Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;
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Field Programmable Gate Arrays (FPGA) XCV200-5BG352C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
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No. of Equivalent Gates:
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Maximum Supply Voltage:
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Minimum Operating Temperature:
Maximum Operating Temperature:
Temperature Grade:
Peak Reflow Temperature:
Peak Reflow Time:
Moisture Sensitivity Level (MSL):
Package Body Material:
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Length:
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Maximum Seated Height:
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JESD-30 Code:
JESD-609 Code:
Qualified:
XCV200-5BG352C Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Spartan,Virtex FPGA/SCD 18/Oct/2010
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
Rectron
LM358DR2G
Onsemi
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20U
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
LM2931AZ-5.0RPG
LM2931AZ-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage and 0.1A max output current. It features a low dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature range from -40 to 125°C. The package style is cylindrical with matte tin terminal finish, ideal for various electronic devices needing precise voltage regulation.
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sensitron Semiconductor
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
Surge Components
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
FDD5614P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
M2GL060-FGG484I
Microchip Technology
M2GL060-FGG484I by Microchip Technology is a PLASTIC/EPOXY FPGA with 484 terminals, operating from -40 to 100 °C. It has a supply voltage range of 1.14V to 1.26V and can withstand peak reflow temperature of 250C. Ideal for industrial applications requiring high-performance programmable ICs in a compact GRID ARRAY package style.
EP2C5T144C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC7S6-1CSGA225C
Xilinx
The Xilinx XC7S6-1CSGA225C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style of grid array and low profile, it offers flexibility in design while maintaining a compact form factor.
LCMXO2-4000HC-4TG144I
Lattice Semiconductor
LCMXO2-4000HC-4TG144I by Lattice Semiconductor is a FPGA with 4320 logic cells, 114 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-density programmable ICs in compact spaces with temperature range of -40 to 100°C.
XC3S400-4TQG144I
The Xilinx XC3S400-4TQG144I is a FPGA with 8064 logic cells, 896 CLBs, and 400000 equivalent gates. It operates at a max clock frequency of 630 MHz and has a combinatorial delay of 0.61 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.
10M08SAE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK;
10M08SCU169I7G
Intel
Intel's 10M08SCU169I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with ball terminals.
XC6SLX16-2CSG324C
Xilinx XC6SLX16-2CSG324C FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Ideal for applications requiring a max clock frequency of 667 MHz, such as high-speed data processing in telecommunications or industrial automation systems. Operating temperature range from 0 to 85°C with a low profile grid array package style.
LCMXO3LF-6900C-5BG400C
LCMXO3LF-6900C-5BG400C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 400 terminals. Ideal for applications requiring low profile, fine pitch grid arrays in electronics operating b/w 0-85°C.
XC7A25T-2CSG325C
The Xilinx XC7A25T-2CSG325C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various industries. With a package style of grid array and low profile, it offers flexibility in design while maintaining high performance standards.
A3P1000-PQG208M
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
LCMXO2-1200HC-4TG100CR1
LCMXO2-1200HC-4TG100CR1 by Lattice Semiconductor is a CMOS FPGA with 1280 logic cells, 80 inputs/outputs, and 3.465V max supply voltage. Ideal for applications requiring high clock frequency up to 133MHz in a square package with GULL WING terminals.
XC7S6-1CPGA196I
Xilinx XC7S6-1CPGA196I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a grid array package style.
EP2C5T144C8N by Intel is a FPGA with 4608 logic cells, 288 CLBs, and 89 inputs. It operates at a max supply voltage of 1.25V and uses CMOS technology. Ideal for applications requiring high-speed data processing in compact designs.
XC6SLX45-3FGG484C
Xilinx XC6SLX45-3FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, such as telecommunications and signal processing due to its CMOS technology and low combinatorial delay of 0.21 ns.
LCMXO2-256HC-5SG32I
LCMXO2-256HC-5SG32I by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs and 21 Inputs/Outputs. Operating at 2.375V to 3.465V, it's ideal for applications requiring high performance in compact form factors like IoT devices and industrial automation systems.
XC6SLX25-2FGG484I
Xilinx XC6SLX25-2FGG484I FPGA features 24051 logic cells, 1879 CLBs, and 266 inputs/outputs. With a max clock frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages of 1.14V to 1.26V, making it versatile for various electronic designs.
A3P1000-FG144M
A3P1000-FG144M by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. It operates at a max clock frequency of 350 MHz, suitable for military-grade applications requiring high-speed processing and complex logic functions. The package style is grid array, making it ideal for surface mount assembly in compact electronic systems.
XC7A35T-1FTG256I
Xilinx XC7A35T-1FTG256I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact form factor. Operates b/w -40 to 100 °C with low profile grid array package style.
10M04SCE144C8G
Intel's 10M04SCE144C8G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-speed processing in industrial automation and telecommunications sectors.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCV200-4FGG456C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
XCV2000E-6FG1156C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCV2000E-7BGG560C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;
XCV2000E-6FGG1156C
XCV2000E-7BG560C
XCV2000E-6FG860C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE;
XCV2000E-7BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.89 V;
XCV2000E-6BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
XCV2000E-6FG1156I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.2/3.6,1.8;
XCV2000E-6FGG1156I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 357 MHz;
XCV2000E-6FGG680C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE;
XCV2000E-6FGG860I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 9600;
XCV2000E-6FG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
XCV2000E-7BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;
XCV2000E-6BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
XCV2000E-6FGG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
XCV2000E-6FG860I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;
XCV2000E-6BG560C
XCV2000E-6BGG560C
XCV2000E-6FG680C
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