Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Lattice Semiconductor's LFE3-35EA-8FTN256C FPGA offers 33,000 logic cells, operates at a max frequency of 500 MHz, and has 133 inputs/outputs. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
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This material provides durability and protection for the FPGA, ensuring it can withstand various environmental conditions.
With a high number of logic cells, this FPGA allows for complex programmable logic designs to be implemented effectively.
Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.
The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.
Having a large number of inputs enables the FPGA to handle multiple data streams or signals simultaneously, enhancing its processing capabilities.
The square package shape provides uniformity and ease of mounting on circuit boards, optimizing space utilization.
The use of ball terminals simplifies the connection and soldering process, ensuring secure and reliable electrical contact.
Having a consistent nominal supply voltage ensures stable performance of the FPGA, preventing fluctuations that can impact functionality.
The availability of multiple power supplies at 1.2V provides flexibility in design and operation, accommodating different voltage requirements for various components.
The high number of terminals allows for versatile connectivity options and integration with external devices, expanding the application possibilities of the FPGA.
As a field-programmable device, this FPGA offers reconfigurability and adaptability for custom logic implementations, making it suitable for a wide range of applications.
The grid array package style with a low profile design enhances thermal performance and helps in reducing signal interference, improving the overall reliability of the FPGA.
The low minimum supply voltage ensures proper operation even under low power conditions, enabling efficient energy utilization in the FPGA.
The high maximum operating temperature tolerance allows the FPGA to function reliably in harsh environments or under extended operation, ensuring long-term durability.
The close proximity of terminals at 1mm pitch facilitates high-density interconnection and compact PCB layout, enabling efficient signal routing and reducing overall space requirements.
The low combinatorial delay ensures fast signal processing and minimal latency, enhancing the performance of the FPGA for real-time applications.
The low minimum operating temperature allows the FPGA to function reliably in cold environments without compromising its performance, ensuring versatility in deployment.
The use of multiple finishing materials enhances solderability and corrosion resistance, ensuring long-term reliability and robust electrical connections for the FPGA.
Having terminals at the bottom simplifies PCB design and assembly, providing easy access for soldering and connection, streamlining the manufacturing process.
With a moderate moisture sensitivity level, this FPGA can withstand typical handling and storage conditions without risk of damage or performance degradation.
The low seated height profile enables compact and slim device design, making it suitable for space-constrained applications and enhancing overall aesthetics.
The 17mm width provides a balance between compact form factor and sufficient space for terminal placement, ensuring optimal design flexibility and board compatibility.
With a high maximum clock frequency, this FPGA can support fast data processing and high-speed communication, enabling efficient performance in demanding applications.
Having a large number of outputs allows the FPGA to drive multiple devices or components, enabling complex logic operations and diverse system integration possibilities.
The prolonged time at peak reflow temperature ensures proper soldering and bonding of the FPGA during assembly, enhancing reliability and mechanical stability.
The high peak reflow temperature tolerance ensures effective soldering and thermal bonding, preventing solder defects and ensuring robust electrical connections for the FPGA.
The 17mm length provides a compact footprint for the FPGA, enabling space-efficient integration in various electronic devices and ensuring versatility in design applications.
Field Programmable Gate Arrays (FPGA) LFE3-35EA-8FTN256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor
Programmable IC Type:
No. of Logic Cells:
No. of Inputs:
No. of Outputs:
Maximum Clock Frequency:
CLB Maximum Delay:
Sub-Category:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies:
Minimum Operating Temperature:
Maximum Operating Temperature:
Temperature Grade:
Peak Reflow Temperature:
Peak Reflow Time:
Moisture Sensitivity Level (MSL):
Package Body Material:
Surface Mountable:
Package Style:
Package Code:
Package Shape:
Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
Terminal Position:
Terminal Style:
Terminal Finish:
Terminal Pitch:
No. of Terminals:
JESD-30 Code:
JESD-609 Code:
Qualified:
LFE3-35EA-8FTN256C Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Multiple Devices Cu Wire 01/Jul/2013 Top Mark Format Change 20/Dec/2023
PCN Assembly/Origin - Alternate Qualified Test Site 30/Sep/2013
PCN Packaging - All Dev Pkg Mark Chg 12/Nov/2018
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
USBLC6-2SC6
STMicroelectronics
USBLC6-2SC6 by STMicroelectronics is a unidirectional transient voltage suppressor diode with a breakdown voltage of 6V. It has a max clamping voltage of 17V and operates in temperatures ranging from -40 to 125°C. This device, with dual terminals and matte tin finish, is ideal for protecting sensitive electronics from voltage spikes in various applications.
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317LMX/NOPB
Texas Instruments
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
LM317AEMP/NOPB
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
STM32F407VGT6
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
Daco Semiconductor
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
XC6SLX45T-2FGG484C
Xilinx
Xilinx XC6SLX45T-2FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 296 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.
XC6SLX25T-3CSG324I
Xilinx XC6SLX25T-3CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages ranging from 1.14V to 2.5/3.3V, making it versatile for various electronic designs.
XC7K160T-2FFG676C
The Xilinx XC7K160T-2FFG676C is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1818 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XCAU15P-2FFVB676I
Xilinx XCAU15P-2FFVB676I FPGA offers 170100 logic cells, 9720 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from -40 to 100°C makes it versatile for various environments.
M1AGL600V2-FGG144I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
EP4CE15F17I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;
A3P250-FGG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
10M25SAE144C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
ICE40LP1K-CM36
Lattice Semiconductor
ICE40LP1K-CM36 by Lattice Semiconductor is a 1280 logic cell FPGA with CMOS technology. It operates at 1.2V, has 160 CLBs, and supports a max clock frequency of 133MHz. Ideal for industrial applications requiring high-speed processing in compact designs.
A3P1000-FG256I
XCAU10P-1UBVA368I
FIELD PROGRAMMABLE GATE ARRAY;
10M25SAE144C8GES
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
A3PN250-VQG100I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
10M50DAF256I7G
Intel
The Intel 10M50DAF256I7G is a FPGA with 50000 logic cells, 3125 CLBs, and 500 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and has an industrial temperature grade. This versatile chip is ideal for applications requiring high-speed data processing and customizable logic functions in various industries.
A3P125-VQG100I
XCAU25P-L1SFVB784I
5CEFA5F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
LCMXO2-4000HC-4BG332I
LCMXO2-4000HC-4BG332I by Lattice Semiconductor is a FPGA with 4320 logic cells, 274 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
M7A3P1000-FGG484I
Microchip Technology
M7A3P1000-FGG484I by Microchip Technology is a FPGA with 24576 logic cells, 1000000 gates, and 300 inputs/outputs. It operates at max frequency of 350 MHz and supports industrial temperature range. Ideal for high-performance applications requiring programmable ICs in compact form factor.
XCAU20P-L1FFVB676I
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LFE3-17EA-6LMG328I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
LFE3-17EA-6FTN256I
LFE3-17EA-6FTN256I by Lattice Semiconductor is a 17000 logic cell FPGA with 133 inputs/outputs, operating at max frequency of 375 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.
LFE3-17EA-6FN484C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LFE3-17EA-6FN484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LFE3-35EA-6FN484C
LFE3-35EA-6FTN256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LFE3-17EA-6FTN256C
Lattice Semiconductor's LFE3-17EA-6FTN256C FPGA features 17000 logic cells, 133 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact square package with low profile grid array style.
LFE3-35EA-7FN484C
LFE3-35EA-7FN484C by Lattice Semiconductor is a 33000 logic cell FPGA with 295 inputs/outputs, operating at 420 MHz. Ideal for applications requiring high-speed processing in compact designs due to its small form factor and low power consumption.
LFE3-35EA-8FN484I
LFE3-70EA-8FN484C
LFE3-17EA-8MG328C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE;
LFE3-95EA-6FN672I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .379 ns;
LFE3-17EA-8LMG328I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE; Pitch Of Terminal: .5 mm;
LFE3-17EA-8FTN256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LFE3-35EA-6FTN256I
LFE3-70EA-7FN484C
LFE3-70EA-7FN484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 67000;
LFE3-150EA-7FN1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
LFE3-150EA-8FN672I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
LFE3-35EA-6FN672C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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