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LFE3-17EA-6FTN256I

Lattice Semiconductor

LFE3-17EA-6FTN256I by Lattice Semiconductor

LFE3-17EA-6FTN256I by Lattice Semiconductor is a 17000 logic cell FPGA with 133 inputs/outputs, operating at max frequency of 375 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

$29.600

Lifecycle Status

Suppliers In-Stock

11

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Flip Electronics (Authorized)

USA . 5,185 parts In-Stock

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Rochester

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$29.370

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$26.280

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$24.740

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Verical

USA . 720 parts In-Stock

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$30.460

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$30.350

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Arrow

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$29.600

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$29.310

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$28.730

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Distributors (In-Stock)

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Component Electronics Inc.

Canada . 2 parts In-Stock

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$23.080

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$17.310

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Bristol Electronics

USA . 100 parts In-Stock

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$29.160

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Vyrian

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Chip Stock

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Cyclops Electronics Ltd

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Nova Conductors

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Vigor

Singapore . 5,000 parts In-Stock

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$24.600

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Ampacity Inc.

Singapore . 1,231 parts In-Stock

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Corohmni

South Africa . 385 parts In-Stock

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Microchip USA

USA . 2,180 parts In-Stock

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Semicontronic

India . 809 parts In-Stock

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$54.760

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$53.391

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$53.117

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Aztec Data Supply Inc.

USA . 294 parts In-Stock

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$70.964

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A-Z Elektronik GmbH

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Continental Prestige Electronics

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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Argo Parts USA

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Component Stockers USA

USA . 1,297 parts In-Stock

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RC Electronics

USA . 856 parts In-Stock

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$28.310

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$25.840

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$25.070

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Bastille Electronics

Australia . 300 parts In-Stock

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Kepictronics

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Overview

Looking to enhance your electronic designs with cutting-edge technology? Look no further than the LFE3-17EA-6FTN256I by Lattice Semiconductor. As a leader in Field Programmable Gate Arrays (FPGA), Lattice Semiconductor delivers top-notch quality and innovation. With 17000 logic cells and a maximum clock frequency of 375 MHz, this FPGA is perfect for a wide range of applications. Whether you're working on telecommunications, automotive, or industrial projects, this FPGA offers unparalleled flexibility and performance. Trust Lattice Semiconductor for all your FPGA needs and take your designs to the next level.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and cost-effectiveness for the product.

No. of Logic Cells:

17000 - The high number of logic cells allows for complex designs to be implemented efficiently.

Surface Mount:

YES - The surface mount feature makes the product easy to integrate into circuit boards.

Maximum Supply Voltage:

1.26 V - The maximum supply voltage ensures reliable performance without risking damage to the FPGA.

No. of Inputs:

133 - The high number of inputs allows for versatile connectivity options in the design.

Package Shape:

SQUARE - The square shape of the package helps in efficient use of space on a circuit board.

Form Of Terminal:

BALL - The ball terminal design ensures secure connections and easy soldering.

Nominal Supply Voltage (V):

1.2 - The nominal supply voltage provides stability and compatibility with other components.

Power Supplies (V):

1.2 - The consistent power supply ensures reliable operation of the FPGA.

No. of Terminals:

256 - The high number of terminals allows for versatile connectivity options in the design.

Programmable IC Type:

FIELD PROGRAMMABLE GATE ARRAY - This type of IC allows for reconfigurable logic, making it adaptable to different applications.

Package Style (Meter):

GRID ARRAY, LOW PROFILE - The low profile grid array package style ensures efficient use of space on a circuit board.

Minimum Supply Voltage:

1.14 V - The minimum supply voltage ensures energy efficiency and reliable operation.

Maximum Operating Temperature:

100 °C - The high maximum operating temperature allows for operation in a wide range of environments.

Pitch Of Terminal:

1 mm - The small pitch of the terminals allows for high-density packaging on a circuit board.

Maximum Combinatorial Delay of a CLB:

0.379 ns - The low combinatorial delay ensures high-speed performance of the FPGA.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows for operation in harsh environments.

Finishing Of Terminal Used:

TIN SILVER COPPER - The combination of finishing materials ensures high conductivity and reliability of the connections.

Position Of Terminal:

BOTTOM - The position of the terminals on the bottom side of the package helps in easy integration into circuit boards.

Moisture Sensitivity Level (MSL):

3 - The MSL level indicates the product's resistance to moisture, ensuring long-term reliability.

Maximum Seated Height:

1.55 mm - The low seated height allows for compact design and efficient use of space.

Width:

17 mm - The width of the FPGA is suitable for various circuit board designs.

Maximum Clock Frequency:

375 MHz - The high maximum clock frequency allows for fast processing of signals and data.

No. of Outputs:

133 - The high number of outputs allows for versatile connectivity options in the design.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature ensures the product's reliability during soldering processes.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures proper soldering and reliability of connections.

Length:

17 mm - The length of the FPGA is suitable for various circuit board designs.

Grading Of Temperature:

INDUSTRIAL - The industrial-grade temperature rating indicates the product's suitability for a wide range of operating conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFE3-17EA-6FTN256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

17000

No. of Inputs:

133

No. of Outputs:

133

Maximum Clock Frequency:

375 MHz

CLB Maximum Delay:

0.379 ns

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFE3-17EA-6FTN256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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