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LFE3-35EA-8FTN256C

Lattice Semiconductor

LFE3-35EA-8FTN256C by Lattice Semiconductor

Lattice Semiconductor's LFE3-35EA-8FTN256C FPGA offers 33,000 logic cells, operates at a max frequency of 500 MHz, and has 133 inputs/outputs. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

Median Price

$59.120

Lifecycle Status

Suppliers In-Stock

9

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Arrow

USA . 90 parts In-Stock

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$52.340

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$49.380

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Verical

USA . 90 parts In-Stock

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Mouser Electronics

USA . 59 parts In-Stock

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$55.740

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DigiKey

USA . 58 parts In-Stock

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$71.450

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$59.768

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Flip Electronics (Authorized)

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Flip Electronics

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Vyrian

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Chip Stock

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Nova Conductors

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Vigor

Singapore . 308 parts In-Stock

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$43.710

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Ampacity Inc.

Singapore . 8,756 parts In-Stock

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Microchip USA

USA . 6,585 parts In-Stock

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Metaverse IC Inc.

Canada . 88,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

Germany . 6,947 parts In-Stock

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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RC Electronics

USA . 447 parts In-Stock

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$47.170

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$45.760

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ChipstoGo Electronic ltd

UK . 126 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Lattice Semiconductor LFE3-35EA-8FTN256C FPGA. Manufactured by industry leader Lattice Semiconductor, this high-quality FPGA offers unparalleled versatility and performance in a compact package. Ideal for a wide range of applications, from telecommunications to industrial control systems, this FPGA delivers unmatched value and benefits to customers looking to optimize their designs. Experience the advantages of seamless integration, fast processing speeds, and reliable performance with the LFE3-35EA-8FTN256C FPGA - your key to unlocking endless possibilities in the world of digital design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, ensuring it can withstand various environmental conditions.

No. of Logic Cells: 33000

With a high number of logic cells, this FPGA allows for complex programmable logic designs to be implemented effectively.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.

No. of Inputs: 133

Having a large number of inputs enables the FPGA to handle multiple data streams or signals simultaneously, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape provides uniformity and ease of mounting on circuit boards, optimizing space utilization.

Form Of Terminal: BALL

The use of ball terminals simplifies the connection and soldering process, ensuring secure and reliable electrical contact.

Nominal Supply Voltage (V): 1.2

Having a consistent nominal supply voltage ensures stable performance of the FPGA, preventing fluctuations that can impact functionality.

Power Supplies (V): 1.2

The availability of multiple power supplies at 1.2V provides flexibility in design and operation, accommodating different voltage requirements for various components.

No. of Terminals: 256

The high number of terminals allows for versatile connectivity options and integration with external devices, expanding the application possibilities of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA offers reconfigurability and adaptability for custom logic implementations, making it suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array package style with a low profile design enhances thermal performance and helps in reducing signal interference, improving the overall reliability of the FPGA.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures proper operation even under low power conditions, enabling efficient energy utilization in the FPGA.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the FPGA to function reliably in harsh environments or under extended operation, ensuring long-term durability.

Pitch Of Terminal: 1 mm

The close proximity of terminals at 1mm pitch facilitates high-density interconnection and compact PCB layout, enabling efficient signal routing and reducing overall space requirements.

Maximum Combinatorial Delay of a CLB: 0.281 ns

The low combinatorial delay ensures fast signal processing and minimal latency, enhancing the performance of the FPGA for real-time applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the FPGA to function reliably in cold environments without compromising its performance, ensuring versatility in deployment.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of multiple finishing materials enhances solderability and corrosion resistance, ensuring long-term reliability and robust electrical connections for the FPGA.

Position Of Terminal: BOTTOM

Having terminals at the bottom simplifies PCB design and assembly, providing easy access for soldering and connection, streamlining the manufacturing process.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, this FPGA can withstand typical handling and storage conditions without risk of damage or performance degradation.

Maximum Seated Height: 1.55 mm

The low seated height profile enables compact and slim device design, making it suitable for space-constrained applications and enhancing overall aesthetics.

Width: 17 mm

The 17mm width provides a balance between compact form factor and sufficient space for terminal placement, ensuring optimal design flexibility and board compatibility.

Maximum Clock Frequency: 500 MHz

With a high maximum clock frequency, this FPGA can support fast data processing and high-speed communication, enabling efficient performance in demanding applications.

No. of Outputs: 133

Having a large number of outputs allows the FPGA to drive multiple devices or components, enabling complex logic operations and diverse system integration possibilities.

Maximum Time At Peak Reflow Temperature (s): 30

The prolonged time at peak reflow temperature ensures proper soldering and bonding of the FPGA during assembly, enhancing reliability and mechanical stability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures effective soldering and thermal bonding, preventing solder defects and ensuring robust electrical connections for the FPGA.

Length: 17 mm

The 17mm length provides a compact footprint for the FPGA, enabling space-efficient integration in various electronic devices and ensuring versatility in design applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFE3-35EA-8FTN256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

33000

No. of Inputs:

133

No. of Outputs:

133

Maximum Clock Frequency:

500 MHz

CLB Maximum Delay:

0.281 ns

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFE3-35EA-8FTN256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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