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5AGZME1E2H29C3G

Intel

5AGZME1E2H29C3G by Intel

Intel 5AGZME1E2H29C3G FPGA features 220,000 logic cells and 8,302 CLBs. With 342 inputs/outputs, it operates b/w -40°C to 85°C. Ideal for applications requiring high-speed data processing in compact spaces.

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Vyrian

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Digiode

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Chip Stock

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Nova Conductors

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Ampacity Inc.

Singapore . 1,460 parts In-Stock

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AZTECH Wire

Italy . 994 parts In-Stock

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MARBEL Systems

Belgium . 1,730 parts In-Stock

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Texas Native Microelectronics

USA . 1,678 parts In-Stock

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Kenton Components

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QUARKTWIN TECHNOLOGY LTD

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Qasali Group International

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Microchip USA

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Authorized Procurement Solutions

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Argo Parts USA

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Continental Prestige Electronics

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Overview

Experience the revolution in technology with the 5AGZME1E2H29C3G by Intel. Designed with precision and expertise, this FPGA delivers unmatched quality and performance. Unlock endless possibilities in computing, networking, and automation with its cutting-edge features. Elevate your projects with ease and efficiency, thanks to its advanced capabilities. Trust Intel to bring you the best in innovation and reliability. Upgrade to the 5AGZME1E2H29C3G today and stay ahead in the game.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable.

No. of Logic Cells: 220000

Having a high number of logic cells allows for complex designs and higher processing capabilities.

Surface Mount: YES

Being surface mountable, this FPGA is easy to incorporate into circuit boards and designs.

Maximum Supply Voltage: 0.88 V

The maximum supply voltage of 0.88 V ensures efficient power consumption and operation.

No. of CLBs: 8302

With 8302 Configurable Logic Blocks, there is ample room for custom logic configurations.

No. of Inputs: 342

Having 342 inputs allows for a wide range of data and signals to be processed by the FPGA.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on circuit boards.

Form Of Terminal: BALL

The ball terminals are reliable and provide secure connections for the FPGA.

Nominal Supply Voltage (V): 0.85

The nominal supply voltage of 0.85 V ensures stable and optimal performance of the FPGA.

No. of Terminals: 780

Having 780 terminals allows for versatile connectivity options within the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility and reprogramming capabilities.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout for the FPGA.

Minimum Supply Voltage: 0.82 V

The minimum supply voltage of 0.82 V ensures reliable operation even at lower power levels.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand high temperatures in various environments.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for precise alignment and soldering during installation.

Organization: 8302 CLBS

The organization of 8302 Configurable Logic Blocks enables efficient logic implementation and customization.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can function in cold environments without compromising performance.

Position Of Terminal: BOTTOM

Having the terminals at the bottom makes it easier to integrate the FPGA into circuit designs.

Maximum Seated Height: 3.5 mm

The maximum seated height of 3.5 mm allows for a low-profile and compact design when mounted on a PCB.

Width: 33 mm

The 33 mm width provides a balance between space-saving and accommodating multiple components on a circuit board.

No. of Outputs: 342

With 342 outputs, the FPGA can drive multiple devices and provide diverse output signals.

Length: 33 mm

The 33 mm length ensures a compact form factor that can easily fit into tight spaces on a circuit board.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5AGZME1E2H29C3G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

220000

No. of Inputs:

342

No. of Outputs:

342

No. of CLBs:

8302

Organization:

8302 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.82 V

Maximum Supply Voltage:

.88 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

33 mm

Width:

33 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

5AGZME1E2H29C3G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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