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10AX027E1F29I1HG

Intel

10AX027E1F29I1HG by Intel

Intel's 10AX027E1F29I1HG FPGA boasts 270K logic cells, TSMC tech, and 10162 CLBs. Ideal for industrial applications with -40 to 100°C temp range, it features a grid array package style and 360 inputs/outputs for versatile designs.

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Vyrian

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 346 parts In-Stock

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Ampacity Inc.

Singapore . 574 parts In-Stock

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MARBEL Systems

Belgium . 3,251 parts In-Stock

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Texas Native Microelectronics

USA . 5,302 parts In-Stock

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Kenton Components

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Corohmni

South Africa . 83 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

New Zealand . 2,976 parts In-Stock

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Microchip USA

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Argo Parts USA

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Continental Prestige Electronics

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Qasali Group International

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Corphita

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Vigor

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Aranea Global

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Overview

Unlock endless possibilities with the Intel 10AX027E1F29I1HG Field Programmable Gate Array. Crafted by industry leader Intel, this FPGA boasts unparalleled quality and reliability. Ideal for applications requiring flexibility and customization, this FPGA offers 270,000 logic cells and 10,162 CLBs to bring your innovative ideas to life. With a wide range of inputs and outputs, along with TSMC technology, this product is designed to meet your unique needs. Experience the value and benefits of Intel's cutting-edge technology with the 10AX027E1F29I1HG FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product suitable for a variety of applications.

No. of Logic Cells: 270000

Large number of logic cells allow for complex and high-performance designs to be implemented on the FPGA.

Surface Mount: YES

Surface mount compatibility makes installation and integration of the FPGA easier and more convenient.

Maximum Supply Voltage: 0.98 V

Efficient power consumption and low voltage operation make the product energy-efficient and suitable for battery-powered applications.

Technology Used: TSMC

Utilizing TSMC technology ensures high quality and reliability of the FPGA.

No. of Inputs: 360

Having a large number of inputs allows for versatile connectivity and scalability in designs.

Package Shape: SQUARE

Square package shape facilitates easy PCB layout and routing for efficient design implementation.

Form Of Terminal: BALL

Ball terminals provide secure connections and enhance reliability of the product in various applications.

Nominal Supply Voltage (V): 0.95

Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

No. of Terminals: 780

Having a large number of terminals allows for flexible and reliable connectivity options in different systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for customization and reconfiguration of the FPGA for different applications and use cases.

Package Style (Meter): GRID ARRAY

Grid array package style offers high-density mounting and efficient use of PCB space for compact designs.

Minimum Supply Voltage: 0.92 V

Low minimum supply voltage enables efficient power management and extends the battery life in portable applications.

Maximum Operating Temperature: 100 °C

Wide operating temperature range ensures the FPGA can perform reliably in various environmental conditions.

Pitch Of Terminal: 1 mm

Standard pitch of terminals enables easy integration with existing components and systems.

Organization: 10162 CLBS

Organized into 10162 Configurable Logic Blocks (CLBs) for efficient design implementation and resource utilization.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the FPGA can function in extreme cold environments without performance degradation.

Position Of Terminal: BOTTOM

Bottom terminal position facilitates PCB layout and routing for streamlined design integration.

Maximum Seated Height: 3.35 mm

Low maximum seated height allows for compact and slim product designs with efficient use of space.

Width: 29 mm

Compact width of the FPGA enables space-saving design implementations in various systems and applications.

No. of Outputs: 360

Having a large number of outputs allows for versatile connectivity options and signal routing in complex designs.

Length: 29 mm

Compact length of the FPGA enables space-saving design implementations in various systems and applications.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with temperature fluctuations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10AX027E1F29I1HG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

270000

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

10162

Technology:

TSMC

Organization:

10162 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.92 V

Maximum Supply Voltage:

.98 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.35 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

10AX027E1F29I1HG Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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