Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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LFE3-70EA-6FN672C by Lattice Semiconductor is a 67000 logic cell FPGA with a max clock frequency of 375 MHz. It is used for applications requiring high-speed processing and programmable logic capabilities.
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A-Z Elektronik GmbH
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Emar International I/E
ChipstoGo Electronic ltd
Perfect Parts
The use of plastic/epoxy material for the package body ensures durability and cost-effectiveness, making this FPGA a reliable choice for various applications.
With a large number of logic cells, this FPGA allows for complex designs and efficient system integration, providing flexibility and versatility in operations.
The surface mount capability of this FPGA facilitates easier PCB assembly and reduces the overall footprint, making it suitable for space-constrained applications.
The high maximum supply voltage of 1.26 V allows for efficient power management and supports different power supply configurations, ensuring reliable performance in diverse environments.
The abundance of inputs allows for a high level of data connectivity, enabling seamless integration with various external devices and ensuring enhanced functionality.
The square package shape enhances ease of installation and compatibility with standard board layouts, making this FPGA convenient to integrate into existing systems.
The ball form of terminals enables reliable connections and improves thermal performance, ensuring stable and efficient signal transmission for optimal FPGA operation.
The nominal supply voltage of 1.2 V ensures low power consumption and heat dissipation, making this FPGA an energy-efficient choice for power-sensitive applications.
The availability of multiple power supplies at 1.2 V enhances component flexibility and supports complex power management requirements, enabling effective optimization of system performance.
The abundance of terminals allows for efficient signal routing and enhanced connectivity options, enabling seamless integration with multiple peripheral devices and ensuring robust system integration.
Being a field programmable gate array (FPGA), this product offers customizable and reprogrammable logic functionality, providing adaptability and flexibility for various application needs.
The grid array package style ensures reliable signal integrity, improved thermal dissipation, and easy soldering, making this FPGA suitable for high-performance and demanding applications.
The low minimum supply voltage of 1.14 V allows for reduced power consumption while maintaining stable operation, ensuring energy efficiency and prolonged battery life in portable devices.
The high maximum operating temperature of 85°C enables reliable operation in harsh environments, guaranteeing the FPGA's performance in demanding industrial applications.
The small terminal pitch of 1 mm allows for compact integration and layout flexibility, facilitating miniaturization and providing space-saving advantages in electronic designs.
The low maximum combinatorial delay of 0.379 ns ensures fast signal processing, reducing latency and enabling real-time operations, making this FPGA ideal for high-performance applications.
The low minimum operating temperature of 0°C ensures reliable functionality even in cold environments, guaranteeing the FPGA's performance in a wide range of operating conditions.
The use of tin-silver-copper finishing on the terminals enhances conductivity, corrosion resistance, and solderability, ensuring reliable connections and longevity of the FPGA.
The terminal's bottom-mounted position simplifies PCB design, soldering, and inspection processes, making this FPGA convenient for manufacturing and assembly procedures.
With an MSL of 3, this FPGA can withstand occasional exposure to moisture without compromising its performance, ensuring reliability and functionality in various environments.
The low maximum seated height of 2.6 mm facilitates compact and space-efficient designs, making this FPGA suitable for applications with strict mechanical constraints.
The compact width of 27 mm allows for easy integration into PCB layouts, providing design flexibility and compatibility with standard board dimensions.
The high maximum clock frequency of 375 MHz enables rapid data processing and execution of complex algorithms, ensuring high-speed performance and responsiveness.
The availability of a large number of outputs allows for extensive signal distribution and connectivity options, facilitating seamless integration with multiple external devices and enhancing system functionality.
The maximum time of 30 seconds at peak reflow temperature ensures efficient soldering and reliable joint formation, optimizing the manufacturing process and minimizing assembly errors.
With a peak reflow temperature of 250°C, this FPGA can withstand high-temperature soldering processes, ensuring reliable and robust solder joints for long-term operational stability.
The compact length of 27 mm allows for space-efficient integration into PCB layouts, providing design flexibility and compatibility with standard board dimensions.
Field Programmable Gate Arrays (FPGA) LFE3-70EA-6FN672C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor
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LFE3-70EA-6FN672C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Multiple Devices Cu Wire 01/Jul/2013
PCN Assembly/Origin - Alternate Assembly/Test Site 14/Apr/2014
PCN Packaging - All Dev Pkg Mark Chg 12/Nov/2018
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
STM32F405RGT6
STMicroelectronics
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
1N4148
Nte Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
L7805CV
L7805CV by STMicroelectronics is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation in electronic circuits.
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138W-7-F
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
XC7S15-1CSGA225I
Xilinx
Xilinx XC7S15-1CSGA225I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.
LCMXO2-2000HC-4BG256C
Lattice Semiconductor
LCMXO2-2000HC-4BG256C by Lattice Semiconductor is a FPGA with 2112 logic cells, 206 inputs/outputs, and max clock frequency of 133 MHz. It operates at 2.375-3.465 V, suitable for applications requiring high-speed processing in industrial automation and telecommunications sectors.
LCMXO2-1200ZE-1TG100I
LCMXO2-1200ZE-1TG100I by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. Operating temp range -40 to 100 °C, package style flatpack. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.
A3P600-PQG208I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC7K325T-2FFG900I
The Xilinx XC7K325T-2FFG900I is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex designs. With a package style of grid array and CMOS technology, it offers versatile solutions for various electronic systems.
10M08SAU169A7G
Intel
Intel's 10M08SAU169A7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for automotive applications requiring high performance in a compact form factor. The device operates b/w -40 to 125°C and offers a grid array package style with 0.8mm terminal pitch.
M2GL010T-FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
10M02SCU169C8G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
XC7A15T-2CSG325I
Xilinx XC7A15T-2CSG325I FPGA features 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing with a wide operating temperature range from -40 to 100°C. Package style is grid array with low profile and fine pitch terminals.
LFE5U-45F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
EP3C5E144C8N
EP3C5E144C8N by Altera is a CMOS FPGA with 5136 logic cells and 94 inputs/outputs. It operates at a maximum clock frequency of 472.5 MHz and has a low profile package shape. Ideal for various applications.
M2GL025TS-1FGG484I
Microchip Technology
M2GL025TS-1FGG484I by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and comes in a square grid array package suitable for industrial applications.
ICE5LP4K-SG48ITR
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
XCKU035-2FBVA900I
Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.
10M04SAU169I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
EP4CE6F17C7N
EP4CE6F17C7N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and digital signal processing.
A3P1000-PQG208
A3P1000-PQG208 by Microchip Technology is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max clock frequency of 350 MHz, suitable for applications requiring high-speed processing. With a package style of flatpack, fine pitch, it is ideal for commercial use in various electronic systems.
A3P250-FGG256I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
10M40DAF256I7G
Intel's 10M40DAF256I7G FPGA features 40000 logic cells, 2500 CLBs, and 500 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C and a min of -40°C. The package style is grid array with a square shape and ball terminals.
10AX016C3U19E2LG
Intel's 10AX016C3U19E2LG FPGA boasts 160,000 logic cells and 6151 CLBs. Operating at 0.93V max supply voltage, it offers 240 inputs/outputs for versatile applications in TSMC technology. With a compact square package style and fine pitch grid array, it suits various projects requiring high-performance programmable ICs.
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LFE3-17EA-6LMG328I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
LFE3-17EA-6FTN256I
LFE3-17EA-6FTN256I by Lattice Semiconductor is a 17000 logic cell FPGA with 133 inputs/outputs, operating at max frequency of 375 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor.
LFE3-17EA-6FN484C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LFE3-17EA-6FN484I
LFE3-35EA-6FN484C
LFE3-35EA-6FTN256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LFE3-17EA-6FTN256C
Lattice Semiconductor's LFE3-17EA-6FTN256C FPGA features 17000 logic cells, 133 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact square package with low profile grid array style.
LFE3-35EA-7FN484C
LFE3-35EA-7FN484C by Lattice Semiconductor is a 33000 logic cell FPGA with 295 inputs/outputs, operating at 420 MHz. Ideal for applications requiring high-speed processing in compact designs due to its small form factor and low power consumption.
LFE3-35EA-8FN484I
LFE3-70EA-8FN484C
LFE3-17EA-8MG328C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE;
LFE3-95EA-6FN672I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .379 ns;
LFE3-17EA-8LMG328I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 328; Package Code: LFBGA; Package Shape: SQUARE; Pitch Of Terminal: .5 mm;
LFE3-17EA-8FTN256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LFE3-35EA-6FTN256I
LFE3-70EA-7FN484C
LFE3-70EA-7FN484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 67000;
LFE3-150EA-7FN1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
LFE3-150EA-8FN672I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
LFE3-35EA-6FN672C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
Supply Digital Components
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