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XC3S1200E-4FT256I

Xilinx

XC3S1200E-4FT256I by Xilinx

XC3S1200E-4FT256I by Xilinx is a FPGA with 19512 logic cells, 2168 CLBs, and 1200000 gates. Operating at max frequency of 572 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range (-40 to 100°C) and low profile grid array package style, it offers versatility in various environments.

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Overview

Unleash the power of cutting-edge technology with the XC3S1200E-4FT256I by Xilinx. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Xilinx delivers top-quality solutions for a wide range of applications. From advanced robotics to aerospace systems, this versatile FPGA offers unparalleled performance and flexibility. Experience the value of seamless integration, enhanced efficiency, and optimized functionality with the XC3S1200E-4FT256I. Transform your projects with Xilinx's innovative solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and resistant to damage during handling and installation.

No. of Logic Cells: 19512

High number of logic cells allow for complex logic operations and versatile programming capabilities in the FPGA.

Maximum Supply Voltage: 1.26 V

Efficient power consumption with a relatively low maximum supply voltage, reducing energy costs and heat generation.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA reliable and energy-efficient.

Maximum Clock Frequency: 572 MHz

High clock frequency allows for fast processing speeds and real-time operation of the FPGA, making it suitable for time-sensitive applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S1200E-4FT256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

19512

No. of Inputs:

190

No. of Outputs:

150

No. of CLBs:

2168

No. of Equivalent Gates:

1200000

Maximum Clock Frequency:

572 MHz

CLB Maximum Delay:

0.76 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2168 CLBS, 1200000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3S1200E-4FT256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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