Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Intel 5AGZME3E2H29C3G FPGA features 360K logic cells, 13584 CLBs, and 342 inputs/outputs. With a package style of grid array and square shape, it's ideal for applications requiring high-speed processing in compact spaces. Operating b/w 0-85°C with low supply voltage, it suits various industrial and embedded systems.
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The use of plastic/epoxy material in the package body makes the FPGA lightweight and durable, making it easy to handle and suitable for a wide range of applications.
With a high number of logic cells, this FPGA offers a large-scale integration capability, allowing for complex programmable logic designs to be implemented efficiently.
Being surface mountable simplifies the assembly process and enables compact PCB layouts, making it ideal for space-constrained applications.
The low maximum supply voltage requirement ensures power efficiency and compatibility with low-power systems, reducing power consumption and heat generation.
The high number of Configurable Logic Blocks (CLBs) allows for flexible design configurations and efficient utilization of resources for implementing logic functions and algorithms.
Having a large number of inputs provides versatility in connecting external signals and data sources, enabling the FPGA to handle diverse input requirements in complex systems.
The square package shape offers uniformity in size and facilitates easy integration into PCB designs, ensuring a standardized mounting and layout arrangement.
The ball terminal form allows for reliable solder connections and easy reworkability, enhancing the overall robustness and serviceability of the FPGA package.
The specified nominal supply voltage ensures stable and consistent operation within the desired voltage range, guaranteeing reliable performance in various operating conditions.
The ample number of terminals provides sufficient connectivity options for interfacing with external components and peripherals, accommodating diverse system integration requirements.
As a Field Programmable Gate Array, this device offers programmable logic flexibility and customization, enabling rapid prototyping and iterative development of digital designs.
The grid array package style ensures uniform terminal distribution and easy alignment during assembly, contributing to efficient soldering and reliable electrical connections.
The low minimum supply voltage requirement ensures operational stability at lower power levels, enhancing energy efficiency and enabling power-saving modes in the system.
With a high maximum operating temperature, the FPGA can function reliably in elevated temperature environments, ensuring robust performance under demanding thermal conditions.
The specified terminal pitch provides proper spacing for soldering and assembly, facilitating accurate mounting on PCBs and ensuring secure electrical connections.
The organized structure of 13584 Configurable Logic Blocks (CLBs) allows for efficient logic implementation and resource management, enabling optimized utilization of the FPGA's capabilities.
The specified minimum operating temperature ensures reliable functionality even in cold environments, guaranteeing consistent performance across a wide temperature range.
The bottom position of the terminals simplifies PCB layout and soldering processes, facilitating easy integration into system designs and ensuring mechanical stability.
The maximum seated height specification provides clearances for component placement and ensures compatibility with standard PCB mounting practices, facilitating mechanical design integration.
The compact width dimension of 33 mm allows for space-efficient PCB layouts and compact system designs, making the FPGA suitable for applications with size constraints.
Having a substantial number of outputs enables the FPGA to drive multiple external components and communicate with various peripherals, enhancing system connectivity and functionality.
The length dimension of 33 mm contributes to the overall compactness of the FPGA package, allowing for easy placement on PCBs and enabling efficient use of board space.
Field Programmable Gate Arrays (FPGA) 5AGZME3E2H29C3G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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5AGZME3E2H29C3G Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet Update 09/Aug/2023 Mult PN LABEL 01/08/2023
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
MC7805CTG
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317TG
Texas Instruments
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
1N4148WT-7
1N4148WT-7 by Diodes Inc. is a fast recovery rectifier diode with a max reverse recovery time of 0.004 us and a max forward voltage of 1.25 V. It has a package style of small outline, making it suitable for surface mount applications where high-speed switching is required at temperatures ranging from -65 to 150 °C.
OPA2277UA
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS123-7-F
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
1N4148WS
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Semiconductors
LCMXO2-1200HC-4TG144C
Lattice Semiconductor
LCMXO2-1200HC-4TG144C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133 MHz. Operating at 85°C, it has 107 inputs/outputs and supports supply voltages of 2.5V/3.3V. Ideal for applications requiring high-speed processing in compact designs.
XC7A100T-1FGG484I
Xilinx
Xilinx XC7A100T-1FGG484I FPGA features 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. Utilized in applications requiring high clock frequencies up to 1098 MHz, such as telecommunications and signal processing due to its advanced CMOS technology and low power consumption.
XC6SLX75-2CSG484C
Xilinx XC6SLX75-2CSG484C FPGA features 74637 logic cells, 5831 CLBs, and a max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing and programmable ICs in various industries like telecommunications and automotive.
MPF100T-FCSG325I
Microchip Technology
MPF100T-FCSG325I by Microchip Tech is a CMOS FPGA with 170 inputs/outputs. It operates b/w -40 to 100°C, with supply voltage range of 0.97-1.03V. This low-profile, fine-pitch GRID ARRAY package is ideal for high-performance applications in electronics.
EP4CE6F17I8LN
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
EP3C25Q240C8N
Intel
EP3C25Q240C8N by Intel is a CMOS FPGA with 24624 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, making it suitable for high-speed applications in industries like telecommunications and data processing. With a package style of flatpack, fine pitch, this FPGA offers versatility in design and integration.
10CL006YU256C8G
Intel 10CL006YU256C8G is a FPGA with 392 CLBs, operating voltage range of 1.15V to 1.25V, and max temp of 85°C. Ideal for applications requiring high-speed data processing like telecommunications, automotive systems, and industrial automation due to its programmable nature and grid array package style.
XC7A35T-1FTG256C
Xilinx XC7A35T-1FTG256C is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. Package style: Grid Array, low profile, fine pitch.
LCMXO2-7000HC-4FTG256I
LCMXO2-7000HC-4FTG256I by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring low profile grid array packages, it has a max operating temperature of 100°C and can handle peak reflow temperatures up to 260°C.
XC7A35T-2CSG324I
Xilinx XC7A35T-2CSG324I FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
M2GL090T-1FG484M
M2GL090T-1FG484M by Microchip Technology is a CMOS FPGA with 86316 logic cells, 267 inputs/outputs, and operates at 1.2V. It is used in military-grade applications requiring high performance and reliability in harsh environments.
LFXP2-5E-5QN208C
LFXP2-5E-5QN208C by Lattice Semiconductor is a 5000 Logic Cells FPGA with 625 CLBs, operating at max 435 MHz clock frequency. It has 146 inputs/outputs, uses CMOS technology, and supports supply voltage of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices or embedded systems.
EP4CE10F17I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
M2GL005-VFG256I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
LFD2NX-40-7BG256C
Lattice Semiconductor's LFD2NX-40-7BG256C FPGA features 39000 logic cells, FDSOI technology, and 9750 CLBs. Ideal for applications requiring high performance with 111 inputs/outputs, low profile grid array package style, and operating temperatures from 0 to 85°C.
XC6VLX760-1FFG1760I
Xilinx XC6VLX760-1FFG1760I FPGA features 758784 logic cells, operates at max 1098 MHz clock frequency, and supports CMOS technology. Ideal for industrial applications requiring high-speed processing with a wide range of inputs/outputs and low power consumption.
M2GL025TS-1FGG484I
M2GL025TS-1FGG484I by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and comes in a square grid array package suitable for industrial applications.
EP3C25F256I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;
XC3S200A-4VQG100C
The Xilinx XC3S200A-4VQG100C is a FPGA with 4032 logic cells, 448 CLBs, and 200000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
EP1C4F324C8N
EP1C4F324C8N by Intel is a 4000 logic cell FPGA with 400 CLBs and 249 inputs/outputs. Operating at a max frequency of 275 MHz, it's ideal for applications requiring high-speed processing such as signal processing, networking, and industrial automation. With a compact square package style and low power consumption at 1.5V, it offers versatile programmability for various electronic designs.
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5AGZME1E2H29C3G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
5AGZME1H2F35I3LG
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 8302;
5AGZME1E3F29I3L
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: NO LEAD; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;
5AGZME1E3F29C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;
5AGZME1E2F35I3
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
5AGZME1E2F29C4N
5AGZME1E3F29I3LN
5AGZME1E2F29I3LN
5AGZME1E2F35I3LN
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: NO LEAD; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
5AGZME1E2F29I3N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;
5AGZME1E2F35I3N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
5AGZME1E3F29C4
5AGZME1E2F35C4N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
5AGZME1E3F29I3
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.12 V;
5AGZME1E2F29I3L
5AGZME1E2H29C3N
FIELD PROGRAMMABLE GATE ARRAY;
5AGZME1E2F35I3L
5AGZME1E2F29C4
5AGZME1E2F29I3
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Width: 33 mm;
5AGZME3E2H29C4N
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