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XC3S700A-5FTG256C

Xilinx

XC3S700A-5FTG256C by Xilinx

Xilinx XC3S700A-5FTG256C FPGA offers 13248 logic cells, 1472 CLBs, and 700000 gates. Ideal for applications requiring high clock frequency up to 770 MHz, with a max operating temperature of 85°C. Package style: Grid Array, low profile; technology: CMOS; suitable for various electronic designs.

Median Price

$105.270

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One Stop Electronics

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Overview

Unleash the power of cutting-edge technology with the XC3S700A-5FTG256C by Xilinx! As a leader in Field Programmable Gate Arrays (FPGA), Xilinx delivers top-notch quality and reliability. This versatile FPGA boasts 13248 logic cells, 1472 CLBs, and 700000 equivalent gates, making it ideal for a wide range of applications. From high-speed data processing to complex algorithm implementation, this FPGA offers unmatched performance and flexibility. Elevate your projects to new heights with the XC3S700A-5FTG256C and experience the difference that Xilinx innovation can bring to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

No. of Logic Cells: 13248

With a high number of logic cells, this FPGA can handle complex and advanced logic functions efficiently.

Surface Mount: YES

Surface mount packaging allows for easy integration into circuit boards, saving space and simplifying design.

Maximum Supply Voltage: 1.26 V

Operating within this voltage range ensures optimal performance and reliability.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

No. of Inputs: 161

A high number of inputs allows for versatile connectivity and functionality in various applications.

No. of Equivalent Gates: 700000

With a large number of equivalent gates, this FPGA can handle complex digital designs with ease.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent performance and reliability.

Maximum Clock Frequency: 770 MHz

High clock frequency allows for fast processing speed, making the product suitable for high-performance applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S700A-5FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

13248

No. of Inputs:

161

No. of Outputs:

148

No. of CLBs:

1472

No. of Equivalent Gates:

700000

Maximum Clock Frequency:

770 MHz

CLB Maximum Delay:

0.62 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1472 CLBS, 700000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S700A-5FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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