Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Lattice Semiconductor's LFE3-35EA-8FTN256C FPGA offers 33,000 logic cells, operates at a max frequency of 500 MHz, and has 133 inputs/outputs. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
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This material provides durability and protection for the FPGA, ensuring it can withstand various environmental conditions.
With a high number of logic cells, this FPGA allows for complex programmable logic designs to be implemented effectively.
Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.
The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.
Having a large number of inputs enables the FPGA to handle multiple data streams or signals simultaneously, enhancing its processing capabilities.
The square package shape provides uniformity and ease of mounting on circuit boards, optimizing space utilization.
The use of ball terminals simplifies the connection and soldering process, ensuring secure and reliable electrical contact.
Having a consistent nominal supply voltage ensures stable performance of the FPGA, preventing fluctuations that can impact functionality.
The availability of multiple power supplies at 1.2V provides flexibility in design and operation, accommodating different voltage requirements for various components.
The high number of terminals allows for versatile connectivity options and integration with external devices, expanding the application possibilities of the FPGA.
As a field-programmable device, this FPGA offers reconfigurability and adaptability for custom logic implementations, making it suitable for a wide range of applications.
The grid array package style with a low profile design enhances thermal performance and helps in reducing signal interference, improving the overall reliability of the FPGA.
The low minimum supply voltage ensures proper operation even under low power conditions, enabling efficient energy utilization in the FPGA.
The high maximum operating temperature tolerance allows the FPGA to function reliably in harsh environments or under extended operation, ensuring long-term durability.
The close proximity of terminals at 1mm pitch facilitates high-density interconnection and compact PCB layout, enabling efficient signal routing and reducing overall space requirements.
The low combinatorial delay ensures fast signal processing and minimal latency, enhancing the performance of the FPGA for real-time applications.
The low minimum operating temperature allows the FPGA to function reliably in cold environments without compromising its performance, ensuring versatility in deployment.
The use of multiple finishing materials enhances solderability and corrosion resistance, ensuring long-term reliability and robust electrical connections for the FPGA.
Having terminals at the bottom simplifies PCB design and assembly, providing easy access for soldering and connection, streamlining the manufacturing process.
With a moderate moisture sensitivity level, this FPGA can withstand typical handling and storage conditions without risk of damage or performance degradation.
The low seated height profile enables compact and slim device design, making it suitable for space-constrained applications and enhancing overall aesthetics.
The 17mm width provides a balance between compact form factor and sufficient space for terminal placement, ensuring optimal design flexibility and board compatibility.
With a high maximum clock frequency, this FPGA can support fast data processing and high-speed communication, enabling efficient performance in demanding applications.
Having a large number of outputs allows the FPGA to drive multiple devices or components, enabling complex logic operations and diverse system integration possibilities.
The prolonged time at peak reflow temperature ensures proper soldering and bonding of the FPGA during assembly, enhancing reliability and mechanical stability.
The high peak reflow temperature tolerance ensures effective soldering and thermal bonding, preventing solder defects and ensuring robust electrical connections for the FPGA.
The 17mm length provides a compact footprint for the FPGA, enabling space-efficient integration in various electronic devices and ensuring versatility in design applications.
Field Programmable Gate Arrays (FPGA) LFE3-35EA-8FTN256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor
Programmable IC Type:
No. of Logic Cells:
No. of Inputs:
No. of Outputs:
Maximum Clock Frequency:
CLB Maximum Delay:
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Maximum Supply Voltage:
Power Supplies:
Minimum Operating Temperature:
Maximum Operating Temperature:
Temperature Grade:
Peak Reflow Temperature:
Peak Reflow Time:
Moisture Sensitivity Level (MSL):
Package Body Material:
Surface Mountable:
Package Style:
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Length:
Width:
Maximum Seated Height:
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JESD-30 Code:
JESD-609 Code:
Qualified:
LFE3-35EA-8FTN256C Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Multiple Devices Cu Wire 01/Jul/2013 Top Mark Format Change 20/Dec/2023
PCN Assembly/Origin - Alternate Qualified Test Site 30/Sep/2013
PCN Packaging - All Dev Pkg Mark Chg 12/Nov/2018
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
1N4148
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
LL4148
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
2N2222A
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NE555D
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
MBR0520LT1
Onsemi
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
LM358N
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
LM2931Z-5.0RPG
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
10CX220YF780I5G
Intel
Intel's 10CX220YF780I5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it has 284 inputs/outputs and uses TSMC technology. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package.
10M02SCE144C8GES
Altera
FIELD PROGRAMMABLE GATE ARRAY;
LFD2NX-40-9BG256I
Lattice Semiconductor
LFD2NX-40-9BG256I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 111 inputs/outputs, and uses a grid array package. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.
EP4CGX15BF14C8N
EP4CGX15BF14C8N by Intel is a FPGA with 14400 logic cells, 900 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities due to its versatile design and low profile grid array package style.
XCKU040-2FFVA1156E
Xilinx
Xilinx XCKU040-2FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: Grid Array, with a max operating temperature of 100°C.
XC7A12T-2CSG325C
The Xilinx XC7A12T-2CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
M2GL050-VFG400I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
XC7A200T-2FBG676I
Xilinx XC7A200T-2FBG676I FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
XC6SLX25-2FGG484C
The Xilinx XC6SLX25-2FGG484C is a FPGA with 24051 logic cells, 1879 CLBs, and max clock frequency of 667 MHz. It operates at a nominal voltage of 1.2V and is suitable for applications requiring high-speed processing in electronics and telecommunications industries.
EP3C16F484I7N
EP3C16F484I7N by Intel is a CMOS FPGA with 15408 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, suitable for industrial applications requiring high-speed processing in compact designs. With 346 inputs/outputs, this rectangular grid array package offers flexibility and performance in various electronic systems.
A3P1000-FG256I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
M1A3P1000-FG256I
Microchip Technology
M1A3P1000-FG256I by Microchip Technology is a FPGA with 24576 CLBs and 1000000 gates, operating at max frequency of 350 MHz. It has a supply voltage range of 1.425V to 1.575V, suitable for industrial applications requiring high gate count and clock speed in a compact grid array package.
EP1S25F672C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
XC7A12T-1CSG325C
The Xilinx XC7A12T-1CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
EP4CE22E22C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: HLFQFP; Package Shape: SQUARE;
XC7A35T-1CSG324C
Xilinx XC7A35T-1CSG324C FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor with low power consumption.
ICE40HX4K-CB132
ICE40HX4K-CB132 by Lattice Semiconductor is a FPGA with 3520 logic cells, 440 CLBs, and 95 inputs/outputs. Operating at max frequency of 133 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and very thin profile, it offers versatility in design while maintaining reliability.
10CL025YU256I7G
Intel 10CL025YU256I7G is a FPGA with 1539 CLBs, operating voltage of 1.15-1.25V, and temp range -40 to 100°C. Ideal for industrial applications requiring low profile, fine pitch grid array package style with moisture sensitivity level of 3.
LCMXO2-640HC-4TG100C
LCMXO2-640HC-4TG100C by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 78 Inputs/Outputs. Operating at 2.5V, it's ideal for applications requiring low power consumption and high performance in industrial settings. Its compact square package makes it suitable for space-constrained designs.
M2GL090T-1FG676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
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LFE3-17EA-6LMG328I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
LFE3-17EA-6FTN256I
LFE3-17EA-6FTN256I by Lattice Semiconductor is a 17000 logic cell FPGA with 133 inputs/outputs, operating at max frequency of 375 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.
LFE3-17EA-6FN484C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LFE3-17EA-6FN484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LFE3-35EA-6FN484C
LFE3-35EA-6FTN256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LFE3-17EA-6FTN256C
Lattice Semiconductor's LFE3-17EA-6FTN256C FPGA features 17000 logic cells, 133 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact square package with low profile grid array style.
LFE3-35EA-7FN484C
LFE3-35EA-7FN484C by Lattice Semiconductor is a 33000 logic cell FPGA with 295 inputs/outputs, operating at 420 MHz. Ideal for applications requiring high-speed processing in compact designs due to its small form factor and low power consumption.
LFE3-35EA-8FN484I
LFE3-70EA-8FN484C
LFE3-17EA-8MG328C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE;
LFE3-95EA-6FN672I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .379 ns;
LFE3-17EA-8LMG328I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE; Pitch Of Terminal: .5 mm;
LFE3-17EA-8FTN256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LFE3-35EA-6FTN256I
LFE3-70EA-7FN484C
LFE3-70EA-7FN484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 67000;
LFE3-150EA-7FN1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
LFE3-150EA-8FN672I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
LFE3-35EA-6FN672C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
Supply Digital Components
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