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XC3S500E-4FT256I

Xilinx

XC3S500E-4FT256I by Xilinx

Xilinx XC3S500E-4FT256I FPGA offers 10476 logic cells, 1164 CLBs, and 500000 equivalent gates. Ideal for industrial applications with a max clock frequency of 572 MHz and operating temperature range from -40 to 100 °C.

Median Price

$137.780

Lifecycle Status

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Mouser Electronics

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VNN

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Digiode

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Modulus Dynamics

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Vigor

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One Stop Electronics

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Component Stockers USA

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Microchip USA

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Kenton Components

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Qasali Group International

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Overview

Unleash the possibilities with the XC3S500E-4FT256I by Xilinx, a top-tier Field Programmable Gate Array that combines cutting-edge technology with unmatched reliability. This FPGA boasts 10476 logic cells and 1164 CLBs, making it a powerhouse for any application. With a maximum clock frequency of 572 MHz and a wide range of power supplies, this versatile device offers flexibility like no other. Whether you're in telecommunications, industrial automation, or consumer electronics, the XC3S500E-4FT256I delivers unrivaled performance and efficiency, ensuring your projects reach new heights. Experience the innovation firsthand and revolutionize your designs with Xilinx's industry-leading FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging provides good protection for the sensitive components inside the FPGA, ensuring durability and reliability.

No. of Logic Cells: 10476

With a high number of logic cells, this FPGA can handle complex logic functions and support advanced applications.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA more energy-efficient.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA suitable for a wide range of applications.

Maximum Clock Frequency: 572 MHz

The high maximum clock frequency allows for fast processing speeds, making the FPGA suitable for time-sensitive applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S500E-4FT256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

10476

No. of Inputs:

190

No. of Outputs:

149

No. of CLBs:

1164

No. of Equivalent Gates:

500000

Maximum Clock Frequency:

572 MHz

CLB Maximum Delay:

0.76 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1164 CLBS, 500000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3S500E-4FT256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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