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LFE3-35EA-6FN672C

Lattice Semiconductor

LFE3-35EA-6FN672C by Lattice Semiconductor

Lattice Semiconductor's LFE3-35EA-6FN672C FPGA offers 33000 logic cells, 310 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

Median Price

$53.664

Lifecycle Status

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Overview

Unlock the power of cutting-edge technology with the LFE3-35EA-6FN672C by Lattice Semiconductor. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Lattice Semiconductor delivers top-notch quality and reliability. This versatile FPGA offers endless possibilities for applications in various industries. With its 33,000 logic cells and high clock frequency of 375 MHz, this product is designed to provide unmatched performance. Experience seamless integration and optimized functionality with the LFE3-35EA-6FN672C, giving you the competitive edge you need to succeed in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the FPGA lightweight and durable, making it suitable for various applications where weight and durability are important factors.

No. of Logic Cells: 33000

With a high number of logic cells, this FPGA provides increased processing power and flexibility for complex logic functions and designs.

Surface Mount: YES

The surface-mount capability of this FPGA allows for easy integration onto printed circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation and prevents damage to the FPGA from voltage spikes or fluctuations.

No. of Inputs: 310

With a high number of inputs, this FPGA can accommodate a large number of external signals, making it suitable for applications that require extensive input processing.

Package Shape: SQUARE

The square package shape allows for easy integration and placement on the PCB, optimizing space utilization and layout efficiency.

Form Of Terminal: BALL

The ball form of terminal simplifies the soldering process during assembly, ensuring reliable and secure connections.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V ensures compatibility with standard voltage levels, making it easy to interface with other components in the system.

Power Supplies (V): 1.2

The consistent power supply voltage of 1.2 V ensures stable and reliable operation of the FPGA, reducing the risk of errors or malfunctions.

No. of Terminals: 672

With a high number of terminals, this FPGA offers ample connectivity options for interfacing with external devices and components, enhancing its versatility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable gate array, this product allows for customization and reconfiguration of logic functions on-the-fly, making it adaptable to evolving project requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout of terminals, facilitating easy routing and connecting of signals on the PCB.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures compatibility with low-power applications while still providing sufficient voltage for reliable operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this FPGA can withstand harsh environmental conditions and operate reliably in elevated temperature environments.

Pitch Of Terminal: 1 mm

The 1 mm terminal pitch allows for precise placement and routing of connections on the PCB, maximizing efficiency and signal integrity.

Maximum Combinatorial Delay of a CLB: 0.379 ns

The low maximum combinatorial delay of a configurable logic block (CLB) ensures fast processing and response times, ideal for high-speed applications that demand quick logic execution.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can function in cold environments without risk of damage or performance degradation.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing ensures reliable and low-resistance connections, reducing signal loss and improving signal integrity.

Position Of Terminal: BOTTOM

The bottom position of the terminals simplifies PCB layout and routing, allowing for efficient and organized signal connections.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this FPGA is moderately sensitive to moisture, requiring standard handling and storage practices to prevent moisture-related damage.

Maximum Seated Height: 2.6 mm

The low maximum seated height of 2.6 mm allows for slim and compact PCB designs, saving space and enabling integration into space-constrained applications.

Width: 27 mm

The 27 mm width provides a compact form factor for the FPGA, allowing for easy integration into various system layouts and designs.

Maximum Clock Frequency: 375 MHz

With a high maximum clock frequency of 375 MHz, this FPGA can handle rapid data processing and high-speed operations, making it suitable for performance-critical applications.

No. of Outputs: 310

The high number of outputs allows for extensive signal routing and processing capabilities, enabling complex logic and output configurations in the FPGA design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and thermal bonding during assembly, preventing solder joints from overheating or degrading.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250°C ensures effective reflow soldering during assembly, achieving reliable and durable connections between the FPGA and the PCB.

Length: 27 mm

The 27 mm length complements the width of the FPGA, providing a balanced form factor for easy integration and placement on the PCB.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFE3-35EA-6FN672C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

33000

No. of Inputs:

310

No. of Outputs:

310

Maximum Clock Frequency:

375 MHz

CLB Maximum Delay:

0.379 ns

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFE3-35EA-6FN672C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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