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LFE3-17EA-7FTN256C

Lattice Semiconductor

LFE3-17EA-7FTN256C by Lattice Semiconductor

Lattice Semiconductor's LFE3-17EA-7FTN256C FPGA features 17000 logic cells, 133 inputs/outputs, and a max clock frequency of 420 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

Median Price

$36.260

Lifecycle Status

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16

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Arrow

USA . 810 parts In-Stock

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Verical

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Mouser Electronics

USA . 3 parts In-Stock

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DigiKey

USA . 25 parts In-Stock

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Rochester

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DF Sales Co.

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DF Sales Co.

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Vyrian

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Cyclops Electronics Ltd

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Speed Components Ltd

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LIBRA Elektronik GmbH

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Nova Conductors

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ComSIT Distribution GmbH

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Vigor

Singapore . 4,385 parts In-Stock

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Ampacity Inc.

Singapore . 6,443 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

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Argo Parts USA

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QUARKTWIN TECHNOLOGY LTD

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Aranea Global

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Metaverse IC Inc.

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Overview

Discover the power of innovation with the LFE3-17EA-7FTN256C from Lattice Semiconductor. This cutting-edge Field Programmable Gate Array (FPGA) boasts 17000 logic cells and a maximum clock frequency of 420 MHz, making it ideal for a wide range of applications. Whether you're designing IoT devices, industrial automation systems, or automotive solutions, this FPGA delivers unmatched performance and flexibility. With a nominal supply voltage of 1.2V and a low profile grid array package style, the LFE3-17EA-7FTN256C is designed to meet your most demanding requirements. Elevate your projects with the quality and reliability that only Lattice Semiconductor can provide. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

No. of Logic Cells: 17000

With a high number of logic cells, this FPGA can handle complex designs and processing tasks effectively.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

No. of Inputs: 133

A high number of inputs provide flexibility in connecting to various external devices and components.

Package Shape: SQUARE

The square package shape ensures efficient use of PCB real estate and easy integration into existing designs.

Form Of Terminal: BALL

Ball terminal design simplifies the soldering process and ensures reliable connections.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage provides stable operation and compatibility with standard power sources.

Power Supplies (V): 1.2

The consistent power supply voltage helps in maintaining reliable performance and minimizing errors.

No. of Terminals: 256

A high number of terminals offer more connectivity options and support for complex circuit configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this IC provides flexibility in designing and reconfiguring custom logic functions.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile design enhance PCB layout efficiency and allow for compact system designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and reduces power consumption.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can reliably operate in demanding thermal conditions.

Pitch Of Terminal: 1 mm

The terminal pitch of 1mm facilitates easy soldering and connection to standard PCB layouts.

Maximum Combinatorial Delay of a CLB: 0.335 ns

The low combinatorial delay of CLB ensures fast processing speeds and efficient operation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals ensures good conductivity and long-term reliability.

Position Of Terminal: BOTTOM

The location of terminals at the bottom simplifies PCB layout and assembly, improving overall design efficiency.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA can withstand standard moisture exposure during handling and assembly.

Maximum Seated Height: 1.55 mm

The low seated height allows for compact system designs and efficient use of space in electronic devices.

Width: 17 mm

The compact width makes this FPGA suitable for applications where space is limited and compact design is essential.

Maximum Clock Frequency: 420 MHz

With a high maximum clock frequency, this FPGA can handle high-speed data processing and computation tasks efficiently.

No. of Outputs: 133

A high number of outputs provide flexibility in driving multiple external devices and components.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and assembly during production.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for efficient soldering and assembly of this FPGA on PCBs.

Length: 17 mm

The compact length of 17mm makes this FPGA suitable for applications where space-saving designs are required.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFE3-17EA-7FTN256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

17000

No. of Inputs:

133

No. of Outputs:

133

Maximum Clock Frequency:

420 MHz

CLB Maximum Delay:

0.335 ns

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFE3-17EA-7FTN256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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