Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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LFE3-17EA-8FTN256I by Lattice Semiconductor is a 17000 logic cell FPGA with 133 inputs/outputs, operating at max 500 MHz. It features a low profile grid array package suitable for industrial applications requiring high-speed processing and programmable IC flexibility.
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Plastic and epoxy materials are durable and provide good protection for the internal components of the FPGA, ensuring reliable performance.
The large number of logic cells allows for complex programmable logic designs to be implemented effectively.
Surface mount technology allows for easy and efficient integration of the FPGA onto printed circuit boards, saving space and simplifying assembly.
The relatively low maximum supply voltage helps to minimize power consumption and heat generation, making the FPGA more energy-efficient.
Having a high number of inputs enables the FPGA to interface with a wide variety of external devices and sensors, increasing its versatility.
The square package shape is compact and space-saving, making it ideal for applications where board real estate is limited.
The nominal supply voltage ensures stable and consistent operation of the FPGA within its specified voltage range.
Having a consistent power supply voltage helps to maintain the integrity of the FPGA's internal logic and signal processing capabilities.
The high number of terminals provides ample connectivity options for interfacing with other components and circuitry in the system design.
Being a field-programmable device, the FPGA can be reconfigured and customized for a wide range of applications, offering flexibility and adaptability.
The grid array package style with a low profile design facilitates efficient heat dissipation and helps in maintaining a compact form factor for the FPGA.
The low minimum supply voltage ensures reliable operation even under challenging power supply conditions, enhancing the FPGA's robustness.
The high maximum operating temperature range allows the FPGA to be used in demanding industrial environments without compromising performance.
The tight pitch of the terminals enables high-density mounting of the FPGA on the PCB, optimizing space utilization and enhancing circuit layout flexibility.
The low maximum combinatorial delay of a configurable logic block (CLB) ensures fast signal processing and reduces overall system latency.
The low minimum operating temperature range allows the FPGA to be used in extreme environmental conditions, providing reliability and durability.
The use of tin, silver, and copper for terminal finishing ensures good conductivity and reliability of electrical connections, enhancing overall performance.
Having terminals positioned at the bottom of the package simplifies PCB layout and assembly processes, leading to easier integration of the FPGA.
The MSL 3 rating indicates that the FPGA can withstand moderate moisture exposure during assembly and storage, ensuring long-term reliability.
The low maximum seated height of the FPGA package allows for slim and compact device designs, especially in space-constrained applications.
The compact width of the FPGA package enables efficient board space utilization, helping to optimize the overall system layout and design.
The high maximum clock frequency capability allows the FPGA to handle high-speed data processing and real-time operations, making it suitable for demanding applications.
Having a high number of outputs allows the FPGA to drive multiple external devices and subsystems, facilitating complex system integration and operation.
The maximum time at peak reflow temperature specifies the duration for which the FPGA can undergo the solder reflow process during assembly, ensuring proper soldering and reliability.
The high peak reflow temperature tolerance ensures that the FPGA can withstand the solder reflow process without damage, ensuring robust assembly and reliability.
The compact length of the FPGA package further contributes to its space-saving design, allowing for easy integration into electronic systems with limited space constraints.
The industrial temperature grading ensures that the FPGA can operate reliably across a wide range of temperature conditions commonly encountered in industrial applications.
Field Programmable Gate Arrays (FPGA) LFE3-17EA-8FTN256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor
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LFE3-17EA-8FTN256I Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Multiple Devices Cu Wire 01/Jul/2013
PCN Assembly/Origin - Alternate Assembly/Test Site 14/Apr/2014
PCN Packaging - All Dev Pkg Mark Chg 12/Nov/2018
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
1554216002
Molex
WIRE AND CABLE;
1N4148WT
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
LM107H/883C
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
1N4148
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Kingwell Technonlogy
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LIS2DH12TR
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
LM317D2TG
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
LCMXO2-640HC-4SG48C
Lattice Semiconductor
LCMXO2-640HC-4SG48C by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 40 Inputs/Outputs. Operating at 2.375V to 3.6V, it's ideal for applications requiring high performance in compact form factors like IoT devices and consumer electronics.
EP4CE6F17I8LN
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
XCAU15P-1UBVA368E
Xilinx
FIELD PROGRAMMABLE GATE ARRAY;
EP2C20Q240C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
LFD2NX-40-8BG256I
LFD2NX-40-8BG256I by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 39,000 logic cells and 9,750 CLBs. It uses FDSOI technology and has a max supply voltage of 1.05V. This FPGA is suitable for industrial applications requiring high-performance programmable ICs.
10CX150YF672E5G
Intel
Intel's 10CX150YF672E5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at 0.93V max voltage, it offers TSMC technology with 236 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor.
M7A3P1000-FGG256I
Microchip Technology
M7A3P1000-FGG256I by Microchip Technology is a FPGA with 24576 logic cells, 1.5V nominal voltage, and 350MHz max clock frequency. Ideal for industrial applications requiring high-speed processing, it features 177 inputs/outputs and 1000000 equivalent gates in a compact grid array package.
A3P125-VQG100I
A3P125-VQG100I by Microchip Technology is a CMOS FPGA with 3072 CLBs and 125000 gates. It operates at max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package style of flatpack, thin profile, fine pitch, it offers versatility in design and integration.
EP3C25F256C8NES
EP3C25F256C8NES by Intel is a FPGA with 24624 CLBs, 472.5 MHz clock frequency, and 1.25 V max supply voltage. Ideal for applications requiring high-speed processing and programmable logic in compact form factors like IoT devices and telecommunications equipment.
EP1C4F324C8N
EP1C4F324C8N by Intel is a 4000 logic cell FPGA with 400 CLBs and 249 inputs/outputs. Operating at a max frequency of 275 MHz, it's ideal for applications requiring high-speed processing such as signal processing, networking, and industrial automation. With a compact square package style and low power consumption at 1.5V, it offers versatile programmability for various electronic designs.
LFE5U-25F-8MG285I
Lattice Semiconductor's LFE5U-25F-8MG285I FPGA features 3000 CLBs, operates at -40 to 100 °C, with a supply voltage range of 1.045V to 1.155V. Ideal for industrial applications requiring high-performance and low-profile grid array packaging with fine pitch terminals.
A40MX04-PLG68I
A40MX04-PLG68I by Microchip Tech is a 3.6V FPGA with 547 CLBs, 6000 gates, and max clock freq of 80MHz. Ideal for industrial applications requiring high-speed processing in temp range -40 to 85°C. Features CMOS tech, J bend terminals, and square package shape.
LCMXO3LF-6900C-5BG400C
LCMXO3LF-6900C-5BG400C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 400 terminals. Ideal for applications requiring low profile, fine pitch grid arrays in electronics operating b/w 0-85°C.
10CL120YF484I7G
Intel's 10CL120YF484I7G FPGA features 119088 logic cells, 7443 CLBs, and 277 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style mounting.
10M50SAE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
XC7K160T-1FFG676C
XC7K160T-1FFG676C by Xilinx is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1098 MHz. It operates at supply voltages ranging from 0.97V to 3.3V and is used in applications requiring high-speed processing and programmable ICs.
M2GL005-TQG144I
M2GL005-TQG144I by Microchip Technology is a Field Programmable Gate Array (FPGA) with a max supply voltage of 1.26V and min operating temperature of -40°C. Its package style is flatpack, low profile, fine pitch making it suitable for industrial applications requiring high performance in compact spaces. With 144 terminals and matte tin finishing, this FPGA offers versatility and reliability in electronic designs.
10M04SCU169C8G
The Intel 10M04SCU169C8G is a FPGA with 4000 logic cells, 250 CLBs, and 246 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from 0°C to 85°C. This versatile device in a square grid array package is ideal for applications requiring programmable ICs with high logic cell counts and input/output capabilities.
LFE5U-25F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
XC5VFX70T-1FFG1136C
Xilinx XC5VFX70T-1FFG1136C FPGA features 71680 logic cells, 5600 CLBs, and 640 inputs/outputs. Utilized in applications requiring high-speed processing, it operates at a max supply voltage of 1.05 V with a combinatorial delay of 0.9 ns per CLB.
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LFE3-17EA-6LMG328I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
LFE3-17EA-6FTN256I
LFE3-17EA-6FTN256I by Lattice Semiconductor is a 17000 logic cell FPGA with 133 inputs/outputs, operating at max frequency of 375 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.
LFE3-17EA-6FN484C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LFE3-17EA-6FN484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LFE3-35EA-6FN484C
LFE3-35EA-6FTN256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LFE3-17EA-6FTN256C
Lattice Semiconductor's LFE3-17EA-6FTN256C FPGA features 17000 logic cells, 133 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact square package with low profile grid array style.
LFE3-35EA-7FN484C
LFE3-35EA-7FN484C by Lattice Semiconductor is a 33000 logic cell FPGA with 295 inputs/outputs, operating at 420 MHz. Ideal for applications requiring high-speed processing in compact designs due to its small form factor and low power consumption.
LFE3-35EA-8FN484I
LFE3-70EA-8FN484C
LFE3-17EA-8MG328C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE;
LFE3-95EA-6FN672I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .379 ns;
LFE3-17EA-8LMG328I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE; Pitch Of Terminal: .5 mm;
LFE3-35EA-6FTN256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LFE3-70EA-7FN484C
LFE3-70EA-7FN484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 67000;
LFE3-150EA-7FN1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
LFE3-150EA-8FN672I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
LFE3-35EA-6FN672C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
LFE3-17EA-8FN484I
Supply Digital Components
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