BG560C by Xilinx

XCV600E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

404

404

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-6BG560I by Xilinx

XCV600E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.89 V;

FPGA

15552

404

404

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-7BG560C by Xilinx

XCV600E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

404

404

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-7BG560I by Xilinx

XCV600E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;

FPGA

15552

404

404

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

LCMXO2280C-3FTN324C by Lattice Semiconductor

LCMXO2280C-3FTN324C

Lattice Semiconductor

LCMXO2280C-3FTN324C by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 271 inputs/outputs. It operates at 1.8V nominal voltage and supports a max of 3.465V. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

2280

271

271

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

19 mm

19 mm

1.7 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

LCMXO2280C-5FTN324C by Lattice Semiconductor

LCMXO2280C-5FTN324C

Lattice Semiconductor

LCMXO2280C-5FTN324C by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 271 inputs/outputs. It operates at a max voltage of 3.465V and nominal voltage of 1.8V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

2280

271

271

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

19 mm

19 mm

1.7 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

LAMXO640C-3FTN256E by Lattice Semiconductor

LAMXO640C-3FTN256E

Lattice Semiconductor

Lattice Semiconductor's LAMXO640C-3FTN256E is a 640 Logic Cells FPGA with 80 CLBs, 159 Inputs/Outputs. Operating at -40 to 125 °C, it has a supply voltage range of 1.71-3.465 V and is AEC-Q100 graded for automotive applications.

FPGA

640

159

159

80

Field Programmable Gate Arrays

80 CLBS

Also Operates at 2.5 V and 3.3 V nominal supply

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XC3S200A-4FT256C by Xilinx

XC3S200A-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S200A-4FT256I by Xilinx

XC3S200A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S200A-4FTG256I by Xilinx

XC3S200A-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S200A-5FTG256C by Xilinx

XC3S200A-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S400A-4FT256C by Xilinx

XC3S400A-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400A-4FT256I by Xilinx

XC3S400A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400A-5FTG256C by Xilinx

XC3S400A-5FTG256C

Xilinx

Xilinx XC3S400A-5FTG256C FPGA features 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 770 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

8064

195

160

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S50A-4FT256C by Xilinx

XC3S50A-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1584

144

112

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No