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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
EP3SE80F780C4LG by Intel

EP3SE80F780C4LG

Intel

EP3SE80F780C4LG by Intel is a FPGA with 80000 logic cells, 3200 CLBs, and 780 terminals. It operates b/w 0-85 °C and has a supply voltage range of 0.86V to 0.94V. This square-shaped GRID ARRAY package is ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

80000

3200

3200 CLBS

Also Operates at 1.1 V VCC nominal

.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.2 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP3SL150F780C4G by Intel

EP3SL150F780C4G

Intel

EP3SL150F780C4G by Intel is a FPGA with 142.5K logic cells, 5700 CLBs, and 488 inputs/outputs. It operates b/w 0-85°C, has a supply voltage range of 0.86-0.94 V, and features a grid array package style. Ideal for applications requiring high-speed data processing and customizable logic functions in electronic systems.

FPGA

142500

488

488

5700

5700 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP3SL50F780C4G by Intel

EP3SL50F780C4G

Intel

EP3SL50F780C4G by Intel is a FPGA with 47500 logic cells, 1900 CLBs, and 488 inputs/outputs. It operates b/w 0-85°C, has a supply voltage range of 0.86-0.94 V, and features a square package shape with ball terminals. Ideal for applications requiring high-speed data processing and customizable logic functions in compact designs.

FPGA

47500

488

488

1900

1900 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

10CX105YF780E6G by Intel

10CX105YF780E6G

Intel

Intel's 10CX105YF780E6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temperature of 100°C, it features TSMC technology and is ideal for applications requiring high-speed data processing and complex algorithm implementations. With 284 inputs/outputs, this square-shaped grid array package supports various digital design projects.

FPGA

104000

284

284

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX105YF780I6G by Intel

10CX105YF780I6G

Intel

Intel's 10CX105YF780I6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Utilizes TSMC technology with 0.93V max supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

FPGA

104000

284

284

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX150YF780E5G by Intel

10CX150YF780E5G

Intel

The Intel 10CX150YF780E5G is a FPGA with 150,000 logic cells and 54,770 CLBs. It operates at 0.9V nominal voltage and can handle up to 284 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a grid array package style.

FPGA

150000

284

284

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX150YF780I5G by Intel

10CX150YF780I5G

Intel

Intel's 10CX150YF780I5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at -40 to 100 °C, it has 284 inputs/outputs for industrial applications. Utilizes TSMC tech with 0.87-0.93 V supply voltage range in a grid array package.

FPGA

150000

284

284

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX220YF780E5G by Intel

10CX220YF780E5G

Intel

The Intel 10CX220YF780E5G is a FPGA with 220,000 logic cells and 80,330 CLBs. It uses TSMC technology and operates b/w -40 to 100 °C. Ideal for applications requiring high-speed processing and programmable ICs in industrial automation and telecommunications sectors.

FPGA

220000

284

284

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX220YF780E6G by Intel

10CX220YF780E6G

Intel

Intel's 10CX220YF780E6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it features TSMC technology with 0.93V supply voltage. Ideal for applications requiring high-performance programmable ICs in a grid array package style.

FPGA

220000

284

284

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX220YF780I5G by Intel

10CX220YF780I5G

Intel

Intel's 10CX220YF780I5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it has 284 inputs/outputs and uses TSMC technology. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package.

FPGA

220000

284

284

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX220YF780I6G by Intel

10CX220YF780I6G

Intel

Intel's 10CX220YF780I6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Utilizes TSMC technology with 0.9V nominal voltage. Ideal for industrial applications requiring high logic cell count and temperature tolerance up to 100°C.

FPGA

220000

284

284

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CL080YF780C6G by Intel

10CL080YF780C6G

Intel

Intel's 10CL080YF780C6G is a FPGA with 5079 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. Suitable for applications requiring high-speed data processing in compact form factors like IoT devices and telecommunications equipment.

FPGA

5079

5079 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.4 mm

Bottom

Ball

1 mm

780

S-PBGA-B780

10CL080YF780C8G by Intel

10CL080YF780C8G

Intel

Intel's 10CL080YF780C8G FPGA features 5079 CLBs, 1.2V nominal voltage, and 85°C max operating temp. Ideal for applications requiring high flexibility and customization in electronic systems with a need for programmable logic devices.

FPGA

5079

5079 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.4 mm

Bottom

Ball

1 mm

780

S-PBGA-B780

10CL080YF780I7G by Intel

10CL080YF780I7G

Intel

Intel 10CL080YF780I7G FPGA features 5079 CLBs, operates at -40 to 100 °C, with max supply voltage of 1.25 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact square grid array package.

FPGA

5079

5079 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.4 mm

Bottom

Ball

1 mm

780

S-PBGA-B780

10CL080ZF780I8G by Intel

10CL080ZF780I8G

Intel

The Intel 10CL080ZF780I8G FPGA features 81264 logic cells, 5079 CLBs, and 423 inputs/outputs. With a package style of grid array and programmable IC type, it is ideal for industrial applications requiring high-performance and flexibility in electronic circuit design. Operating temperature ranges from -40 to 100°C with a supply voltage of 0.97-1.03V.

FPGA

81264

423

423

5079

5079 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.4 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

10CL120YF780C8G by Intel

10CL120YF780C8G

Intel

Intel's 10CL120YF780C8G FPGA features 7443 CLBs, 1.2V nominal voltage, and 85°C max operating temp. Ideal for applications requiring high flexibility and customization in electronic circuit design with a package style of grid array and square shape.

FPGA

7443

7443 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.4 mm

Bottom

Ball

1 mm

780

S-PBGA-B780

10CL120YF780I7G by Intel

10CL120YF780I7G

Intel

Intel 10CL120YF780I7G is a FPGA with 7443 CLBs, 1.2V nominal voltage, and 100°C max operating temp. Ideal for industrial applications requiring high-performance programmable ICs in a compact square grid array package with bottom terminals.

FPGA

7443

7443 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.4 mm

Bottom

Ball

1 mm

780

S-PBGA-B780

10AX027E1F29I1HG by Intel

10AX027E1F29I1HG

Intel

Intel's 10AX027E1F29I1HG FPGA boasts 270K logic cells, TSMC tech, and 10162 CLBs. Ideal for industrial applications with -40 to 100°C temp range, it features a grid array package style and 360 inputs/outputs for versatile designs.

FPGA

270000

360

360

10162

TSMC

10162 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.35 mm

Bottom

Ball

1 mm

780

S-PBGA-B780

EP2AGX65DF29C6G by Intel

EP2AGX65DF29C6G

Intel

EP2AGX65DF29C6G by Intel is a FPGA with 60214 logic cells, 2530 CLBs, and 372 inputs/outputs. It operates b/w temperatures of 0-85°C and has a supply voltage range of 0.87-0.93V. Ideal for applications requiring high-speed data processing and customizable logic functions in compact designs.

FPGA

60214

372

372

2530

2530 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

29 mm

29 mm

2.6 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP3SL70F780I3G by Intel

EP3SL70F780I3G

Intel

EP3SL70F780I3G by Intel is a FPGA with 67500 logic cells, 2700 CLBs, and 488 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 0.86V to 0.94V, and features a grid array package style. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.

FPGA

67500

488

488

2700

2700 CLBS

It can also operate from 1.05 to 1.15 V supply

0.9

.86 V

.94 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP2AGX125EF29C4G by Intel

EP2AGX125EF29C4G

Intel

EP2AGX125EF29C4G by Intel is a Field Programmable Gate Array (FPGA) with 118,143 logic cells. It has a max supply voltage of 0.93V and can operate at temperatures up to 85°C. This FPGA is suitable for various applications requiring programmable ICs and offers a package style of grid array with heat sink/slug.

FPGA

118143

372

372

4964

4964 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

29 mm

29 mm

2.6 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP2AGX125EF29I5G by Intel

EP2AGX125EF29I5G

Intel

EP2AGX125EF29I5G by Intel is a FPGA with 118143 logic cells, 4964 CLBs, and 372 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 0.87V to 0.93V. This device is suitable for applications requiring high-speed processing and programmable logic capabilities in compact form factors.

FPGA

118143

372

372

4964

4964 CLBS

0.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

29 mm

29 mm

2.6 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

5AGZME1E2H29C3G by Intel

5AGZME1E2H29C3G

Intel

Intel 5AGZME1E2H29C3G FPGA features 220,000 logic cells and 8,302 CLBs. With 342 inputs/outputs, it operates b/w -40°C to 85°C. Ideal for applications requiring high-speed data processing in compact spaces.

FPGA

220000

342

342

8302

8302 CLBS

0.85

.82 V

.88 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

33 mm

33 mm

3.5 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

5AGZME3E2H29C3G by Intel

5AGZME3E2H29C3G

Intel

Intel 5AGZME3E2H29C3G FPGA features 360K logic cells, 13584 CLBs, and 342 inputs/outputs. With a package style of grid array and square shape, it's ideal for applications requiring high-speed processing in compact spaces. Operating b/w 0-85°C with low supply voltage, it suits various industrial and embedded systems.

FPGA

360000

342

342

13584

13584 CLBS

0.85

.82 V

.88 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

33 mm

33 mm

3.5 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP4SGX70DF29C4G by Intel

EP4SGX70DF29C4G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Length: 29 mm;

FPGA

72600

372

372

2904

2904 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.3 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780