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XCV600E-6BG560C

Xilinx

XCV600E-6BG560C by Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

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Technical Specifications

Field Programmable Gate Arrays (FPGA) XCV600E-6BG560C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

15552

No. of Inputs:

404

No. of Outputs:

404

No. of CLBs:

3456

No. of Equivalent Gates:

186624

Maximum Clock Frequency:

357 MHz

CLB Maximum Delay:

0.47 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3456 CLBS, 186624 Gates

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

1.89 V

Power Supplies:

1.2/3.6,1.8 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

42.5 mm

Width:

42.5 mm

Maximum Seated Height:

1.7 mm

Package Equivalence Code:

BGA560,33X33,50

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Pitch:

1.27 mm

No. of Terminals:

560

Standards

JESD-30 Code:

S-PBGA-B560

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XCV600E-6BG560C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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