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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LFE3-70EA-6LFN672C by Lattice Semiconductor

LFE3-70EA-6LFN672C

Lattice Semiconductor

LFE3-70EA-6LFN672C by Lattice Semiconductor is a 67000 logic cell FPGA with 380 inputs/outputs, operating at a max frequency of 375 MHz. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

67000

380

380

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-6LFN672I by Lattice Semiconductor

LFE3-70EA-6LFN672I

Lattice Semiconductor

Lattice Semiconductor's LFE3-70EA-6LFN672I FPGA features 67000 logic cells, 380 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact grid array package with plastic/epoxy body material.

FPGA

67000

380

380

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-7LFN672I by Lattice Semiconductor

LFE3-70EA-7LFN672I

Lattice Semiconductor

LFE3-70EA-7LFN672I by Lattice Semiconductor is a 67000 logic cell FPGA with 380 inputs/outputs, operating at up to 420 MHz. It features a max supply voltage of 1.26V and is suitable for applications requiring high-speed processing in fields like telecommunications and industrial automation.

FPGA

67000

380

380

420 MHz

0.335 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-8LFN672I by Lattice Semiconductor

LFE3-70EA-8LFN672I

Lattice Semiconductor

LFE3-70EA-8LFN672I by Lattice Semiconductor is a 67000 logic cell FPGA with 380 inputs/outputs, operating at up to 500 MHz. It features a max supply voltage of 1.26V and can withstand temperatures from -40 to 100°C. Ideal for high-speed applications requiring programmable ICs in compact designs.

FPGA

67000

380

380

500 MHz

0.281 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-9FN672C by Lattice Semiconductor

LFE3-70EA-9FN672C

Lattice Semiconductor

Lattice Semiconductor's LFE3-70EA-9FN672C FPGA offers 67000 logic cells, operates at a max frequency of 500 MHz, and has 380 inputs/outputs. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs.

FPGA

67000

380

380

500 MHz

0.252 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE3-70EA-9FN672I by Lattice Semiconductor

LFE3-70EA-9FN672I

Lattice Semiconductor

LFE3-70EA-9FN672I by Lattice Semiconductor is a 67000 logic cell FPGA with 380 inputs/outputs, operating at max frequency of 500 MHz. Ideal for applications requiring high-speed processing and complex logic functions in industrial automation, telecommunications, and aerospace industries.

FPGA

67000

380

380

500 MHz

0.252 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE2-20E-6FN672C by Lattice Semiconductor

LFE2-20E-6FN672C

Lattice Semiconductor

LFE2-20E-6FN672C by Lattice Semiconductor is a 20000 Logic Cells FPGA with 2625 CLBs and 402 Inputs/Outputs. Operating at 1.2V, it offers a max clock frequency of 357MHz. Ideal for applications requiring high-speed processing in compact designs.

FPGA

20000

402

402

2625

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE2-20SE-7FN672C by Lattice Semiconductor

LFE2-20SE-7FN672C

Lattice Semiconductor

LFE2-20SE-7FN672C by Lattice Semiconductor is a 20000 Logic Cells FPGA with 2625 CLBs and 402 Inputs/Outputs. Operating at 420 MHz, it's ideal for high-speed applications requiring low power consumption in a compact GRID ARRAY package.

FPGA

20000

402

402

2625

420 MHz

0.304 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE2-70E-5FN672C by Lattice Semiconductor

LFE2-70E-5FN672C

Lattice Semiconductor

Lattice Semiconductor's LFE2-70E-5FN672C FPGA boasts 70000 logic cells, 8500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.

FPGA

70000

500

500

8500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE2-70E-7FN672C by Lattice Semiconductor

LFE2-70E-7FN672C

Lattice Semiconductor

LFE2-70E-7FN672C by Lattice Semiconductor is a 70000 logic cell FPGA with 8500 CLBs, 500 inputs/outputs, and max clock frequency of 420 MHz. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.

FPGA

70000

500

500

8500

420 MHz

0.304 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE2-70SE-5FN672C by Lattice Semiconductor

LFE2-70SE-5FN672C

Lattice Semiconductor

LFE2-70SE-5FN672C by Lattice Semiconductor is a 70000 logic cell FPGA with 8500 CLBs and 500 inputs/outputs. Operating at 1.2V, it offers a max clock frequency of 311MHz. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.

FPGA

70000

500

500

8500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE2-70SE-5FN672I by Lattice Semiconductor

LFE2-70SE-5FN672I

Lattice Semiconductor

LFE2-70SE-5FN672I by Lattice Semiconductor is a 70000 logic cell FPGA with 8500 CLBs, 500 inputs/outputs, and max clock frequency of 311 MHz. Ideal for industrial applications due to its low combinatorial delay, operating temp range of -40 to 85 °C, and MSL level of 3.

FPGA

70000

500

500

8500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE2M35E-5FN672C by Lattice Semiconductor

LFE2M35E-5FN672C

Lattice Semiconductor

LFE2M35E-5FN672C by Lattice Semiconductor is a 35000 logic cell FPGA with 4250 CLBs and 410 inputs/outputs. Operating at 1.2V, it offers a max clock frequency of 311MHz. Ideal for applications requiring high-speed processing in compact designs.

FPGA

35000

410

410

4250

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFXP2-40E-5FN672C by Lattice Semiconductor

LFXP2-40E-5FN672C

Lattice Semiconductor

LFXP2-40E-5FN672C by Lattice Semiconductor is a 40000 logic cell FPGA with 5000 CLBs, operating at max 435 MHz. It features CMOS technology, 540 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.

FPGA

40000

540

540

5000

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

XC2VP2-6FF672C by Xilinx

XC2VP2-6FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

3168

204

204

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP2-6FF672I by Xilinx

XC2VP2-6FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

3168

204

204

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP4-6FF672C by Xilinx

XC2VP4-6FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

6768

348

348

752

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP4-6FF672I by Xilinx

XC2VP4-6FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Organization: 752 CLBS;

FPGA

6768

348

348

752

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP7-6FF672C by Xilinx

XC2VP7-6FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP7-6FF672I by Xilinx

XC2VP7-6FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.5;

FPGA

11088

396

396

1232

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP7-7FF672C by Xilinx

XC2VP7-7FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP2-5FF672C by Xilinx

XC2VP2-5FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

3168

204

204

352

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP4-5FF672C by Xilinx

XC2VP4-5FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

6768

348

348

752

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP4-5FF672I by Xilinx

XC2VP4-5FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

6768

348

348

752

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP7-5FF672C by Xilinx

XC2VP7-5FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP7-5FF672I by Xilinx

XC2VP7-5FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 396;

FPGA

11088

396

396

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC4VFX20-10FF672C by Xilinx

XC4VFX20-10FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

19224

320

320

2136

1028 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX20-10FF672I by Xilinx

XC4VFX20-10FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

19224

320

320

2136

1028 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX20-11FF672C by Xilinx

XC4VFX20-11FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

19224

320

320

2136

1181 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX20-11FF672I by Xilinx

XC4VFX20-11FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

19224

320

320

2136

1181 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX40-10FF672C by Xilinx

XC4VFX40-10FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

41904

352

352

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX40-10FF672I by Xilinx

XC4VFX40-10FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

41904

352

352

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-10FF672C by Xilinx

XC4VFX60-10FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

352

352

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-10FF672I by Xilinx

XC4VFX60-10FF672I

Xilinx

XC4VFX60-10FF672I by Xilinx is a FPGA with 56880 logic cells, 6320 CLBs, and 352 inputs/outputs. It operates at max frequency of 1028 MHz and supports industrial temperature range. Ideal for high-performance applications requiring fast processing speeds in compact designs.

FPGA

56880

352

352

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-11FF672C by Xilinx

XC4VFX60-11FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

352

352

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-11FF672I by Xilinx

XC4VFX60-11FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 56880;

FPGA

56880

352

352

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC2VP2-5FFG672C by Xilinx

XC2VP2-5FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

3168

204

204

352

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP2-6FFG672C by Xilinx

XC2VP2-6FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

3168

204

204

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP2-6FFG672I by Xilinx

XC2VP2-6FFG672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.5;

FPGA

3168

204

204

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP4-5FFG672C by Xilinx

XC2VP4-5FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

6768

348

348

752

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP4-6FFG672C by Xilinx

XC2VP4-6FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

6768

348

348

752

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP4-6FFG672I by Xilinx

XC2VP4-6FFG672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

6768

348

348

752

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP7-5FFG672C by Xilinx

XC2VP7-5FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP7-5FFG672I by Xilinx

XC2VP7-5FFG672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

11088

396

396

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP7-6FFG672C by Xilinx

XC2VP7-6FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP7-6FFG672I by Xilinx

XC2VP7-6FFG672I

Xilinx

The Xilinx XC2VP7-6FFG672I is a FPGA with 11088 logic cells, 1232 CLBs, and max clock frequency of 1200 MHz. It uses CMOS technology and has 396 inputs/outputs. Ideal for high-speed applications requiring programmable ICs in compact form factors.

FPGA

11088

396

396

1232

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC2VP7-7FFG672C by Xilinx

XC2VP7-7FFG672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

672

S-PBGA-B672

e1

No

XC4VFX20-10FFG672C by Xilinx

XC4VFX20-10FFG672C

Xilinx

XC4VFX20-10FFG672C by Xilinx is a FPGA with 19224 logic cells, 2136 CLBs, and 320 inputs/outputs. It operates at 1.14-1.26 V, has a clock frequency of 1028 MHz, and can withstand temperatures from 0 to 85°C. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

19224

320

320

2136

1028 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No