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XC4VFX20-11FFG672C

Xilinx

XC4VFX20-11FFG672C by Xilinx

XC4VFX20-11FFG672C by Xilinx is a FPGA with 19224 logic cells, 2136 CLBs, and 320 inputs/outputs. It operates at max frequency of 1181 MHz and supports CMOS technology. Ideal for applications requiring high-speed processing in compact form factors.

Median Price

$539.510

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Mouser Electronics

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Digiode

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Modulus Dynamics

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Kenton Components

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Overview

Unlock endless possibilities with the XC4VFX20-11FFG672C by Xilinx, a top-tier manufacturer of cutting-edge Field Programmable Gate Arrays (FPGAs). Dive into a world of innovation with 19224 logic cells, 2136 CLBs, and 320 inputs/outputs - all in a compact grid array package. Whether you're designing advanced electronics, aerospace systems, or cutting-edge AI solutions, this FPGA delivers unparalleled performance and flexibility. Elevate your projects with Xilinx's superior quality, reliability, and industry-leading technology. Experience the power of customizable ICs and push the boundaries of what's possible.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

No. of Logic Cells: 19224

With a high number of logic cells, this FPGA can handle complex designs and processing tasks efficiently.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into electronic circuits.

Maximum Supply Voltage: 1.26 V

Efficient power management with a relatively low maximum supply voltage.

No. of CLBs: 2136

Abundance of Configurable Logic Blocks (CLBs) enables flexible and versatile programming possibilities.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

No. of Inputs: 320

A high number of inputs allow for multiple data sources to be processed simultaneously.

Package Shape: SQUARE

Square shape enables efficient use of space on PCBs and simplifies layout designs.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and ease of soldering during assembly.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent performance of the FPGA.

No. of Terminals: 672

A higher number of terminals offer more connectivity options for external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for customization and adaptation to different applications.

Package Style (Meter): GRID ARRAY

Grid array packaging facilitates easy mounting and rework, making it convenient for production and maintenance.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures efficient power utilization and extended battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable performance in harsh environmental conditions.

Pitch Of Terminal: 1 mm

A smaller terminal pitch enables higher pin density and more compact circuit designs.

Organization: 2136 CLBS

Well-organized CLBs offer structured logic implementation for better design scalability and optimization.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures ensures reliable functionality in various operational environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing enhances terminal conductivity and durability.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB routing and layout, optimizing signal integrity.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 ensures minimal risk of moisture-induced damage during storage and handling.

Maximum Seated Height: 3 mm

Low seated height facilitates compact device designs and allows for efficient heat dissipation.

Width: 27 mm

Moderate width enables easy integration into various system configurations with space constraints.

Maximum Clock Frequency: 1181 MHz

High maximum clock frequency supports fast processing speeds and real-time performance in demanding applications.

No. of Outputs: 320

A high number of outputs provide ample data transmission channels for efficient communication with external components.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature ensures safe and reliable soldering during assembly processes.

Peak Reflow Temperature °C: 250

High peak reflow temperature allows for secure and durable solder connections for long-term reliability.

Length: 27 mm

Moderate length ensures compatibility with standard PCB sizes and facilitates optimal board layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC4VFX20-11FFG672C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

19224

No. of Inputs:

320

No. of Outputs:

320

No. of CLBs:

2136

Maximum Clock Frequency:

1181 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2136 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC4VFX20-11FFG672C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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