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XCV200-4FGG456C

Xilinx

XCV200-4FGG456C by Xilinx

Xilinx XCV200-4FGG456C is a FPGA with 1176 CLBs, 236666 gates, and max clock frequency of 250 MHz. It operates at 2.375-2.625 V, has combinatorial delay of 0.8 ns, and uses CMOS technology. Ideal for applications requiring high-speed processing in compact designs with bottom terminal position and grid array package style.

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Overview

Unlock the limitless possibilities of advanced technology with the Xilinx XCV200-4FGG456C Field Programmable Gate Array. Manufactured by Xilinx, a trusted leader in FPGA technology, this product boasts unparalleled quality and reliability. Ideal for a wide range of applications, this FPGA offers customers the opportunity to customize their designs with ease and efficiency. Experience faster performance, lower power consumption, and enhanced flexibility with the Xilinx XCV200-4FGG456C. Elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the FPGA lightweight and durable, ideal for applications where weight and durability are important factors.

Maximum Supply Voltage: 2.625 V

Higher maximum supply voltage allows for more flexibility in power supply design and operation.

No. of CLBs: 1176

Having a large number of Configurable Logic Blocks (CLBs) provides flexibility and capability for complex logic implementations.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA energy efficient and reliable.

No. of Equivalent Gates: 236666

With a high number of equivalent gates, the FPGA can handle complex designs and large amounts of logic with ease.

Maximum Clock Frequency: 250 MHz

High maximum clock frequency allows for faster operation and processing speed, suitable for demanding real-time applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCV200-4FGG456C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of CLBs:

1176

No. of Equivalent Gates:

236666

Maximum Clock Frequency:

250 MHz

CLB Maximum Delay:

0.8 ns

Technology:

CMOS

Organization:

1176 CLBS, 236666 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Pitch:

1 mm

No. of Terminals:

456

Standards

JESD-30 Code:

S-PBGA-B456

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCV200-4FGG456C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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