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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4VFX20-10FFG672I by Xilinx

XC4VFX20-10FFG672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3 mm;

FPGA

19224

320

320

2136

1028 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC4VFX20-11FFG672C by Xilinx

XC4VFX20-11FFG672C

Xilinx

XC4VFX20-11FFG672C by Xilinx is a FPGA with 19224 logic cells, 2136 CLBs, and 320 inputs/outputs. It operates at max frequency of 1181 MHz and supports CMOS technology. Ideal for applications requiring high-speed processing in compact form factors.

FPGA

19224

320

320

2136

1181 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

XC4VFX20-11FFG672I by Xilinx

XC4VFX20-11FFG672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3 mm;

FPGA

19224

320

320

2136

1181 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

XC4VFX40-10FFG672C by Xilinx

XC4VFX40-10FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

41904

352

352

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

XC4VFX40-10FFG672I by Xilinx

XC4VFX40-10FFG672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

41904

352

352

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC4VFX40-11FFG672C by Xilinx

XC4VFX40-11FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

41904

352

352

4656

1181 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

XC4VFX40-11FFG672I by Xilinx

XC4VFX40-11FFG672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3 mm;

FPGA

41904

352

352

4656

1181 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

XC4VFX60-10FFG672C by Xilinx

XC4VFX60-10FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

352

352

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

XC4VFX60-10FFG672I by Xilinx

XC4VFX60-10FFG672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

56880

352

352

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC4VFX60-11FFG672C by Xilinx

XC4VFX60-11FFG672C

Xilinx

XC4VFX60-11FFG672C by Xilinx is a FPGA with 56880 logic cells, 6320 CLBs, and 352 inputs/outputs. Operating at up to 1181 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

56880

352

352

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

XC4VFX60-11FFG672I by Xilinx

XC4VFX60-11FFG672I

Xilinx

XC4VFX60-11FFG672I by Xilinx is a CMOS FPGA with 56880 logic cells, 6320 CLBs, and 352 inputs/outputs. It operates at a max frequency of 1181 MHz and has a package size of 27mm x 27mm. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

56880

352

352

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-150EA-8FN672I by Lattice Semiconductor

LFE3-150EA-8FN672I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

149000

380

380

500 MHz

0.281 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-35EA-6FN672C by Lattice Semiconductor

LFE3-35EA-6FN672C

Lattice Semiconductor

Lattice Semiconductor's LFE3-35EA-6FN672C FPGA offers 33000 logic cells, 310 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

33000

310

310

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-35EA-6FN672I by Lattice Semiconductor

LFE3-35EA-6FN672I

Lattice Semiconductor

Lattice Semiconductor's LFE3-35EA-6FN672I FPGA offers 33000 logic cells, operates at max 375 MHz clock frequency, and has 310 inputs/outputs. Ideal for industrial applications requiring high-speed processing in a compact form factor with a package style of grid array and a max operating temperature of 100°C.

FPGA

33000

310

310

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-6FN672C by Lattice Semiconductor

LFE3-70EA-6FN672C

Lattice Semiconductor

LFE3-70EA-6FN672C by Lattice Semiconductor is a 67000 logic cell FPGA with a max clock frequency of 375 MHz. It is used for applications requiring high-speed processing and programmable logic capabilities.

FPGA

67000

380

380

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-6FN672I by Lattice Semiconductor

LFE3-70EA-6FN672I

Lattice Semiconductor

Lattice Semiconductor's LFE3-70EA-6FN672I FPGA offers 67000 logic cells, 380 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.

FPGA

67000

380

380

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-7FN672C by Lattice Semiconductor

LFE3-70EA-7FN672C

Lattice Semiconductor

Lattice Semiconductor's LFE3-70EA-7FN672C FPGA offers 67000 logic cells, 380 inputs/outputs, and a max clock frequency of 420 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact package with a grid array style design.

FPGA

67000

380

380

420 MHz

0.335 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-7FN672I by Lattice Semiconductor

LFE3-70EA-7FN672I

Lattice Semiconductor

Lattice Semiconductor's LFE3-70EA-7FN672I FPGA boasts 67000 logic cells, 380 inputs/outputs, and a max clock frequency of 420 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with PLASTIC/EPOXY body material.

FPGA

67000

380

380

420 MHz

0.335 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-8FN672C by Lattice Semiconductor

LFE3-70EA-8FN672C

Lattice Semiconductor

LFE3-70EA-8FN672C by Lattice Semiconductor is a 67000 logic cell FPGA with 380 inputs/outputs, operating at up to 500 MHz. It has a max supply voltage of 1.26V and is used in applications requiring high-speed processing such as telecommunications and industrial automation.

FPGA

67000

380

380

500 MHz

0.281 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-8FN672I by Lattice Semiconductor

LFE3-70EA-8FN672I

Lattice Semiconductor

Lattice Semiconductor's LFE3-70EA-8FN672I FPGA offers 67000 logic cells, 380 inputs/outputs, and a max clock frequency of 500 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

67000

380

380

500 MHz

0.281 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-95EA-6FN672I by Lattice Semiconductor

LFE3-95EA-6FN672I

Lattice Semiconductor

Lattice Semiconductor's LFE3-95EA-6FN672I FPGA offers 92000 logic cells, 380 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.

FPGA

92000

380

380

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

10CX085YF672E5G by Intel

10CX085YF672E5G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YF672E6G by Intel

10CX085YF672E6G

Intel

Intel's 10CX085YF672E6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for applications requiring high-speed processing and complex logic operations in a compact form factor.

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YF672I5G by Intel

10CX085YF672I5G

Intel

Intel's 10CX085YF672I5G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a wide operating temperature range from -40 to 100 °C.

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YF672I6G by Intel

10CX085YF672I6G

Intel

Intel's 10CX085YF672I6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF672E5G by Intel

10CX105YF672E5G

Intel

Intel's 10CX105YF672E5G FPGA boasts 104K logic cells, TSMC technology, and 38000 CLBs. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor. Supports various input/output configurations with a max supply voltage of 0.93V and operating temperature up to 100°C.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF672E6G by Intel

10CX105YF672E6G

Intel

The Intel 10CX105YF672E6G is a FPGA with 104,000 logic cells and 38,000 CLBs. It operates at 0.9V nominal voltage and supports up to 236 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a grid array package style.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF672I5G by Intel

10CX105YF672I5G

Intel

Intel's 10CX105YF672I5G FPGA boasts 104000 logic cells, TSMC technology, and 38000 CLBs. Ideal for industrial applications with a wide operating temperature range of -40 to 100 °C, it offers high flexibility and performance in various electronic systems.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF672I6G by Intel

10CX105YF672I6G

Intel

Intel's 10CX105YF672I6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temp of 100°C, it uses TSMC technology with 0.93V supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX150YF672E5G by Intel

10CX150YF672E5G

Intel

Intel's 10CX150YF672E5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at 0.93V max voltage, it offers TSMC technology with 236 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor.

FPGA

150000

236

236

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX150YF672E6G by Intel

10CX150YF672E6G

Intel

Intel's 10CX150YF672E6G FPGA boasts 150,000 logic cells and 54,770 CLBs. Operating b/w 0-100°C with a supply voltage range of 0.87-0.93V, it offers 236 inputs/outputs for various applications requiring high-performance programmable ICs in a square grid array package.

FPGA

150000

236

236

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX150YF672I5G by Intel

10CX150YF672I5G

Intel

Intel's 10CX150YF672I5G FPGA features 150000 logic cells, TSMC technology, and 54770 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

150000

236

236

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX220YF672E6G by Intel

10CX220YF672E6G

Intel

Intel's 10CX220YF672E6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it has 236 inputs/outputs and uses TSMC technology. Ideal for applications requiring high-speed processing and complex logic functions in industries like telecommunications and aerospace.

FPGA

220000

236

236

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX220YF672I5G by Intel

10CX220YF672I5G

Intel

Intel's 10CX220YF672I5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it features TSMC technology and supports industrial-grade applications. With 236 inputs/outputs and a supply voltage range of 0.87V to 0.93V, this grid array package is ideal for high-performance computing tasks.

FPGA

220000

236

236

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

5AGXBA1D4F27C4G by Intel

5AGXBA1D4F27C4G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: HBGA; Package Shape: SQUARE;

FPGA

75000

416

416

2830

TSMC

2830 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

27 mm

27 mm

2.7 mm

BGA672,26X26,40

Bottom

Ball

1 mm

672

S-PBGA-B672

10AX016E3F27E1HG by Intel

10AX016E3F27E1HG

Intel

Intel's 10AX016E3F27E1HG FPGA features 160,000 logic cells and 6151 CLBs. With TSMC technology, it offers 240 inputs/outputs for versatile applications in industries like telecommunications and automotive. The package style is a grid array with a square shape and plastic/epoxy body material.

FPGA

160000

240

240

6151

TSMC

6151 CLBS

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.35 mm

BGA672,26X26,40

Bottom

Ball

1 mm

672

S-PBGA-B672

5AGXMA3D4F27I5G by Intel

5AGXMA3D4F27I5G

Intel

Intel's 5AGXMA3D4F27I5G FPGA boasts 156K logic cells, TSMC technology, and 416 inputs/outputs. Ideal for industrial applications with a wide operating temperature range of -40 to 100°C. The package features a grid array style with a compact size of 27x27mm and low seated height of 2.7mm.

FPGA

156000

416

416

5890

TSMC

5890 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

27 mm

27 mm

2.7 mm

BGA672,26X26,40

Bottom

Ball

1 mm

672

S-PBGA-B672