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LFE3-17EA-6FTN256C

Lattice Semiconductor

LFE3-17EA-6FTN256C by Lattice Semiconductor

Lattice Semiconductor's LFE3-17EA-6FTN256C FPGA features 17000 logic cells, 133 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact square package with low profile grid array style.

Median Price

$33.200

Lifecycle Status

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Verical

USA . 87 parts In-Stock

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$33.200

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$27.190

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Mouser Electronics

USA . 5 parts In-Stock

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$33.230

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Arrow

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Nova Conductors

Japan . 10 parts In-Stock

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Chip Stock

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Vyrian

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Bristol Electronics

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ComSIT Distribution GmbH

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Cyclops Electronics Ltd

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Prism Electronics

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Vigor

Singapore . 2,925 parts In-Stock

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Ampacity Inc.

Singapore . 262 parts In-Stock

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Continental Prestige Electronics

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Microchip USA

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Aztec Data Supply Inc.

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Corohmni

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Advanced Electronics

New Zealand . 210 parts In-Stock

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Perfect Parts

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Alle Elektronik GmbH

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Epart123

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Argo Parts USA

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Overview

Unlock limitless possibilities with the LFE3-17EA-6FTN256C FPGA by Lattice Semiconductor. Crafted with precision and expertise, this cutting-edge Field Programmable Gate Array boasts 17,000 logic cells, 133 inputs/outputs, and a maximum clock frequency of 375 MHz. From aerospace to automotive industries, this versatile FPGA is designed to elevate performance and efficiency in a wide range of applications. Experience seamless integration, unparalleled reliability, and unmatched value with the LFE3-17EA-6FTN256C - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and cost-effective, ideal for various applications.

No. of Logic Cells: 17000

With a high number of logic cells, this FPGA provides ample capacity for complex designs and algorithms.

Surface Mount: YES

Being surface mountable, this FPGA is easy to integrate into PCB designs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage of 1.26 V ensures power efficiency and helps in reducing overall power consumption.

No. of Inputs: 133

With 133 inputs, this FPGA can handle a wide range of external signals and data inputs for versatile applications.

Package Shape: SQUARE

The square package shape allows for easy PCB layout and efficient use of space within the design.

Form Of Terminal: BALL

The ball terminal design offers reliable connectivity and ease of soldering during assembly processes.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V provides stable and consistent power delivery for reliable performance.

Power Supplies (V): 1.2

With dedicated power supplies at 1.2 V, this FPGA offers consistent voltage regulation for optimal operation.

No. of Terminals: 256

The 256 terminals provide ample connectivity options for interfacing with other components and external devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA, this programmable IC offers flexibility for customization and adaptation to specific project requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers a compact form factor suitable for space-constrained designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14 V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this FPGA can withstand extended operation under demanding conditions.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for precise and secure connections during assembly.

Maximum Combinatorial Delay of a CLB: 0.379 ns

The low combinatorial delay of 0.379 ns ensures fast processing speeds for real-time applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can operate in a wide range of environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The finishing of terminals with tin, silver, and copper provides excellent conductivity and corrosion resistance for reliable connections.

Position Of Terminal: BOTTOM

The bottom position of terminals offers easy access and soldering during board assembly processes.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FPGA can withstand moderate levels of moisture exposure during storage and handling.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55 mm allows for compact designs and efficient utilization of space.

Width: 17 mm

With a width of 17 mm, this FPGA offers a balance between size and functionality for various applications.

Maximum Clock Frequency: 375 MHz

The high maximum clock frequency of 375 MHz allows for fast operations and real-time processing of data.

No. of Outputs: 133

With 133 outputs, this FPGA can drive a variety of external devices and components, making it versatile for different applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FPGA can withstand high-temperature soldering processes.

Length: 17 mm

The length of 17 mm provides a compact form factor suitable for space-constrained designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFE3-17EA-6FTN256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

17000

No. of Inputs:

133

No. of Outputs:

133

Maximum Clock Frequency:

375 MHz

CLB Maximum Delay:

0.379 ns

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFE3-17EA-6FTN256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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