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LCMXO2280E-4FTN256C

Lattice Semiconductor

LCMXO2280E-4FTN256C by Lattice Semiconductor

LCMXO2280E-4FTN256C by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 211 inputs/outputs. It operates at 1.2V, has a package style of grid array, low profile, and is suitable for applications requiring programmable gate arrays in various industries.

Median Price

$33.763

Lifecycle Status

Suppliers In-Stock

8

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Flip Electronics (Authorized)

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Bristol Electronics

USA . 285 parts In-Stock

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$28.570

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Nova Conductors

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Semicontronic

India . 5,451 parts In-Stock

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AZTECH Wire

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Ampacity Inc.

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Aztec Data Supply Inc.

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Microchip USA

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Overview

Unlock unlimited possibilities with the LCMXO2280E-4FTN256C by Lattice Semiconductor. As a leading manufacturer in the FPGA category, this product boasts 2280 logic cells and 285 CLBs, making it a powerhouse for various applications. With a low profile grid array package style and a maximum operating temperature of 85°C, this FPGA offers exceptional performance and reliability. Whether you're designing cutting-edge electronics or pushing the boundaries of innovation, the LCMXO2280E-4FTN256C delivers unmatched value, benefits, and advantages to meet your unique needs. Elevate your projects with this top-of-the-line solution from Lattice Semiconductor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring reliability in various operating conditions.

No. of Logic Cells: 2280

Large number of logic cells provide flexibility and capability for complex designs and applications.

Surface Mount: YES

Surface mount capability simplifies the assembly process and allows for compact and efficient PCB layout.

Maximum Supply Voltage: 1.26 V

Higher maximum supply voltage allows for robust performance and compatibility with various power sources.

No. of CLBs: 285

Having a significant number of Configurable Logic Blocks (CLBs) enables versatile logic implementation and customization.

No. of Inputs: 211

Abundance of input pins allows for comprehensive external connectivity and data integration.

Package Shape: SQUARE

Square shape facilitates easy integration and placement within PCB design, optimizing space utilization.

Form Of Terminal: BALL

Ball terminals provide reliable connections and solder joints for stable performance and ease of manufacturing.

Nominal Supply Voltage (V): 1.2

Having a standard nominal supply voltage ensures compatibility with common power sources and systems.

Power Supplies (V): 1.2

Stable power supply at 1.2V ensures consistent and reliable operation of the FPGA.

No. of Terminals: 256

Sufficient number of terminals offer ample connectivity options and routing flexibility for diverse applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for customization and adaptability to specific project requirements without the need for costly revisions.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array with low profile design enables efficient PCB stacking and compact system integration.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability in demanding environmental conditions.

Pitch Of Terminal: 1 mm

Narrow terminal pitch allows for high-density routing and compact PCB layout.

Organization: 285 CLBS

Organized structure of 285 CLBs offers clear logic partitioning and efficient utilization of resources.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature tolerance ensures functionality in a wide range of thermal conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Tin/silver/copper finishing on terminals provides reliable conductivity and solderability for stable connections.

Position Of Terminal: BOTTOM

Bottom terminal positioning facilitates easier PCB layout and routing, optimizing signal integrity and performance.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, which is suitable for standard assembly processes and environmental conditions.

Maximum Seated Height: 1.7 mm

Low maximum seated height enables slim and compact device profile for space-constrained applications.

Width: 17 mm

Moderate width of 17mm offers a balance between compactness and accessibility for ease of handling and integration.

No. of Outputs: 211

Abundance of output pins allows for comprehensive signal routing and connectivity options for diverse applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, this FPGA is suitable for efficient and reliable solder reflow processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures secure and stable solder joints for long-term reliability.

Length: 17 mm

Moderate length of 17mm provides a balanced form factor for integration and compatibility with standard PCB dimensions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2280E-4FTN256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

2280

No. of Inputs:

211

No. of Outputs:

211

No. of CLBs:

285

Sub-Category:

Field Programmable Gate Arrays

Organization:

285 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

40 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.7 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO2280E-4FTN256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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