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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LFE3-35EA-6LFTN256I by Lattice Semiconductor

LFE3-35EA-6LFTN256I

Lattice Semiconductor

Lattice Semiconductor's LFE3-35EA-6LFTN256I FPGA offers 33,000 logic cells, operates at a max frequency of 375 MHz, and has 133 inputs/outputs. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

33000

133

133

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-2000ZE-1FTG256I by Lattice Semiconductor

LCMXO2-2000ZE-1FTG256I

Lattice Semiconductor

LCMXO2-2000ZE-1FTG256I by Lattice Semiconductor is a FPGA with 2112 logic cells, 206 inputs/outputs, and operates at 1.2V. Ideal for applications requiring low profile grid array packages, it has a temperature range of -40 to 100°C and uses tin/silver/copper terminals.

FPGA

2112

206

206

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-4000HC-4FTG256I by Lattice Semiconductor

LCMXO2-4000HC-4FTG256I

Lattice Semiconductor

LCMXO2-4000HC-4FTG256I by Lattice Semiconductor is a FPGA with 4320 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-performance computing, signal processing, and embedded systems due to its low profile grid array package style.

FPGA

4320

206

206

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-4000HC-5FTG256C by Lattice Semiconductor

LCMXO2-4000HC-5FTG256C

Lattice Semiconductor

LCMXO2-4000HC-5FTG256C by Lattice Semiconductor is a 4320 logic cell FPGA with 206 inputs/outputs. Operating at 2.375V to 3.465V, it's ideal for applications requiring low-profile grid array packages and high-speed processing in industrial environments.

FPGA

4320

206

206

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-4000HC-5FTG256I by Lattice Semiconductor

LCMXO2-4000HC-5FTG256I

Lattice Semiconductor

LCMXO2-4000HC-5FTG256I by Lattice Semiconductor is a 4320 logic cell FPGA with 206 inputs/outputs. Operating at 2.375V to 3.465V, it's ideal for applications requiring low profile grid array packages like consumer electronics and industrial automation.

FPGA

4320

206

206

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-4000HC-6FTG256C by Lattice Semiconductor

LCMXO2-4000HC-6FTG256C

Lattice Semiconductor

LCMXO2-4000HC-6FTG256C by Lattice Semiconductor is a 4320 logic cell FPGA with 206 inputs/outputs. Operating at 2.375-3.465V, it's ideal for applications requiring low profile grid array packages in industrial environments up to 85°C.

FPGA

4320

206

206

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-4000HC-6FTG256I by Lattice Semiconductor

LCMXO2-4000HC-6FTG256I

Lattice Semiconductor

LCMXO2-4000HC-6FTG256I by Lattice Semiconductor is a FPGA with 4320 logic cells, 206 inputs/outputs, and operates at 2.5V. It is used in applications requiring programmable ICs for various electronic systems.

FPGA

4320

206

206

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-4000ZE-1FTG256C by Lattice Semiconductor

LCMXO2-4000ZE-1FTG256C

Lattice Semiconductor

LCMXO2-4000ZE-1FTG256C by Lattice Semiconductor is a 4320 logic cell FPGA with 206 inputs/outputs. Operating at 1.2V, it has a max temp of 85°C and uses tin/silver/copper terminals. Ideal for applications requiring low profile grid array packages in electronics design.

FPGA

4320

206

206

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-4000ZE-1FTG256I by Lattice Semiconductor

LCMXO2-4000ZE-1FTG256I

Lattice Semiconductor

LCMXO2-4000ZE-1FTG256I by Lattice Semiconductor is a 4320 logic cell FPGA with 206 inputs/outputs. Operating at 1.2V, it has a temp range of -40 to 100°C. Ideal for applications requiring low profile grid array packages and high-density programmable ICs.

FPGA

4320

206

206

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-7000HC-4FTG256C by Lattice Semiconductor

LCMXO2-7000HC-4FTG256C

Lattice Semiconductor

LCMXO2-7000HC-4FTG256C by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-speed processing in compact designs with a max operating temperature of 85°C.

FPGA

6864

206

206

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-7000HC-4FTG256I by Lattice Semiconductor

LCMXO2-7000HC-4FTG256I

Lattice Semiconductor

LCMXO2-7000HC-4FTG256I by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring low profile grid array packages, it has a max operating temperature of 100°C and can handle peak reflow temperatures up to 260°C.

FPGA

6864

206

206

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-7000HC-5FTG256I by Lattice Semiconductor

LCMXO2-7000HC-5FTG256I

Lattice Semiconductor

LCMXO2-7000HC-5FTG256I by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 2.375V to 3.465V. Ideal for applications requiring high-speed processing in industrial automation, telecommunications, and consumer electronics due to its low profile grid array package style.

FPGA

6864

206

206

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-7000HC-6FTG256I by Lattice Semiconductor

LCMXO2-7000HC-6FTG256I

Lattice Semiconductor

LCMXO2-7000HC-6FTG256I by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

6864

206

206

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-7000ZE-1FTG256C by Lattice Semiconductor

LCMXO2-7000ZE-1FTG256C

Lattice Semiconductor

LCMXO2-7000ZE-1FTG256C by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 1.2V. It is used in applications requiring low profile GRID ARRAY packages for high-performance computing in industrial environments.

FPGA

6864

206

206

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LCMXO2-7000ZE-1FTG256I by Lattice Semiconductor

LCMXO2-7000ZE-1FTG256I

Lattice Semiconductor

LCMXO2-7000ZE-1FTG256I by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 1.2V. Ideal for applications requiring low profile grid array package style and programmable gate arrays in industrial environments.

FPGA

6864

206

206

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Tray

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

XC4085XLA-09BG352I by Xilinx

XC4085XLA-09BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

7448

289

289

3136

55000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XC4036XLA-09BG432C by Xilinx

XC4036XLA-09BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1296

288

288

1296

22000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

1296 CLBS, 22000 Gates

Can also use 65000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4052XLA-08BG432C by Xilinx

XC4052XLA-08BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1936

352

352

1936

33000

263 MHz

1 ns

CMOS

Field Programmable Gate Arrays

1936 CLBS, 33000 Gates

Can also use 100000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4085XLA-08BG432C by Xilinx

XC4085XLA-08BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

7448

352

352

3136

55000

263 MHz

1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4085XLA-09BG432C by Xilinx

XC4085XLA-09BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

7448

352

352

3136

55000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC40200XV-07BG560C by Xilinx

XC40200XV-07BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

7056

448

448

7056

130000

296 MHz

1 ns

CMOS

Field Programmable Gate Arrays

7056 CLBS, 130000 Gates

Can also use 400000 gates

2.5

2.3 V

2.7 V

2.5,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin Lead

1.27 mm

560

S-PBGA-B560

e0

No

XC4085XLA-09BG560I by Xilinx

XC4085XLA-09BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Seated Height: 1.7 mm;

FPGA

3136

448

448

3136

55000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV150-4BG352C by Xilinx

XCV150-4BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV150-4BG352I by Xilinx

XCV150-4BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; No. of CLBs: 864;

FPGA

3888

260

260

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV150-5BG352C by Xilinx

XCV150-5BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV150-5BG352I by Xilinx

XCV150-5BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 2.5;

FPGA

3888

260

260

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV150-6BG352C by Xilinx

XCV150-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

3888

260

260

864

164674

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-4BG352C by Xilinx

XCV200-4BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-4BG352I by Xilinx

XCV200-4BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

FPGA

5292

260

260

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-5BG352C by Xilinx

XCV200-5BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-5BG352I by Xilinx

XCV200-5BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 2.625 V;

FPGA

5292

260

260

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200-6BG352C by Xilinx

XCV200-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

236666

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300-4BG352C by Xilinx

XCV300-4BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

260

260

1536

322970

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300-4BG352I by Xilinx

XCV300-4BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;

FPGA

6912

260

260

1536

322970

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300-4BG432C by Xilinx

XCV300-4BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

316

316

1536

322970

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV300-4BG432I by Xilinx

XCV300-4BG432I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .8 ns;

FPGA

6912

316

316

1536

322970

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV300-5BG352C by Xilinx

XCV300-5BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

260

260

1536

322970

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300-5BG352I by Xilinx

XCV300-5BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; No. of CLBs: 1536;

FPGA

6912

260

260

1536

322970

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300-5BG432C by Xilinx

XCV300-5BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

316

316

1536

322970

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV300-5BG432I by Xilinx

XCV300-5BG432I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Package Equivalence Code: BGA432,31X31,50;

FPGA

6912

316

316

1536

322970

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XCV300-6BG352C by Xilinx

XCV300-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

260

260

1536

322970

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300-6BG432C by Xilinx

XCV300-6BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

316

316

1536

322970

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 322970 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4028XL-09BG352C by Xilinx

XC4028XL-09BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1024

256

256

1024

18000

217 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Typical gates = 18000-50000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XC4028XL-1BG352C by Xilinx

XC4028XL-1BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1024

256

256

1024

18000

200 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Max usable 28000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XC4028XL-2BG352I by Xilinx

XC4028XL-2BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 3.6 V;

FPGA

1024

256

256

1024

18000

179 MHz

1.5 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Max usable 28000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XC4028XL-3BG352C by Xilinx

XC4028XL-3BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1024

256

256

1024

18000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Max usable 28000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XC4028XL-3BG352I by Xilinx

XC4028XL-3BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Minimum Supply Voltage: 3 V;

FPGA

1024

256

256

1024

18000

166 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

1024 CLBS, 18000 Gates

Max usable 28000 Logic gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XC4036XL-09BG352C by Xilinx

XC4036XL-09BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1296

288

288

1296

22000

217 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

1296 CLBS, 22000 Gates

Typical gates = 22000-65000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No