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LFE3-70EA-9FN672C

Lattice Semiconductor

LFE3-70EA-9FN672C by Lattice Semiconductor

Lattice Semiconductor's LFE3-70EA-9FN672C FPGA offers 67000 logic cells, operates at a max frequency of 500 MHz, and has 380 inputs/outputs. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs.

Median Price

$135.651

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$135.651

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Vyrian

USA . 489 parts In-Stock

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489

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,417 parts In-Stock

1+ parts

$11.000

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AZTECH Wire

Italy . 594 parts In-Stock

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$13.055

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Vigor

Singapore . 4,600 parts In-Stock

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$89.590

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Aranea Global

USA . 500 parts In-Stock

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$132.938

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$127.620

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$132.938

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$127.620

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Microchip USA

USA . 1,827 parts In-Stock

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$136.151

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Overview

Transform your projects with the LFE3-70EA-9FN672C from Lattice Semiconductor. This cutting-edge Field Programmable Gate Array offers unmatched quality and reliability, backed by a trusted manufacturer. With 67000 logic cells and a maximum clock frequency of 500 MHz, this FPGA is perfect for a wide range of applications. Whether you're designing IoT devices or high-performance computing systems, the LFE3-70EA-9FN672C delivers the value, benefits, and advantages you need to take your projects to the next level. Experience the power of customizable solutions with Lattice Semiconductor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

No. of Logic Cells: 67000

Large number of logic cells provide flexibility and scalability for complex design implementations.

Surface Mount: YES

Surface mount feature allows for easy integration onto PCBs, saving space and enabling high-density designs.

Maximum Supply Voltage: 1.26 V

Higher maximum supply voltage tolerance offers stability and reliability in operation.

No. of Inputs: 380

Abundance of inputs allows for versatile connectivity options and input processing capabilities.

Package Shape: SQUARE

Square package shape simplifies PCB layout and component placement, optimizing space utilization.

Form Of Terminal: BALL

Ball terminal design aids in easy soldering and mounting, ensuring secure connections.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage enables consistent performance and efficient power management.

Power Supplies (V): 1.2

Well-matched power supplies support reliable operation and consistent functionality.

No. of Terminals: 672

High number of terminals provide extensive I/O options for versatile interfacing and communication.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field programmable gate array allows for customization and reconfiguration of logic functions, offering flexibility in design.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates easy mounting and soldering, enhancing manufacturing efficiency.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage requirement promotes energy efficiency and power savings.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in demanding environmental conditions.

Pitch Of Terminal: 1 mm

Narrow terminal pitch enables compact design and efficient use of PCB real estate.

Maximum Combinatorial Delay of a CLB: 0.252 ns

Low combinatorial delay in configurable logic blocks allows for high-speed processing and reduced latency.

Minimum Operating Temperature: 0 °C

Wide operating temperature range ensures functionality in varying temperature environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Triple finishing of terminals enhances conductivity, prevents corrosion, and ensures reliable connections.

Position Of Terminal: BOTTOM

Bottom terminal configuration simplifies PCB routing and layout, improving signal integrity and ease of design.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates robustness against moisture exposure during manufacturing and handling processes.

Maximum Seated Height: 2.6 mm

Low seated height profile enables slim and compact device designs, enhancing overall system aesthetics and space efficiency.

Width: 27 mm

Optimal width measurement enables compatibility with standard PCB dimensions and facilitates integration into various electronic systems.

Maximum Clock Frequency: 500 MHz

High maximum clock frequency supports rapid data processing and high-speed operations in real-time applications.

No. of Outputs: 380

Abundance of outputs allows for versatile signal routing and outputting capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures thorough and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance enables efficient soldering and robust solder joints for reliable connections.

Length: 27 mm

Optimal length measurement enables compatibility with standard PCB dimensions and facilitates integration into various electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFE3-70EA-9FN672C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

67000

No. of Inputs:

380

No. of Outputs:

380

Maximum Clock Frequency:

500 MHz

CLB Maximum Delay:

0.252 ns

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFE3-70EA-9FN672C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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