Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XC3S400A-5FTG256C FPGA features 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 770 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
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Plastic/Epoxy package body material provides good protection for the FPGA, making it durable and reliable.
Large number of logic cells allows for complex designs and high level of functionality in the FPGA.
Surface mount capability makes it easy to integrate the FPGA onto PCBs, saving space and improving manufacturing efficiency.
Low maximum supply voltage helps in reducing power consumption and improving energy efficiency.
CMOS technology offers low power consumption, high noise immunity, and faster speed performance, making the FPGA efficient and reliable.
Ample number of inputs allow for greater flexibility and customization in the FPGA design.
Square package shape ensures easy handling and placement of the FPGA on the PCB.
High number of equivalent gates allows for implementation of complex algorithms and functions in the FPGA.
Stable nominal supply voltage ensures consistent performance of the FPGA.
Multiple power supply options provide compatibility with different systems and requirements.
Sufficient number of terminals for easy connectivity and integration into the PCB.
Being a field programmable gate array, this product offers flexibility and versatility in design and implementation.
Grid array, low profile package style provides compact design and efficient PCB layout.
Low minimum supply voltage allows for operation in low power applications.
High maximum operating temperature range ensures reliable performance in varied environmental conditions.
Optimal terminal pitch facilitates easy soldering and mounting onto the PCB.
Low combinatorial delay ensures fast and efficient processing within the FPGA.
Organized structure of 896 CLBs and 400000 gates enables efficient design and implementation of complex systems.
Low minimum operating temperature ensures reliable performance even in cold environments.
Tin silver copper terminal finishing provides good conductivity and reliability for the FPGA connections.
Bottom terminal position facilitates easier PCB layout and integration.
Moisture sensitivity level of 3 indicates good resistance to moisture-related issues during manufacturing and operation.
Low seated height ensures space-efficient PCB design and assembly.
Compact width allows for easy placement and integration of the FPGA into the PCB design.
High maximum clock frequency enables fast processing and execution of operations within the FPGA.
Adequate number of outputs for versatile connectivity and communication within the FPGA system.
Maximum time at peak reflow temperature ensures reliable soldering and assembly of the FPGA onto the PCB.
High peak reflow temperature tolerance ensures robust assembly and soldering processes for the FPGA.
Optimal length for compact and efficient integration of the FPGA onto the PCB.
Field Programmable Gate Arrays (FPGA) XC3S400A-5FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC3S400A-5FTG256C Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult DEV EOL 01/Jan/2024
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
2N2222A
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
MBRS1100T3G
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
Taitron Components
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
M2GL010-TQG144
Microchip Technology
M2GL010-TQG144 by Microchip Technology is a Field Programmable Gate Array (FPGA) with 144 terminals. It operates b/w 0-85°C, with supply voltage ranging from 1.14V to 1.26V. Ideal for applications requiring low profile, fine pitch package style in plastic/epoxy material.
XC6SLX150-3FGG484I
Xilinx
Xilinx XC6SLX150-3FGG484I is a FPGA with 147443 logic cells, 11519 CLBs, and 338 inputs/outputs. It operates at max frequency of 862 MHz, suitable for industrial applications requiring high-speed processing in a compact form factor. With CMOS technology and low power consumption at nominal voltage of 1.2V, it offers efficient performance for various electronic designs.
EP3C120F780I7N
Intel
EP3C120F780I7N by Intel is a CMOS FPGA with 119088 logic cells, 531 inputs/outputs, and max clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package style.
LCMXO2-256HC-4SG32I
Lattice Semiconductor
LCMXO2-256HC-4SG32I by Lattice Semiconductor is a 256 Logic Cell FPGA with 32 CLBs, operating at 2.5V nominal voltage. Suitable for applications requiring high-density programmable ICs in compact form factors, such as IoT devices and industrial automation systems.
10M50SAE144I7G
The Intel 10M50SAE144I7G is a FPGA with 50000 logic cells, 3125 CLBs, and 500 inputs/outputs. Ideal for industrial applications requiring high performance in a compact package with a max supply voltage of 3.15 V and operating temperature range from -40 to 100 °C.
XC7A75T-2CSG324I
The Xilinx XC7A75T-2CSG324I is a FPGA with 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex designs. With a package style of grid array and low profile, it offers versatile solutions for various electronic systems.
EP3C25F324I7N
The Intel EP3C25F324I7N is a CMOS FPGA with 24624 logic cells and CLBs. It operates at max 472.5 MHz clock frequency, suitable for industrial applications requiring high-speed processing. With 215 inputs/outputs, it offers flexibility in designing complex digital circuits efficiently.
XC7A50T-2CSG325I
XC7A50T-2CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 52160 logic cells and 4075 configurable logic blocks (CLBs). It operates at a max clock frequency of 1286 MHz and is commonly used in industrial applications requiring high-speed processing.
10M04SAU169C8G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
LCMXO2-1200HC-4TG100I
LCMXO2-1200HC-4TG100I by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. Operating temp range -40 to 100°C, suitable for applications requiring high-speed processing in compact designs. Features 79 inputs/outputs and operates at nominal voltage of 2.5V.
LCMXO3LF-4300E-5UWG81CTR1K
LCMXO3LF-4300E-5UWG81CTR1K by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs, 0.4mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact designs.
EP2C20Q240C8N
The Intel EP2C20Q240C8N FPGA features 18752 logic cells, 1172 CLBs, and a max clock frequency of 402.5 MHz. Ideal for applications requiring high-speed processing and programmable ICs in fields like telecommunications, aerospace, and industrial automation.
EP4CE15E22C8N
The EP4CE15E22C8N by Altera is a field programmable gate array (FPGA) with 15408 logic cells and 963 configurable logic blocks (CLBs). It operates at a maximum supply voltage of 1.25V and has 81 inputs and outputs. This FPGA is surface mountable and has a package shape of square, with a gull wing form of terminal. It is suitable for applications that require high-speed processing and programmability.
LFXP2-8E-5QN208C
LFXP2-8E-5QN208C by Lattice Semiconductor is a 1.2V FPGA with 8000 logic cells, 1000 CLBs, and 146 inputs/outputs. It operates at up to 435MHz clock frequency and has a max operating temperature of 85°C. Ideal for applications requiring high-speed processing in compact designs.
M7A3P1000-FGG256I
M7A3P1000-FGG256I by Microchip Technology is a FPGA with 24576 logic cells, 1.5V nominal voltage, and 350MHz max clock frequency. Ideal for industrial applications requiring high-speed processing, it features 177 inputs/outputs and 1000000 equivalent gates in a compact grid array package.
XC7S25-1CSGA225I
XC7S25-1CSGA225I by Xilinx is a Field Programmable Gate Array (FPGA) with 23360 logic cells and 1825 configurable logic blocks (CLBs). It operates at a max clock frequency of 1098 MHz and is commonly used in industrial applications.
XCAU10P-2SBVB484E
FIELD PROGRAMMABLE GATE ARRAY;
XC7A15T-2CPG236C
Xilinx XC7A15T-2CPG236C FPGA features 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data center infrastructure.
EP1C3T100I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC7A15T-1FTG256I
Xilinx XC7A15T-1FTG256I is a FPGA with 16640 logic cells, 1300 CLBs, and 250 inputs/outputs. Operating at up to 1098 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a low profile grid array package and wide temperature range (-40 to 100°C), it offers versatility in various environments.
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XC3S50AN-4TQG144C
XC3S50AN-4TQG144C by Xilinx is a CMOS-based FPGA with 1584 logic cells and 176 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
XC3S200AN-4FTG256C
Xilinx XC3S200AN-4FTG256C is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. It operates at max frequency of 667 MHz and has 160 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
XC3S50AN-4TQG144CES
XC3S50AN-4TQG144CES by Xilinx is a 176 CLB, 50000 gates FPGA with max clock freq of 280 MHz. Operating at 3.3V nominal voltage, it's ideal for applications requiring high-speed processing and programmable logic in compact form factors. Package style: Flatpack, low profile, fine pitch.
XC3S50A-4VQG100C
The Xilinx XC3S50A-4VQG100C is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs.
XC3S50AN-4TQG144I
The Xilinx XC3S50AN-4TQG144I is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at max frequency of 667 MHz, suitable for industrial applications requiring high-speed processing in compact designs. With a wide temperature range (-40 to 100°C) and low profile package style, it's ideal for diverse electronic systems.
XC3SD1800A-4FGG676I
Xilinx XC3SD1800A-4FGG676I FPGA offers 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. Ideal for applications requiring high-speed processing with a max clock frequency of 250 MHz. Package style: Grid Array, technology: CMOS, suitable for various electronic designs.
XC3S50A-4TQG144C
Xilinx XC3S50A-4TQG144C FPGA features 1584 logic cells, 176 CLBs, and 50000 equivalent gates. Operating at a max frequency of 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a compact square package and low profile design, it offers versatile integration options in various electronic systems.
XC3S200AN-4FTG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
XC3S400-4TQG144I
The Xilinx XC3S400-4TQG144I is a FPGA with 8064 logic cells, 896 CLBs, and 400000 equivalent gates. It operates at a max clock frequency of 630 MHz and has a combinatorial delay of 0.61 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.
XC3S200A-4VQG100I
XC3S400-4FTG256C
The Xilinx XC3S400-4FTG256C FPGA features 8064 logic cells, 896 CLBs, and a max clock frequency of 630 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact package.
XC3S250E-4FTG256C
Xilinx XC3S250E-4FTG256C FPGA features 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC3S200-4TQG144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC3S400A-4FTG256C
Xilinx XC3S400A-4FTG256C FPGA offers 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 667 MHz, it is ideal for high-speed applications like telecommunications and networking. Operating temperature ranges from 0 to 85°C with a low profile grid array package style.
XC3S250E-4VQG100I
Xilinx XC3S250E-4VQG100I FPGA offers 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for industrial applications requiring high-speed processing in compact designs. The package style includes flatpack, thin profile, and fine pitch options for versatile integration.
XC3S500E-4FGG320C
Xilinx XC3S500E-4FGG320C FPGA offers 10476 logic cells, 1164 CLBs, and 500000 gates. With a max clock frequency of 572 MHz, it is ideal for high-speed applications in industries like telecommunications and aerospace. Operating temperature ranges from 0 to 85°C with a package style of grid array.
XC3SD1800A-4CSG484C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XC3S200A-4VQG100C
The Xilinx XC3S200A-4VQG100C is a FPGA with 4032 logic cells, 448 CLBs, and 200000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
XC3S400A-4FTG256I
XC3S1200E-4FGG400C
XC3S1200E-4FGG400C by Xilinx is a CMOS-based FPGA with 19512 logic cells and 1200000 equivalent gates. It operates at a max clock frequency of 572 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
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