Loading...

LFE3-70EA-6FN672C

Lattice Semiconductor

LFE3-70EA-6FN672C by Lattice Semiconductor

LFE3-70EA-6FN672C by Lattice Semiconductor is a 67000 logic cell FPGA with a max clock frequency of 375 MHz. It is used for applications requiring high-speed processing and programmable logic capabilities.

Median Price

$115.500

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 10 parts In-Stock

1+ parts

-

100+ parts

$115.500

1k+ parts

-

10k+ parts

-

10

-

$115.500

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 8 parts In-Stock

1+ parts

$94.025

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$94.025

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$101.755

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$101.755

-

-

-

Vyrian

USA . 8,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,448

-

-

-

-

Chip Stock

USA . 292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

292

-

-

-

-

Lantek

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Dan-Mar Components

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 352 parts In-Stock

1+ parts

$13.119

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$13.119

-

-

-

Vigor

Singapore . 7,401 parts In-Stock

1+ parts

$67.850

100+ parts

-

1k+ parts

-

10k+ parts

-

7,401

$67.850

-

-

-

Ampacity Inc.

Singapore . 20 parts In-Stock

1+ parts

$98.170

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$98.170

-

-

-

Microchip USA

USA . 1,140 parts In-Stock

1+ parts

$101.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$101.750

-

-

-

Argo Parts USA

USA . 4,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,198

-

-

-

-

Continental Prestige Electronics

USA . 3,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,975

-

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$99.720

1k+ parts

$96.667

10k+ parts

$94.632

500

-

$99.720

$96.667

$94.632

A-Z Elektronik GmbH

Germany . 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

210

-

-

-

-

GreenTree Electronics

Israel . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Emar International I/E

Canada . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

ChipstoGo Electronic ltd

UK . 36 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36

-

-

-

-

Perfect Parts

USA . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Overview

Discover the power of the LFE3-70EA-6FN672C by Lattice Semiconductor, a high-quality Field Programmable Gate Array (FPGA) that takes your applications to the next level. With 67000 logic cells and 380 inputs and outputs, this FPGA offers unparalleled flexibility and performance. Its innovative design and reliable manufacturing by Lattice Semiconductor ensure top-notch quality and reliability. Whether you are working on telecommunications, automotive, or industrial projects, the LFE3-70EA-6FN672C delivers unmatched value, benefits, and advantages. Unlock endless possibilities and achieve exceptional results with this cutting-edge FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and cost-effectiveness, making this FPGA a reliable choice for various applications.

No. of Logic Cells: 67000

With a large number of logic cells, this FPGA allows for complex designs and efficient system integration, providing flexibility and versatility in operations.

Surface Mount: YES

The surface mount capability of this FPGA facilitates easier PCB assembly and reduces the overall footprint, making it suitable for space-constrained applications.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage of 1.26 V allows for efficient power management and supports different power supply configurations, ensuring reliable performance in diverse environments.

No. of Inputs: 380

The abundance of inputs allows for a high level of data connectivity, enabling seamless integration with various external devices and ensuring enhanced functionality.

Package Shape: SQUARE

The square package shape enhances ease of installation and compatibility with standard board layouts, making this FPGA convenient to integrate into existing systems.

Form Of Terminal: BALL

The ball form of terminals enables reliable connections and improves thermal performance, ensuring stable and efficient signal transmission for optimal FPGA operation.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V ensures low power consumption and heat dissipation, making this FPGA an energy-efficient choice for power-sensitive applications.

Power Supplies (V): 1.2

The availability of multiple power supplies at 1.2 V enhances component flexibility and supports complex power management requirements, enabling effective optimization of system performance.

No. of Terminals: 672

The abundance of terminals allows for efficient signal routing and enhanced connectivity options, enabling seamless integration with multiple peripheral devices and ensuring robust system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array (FPGA), this product offers customizable and reprogrammable logic functionality, providing adaptability and flexibility for various application needs.

Package Style (Meter): GRID ARRAY

The grid array package style ensures reliable signal integrity, improved thermal dissipation, and easy soldering, making this FPGA suitable for high-performance and demanding applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14 V allows for reduced power consumption while maintaining stable operation, ensuring energy efficiency and prolonged battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C enables reliable operation in harsh environments, guaranteeing the FPGA's performance in demanding industrial applications.

Pitch Of Terminal: 1 mm

The small terminal pitch of 1 mm allows for compact integration and layout flexibility, facilitating miniaturization and providing space-saving advantages in electronic designs.

Maximum Combinatorial Delay of a CLB: 0.379 ns

The low maximum combinatorial delay of 0.379 ns ensures fast signal processing, reducing latency and enabling real-time operations, making this FPGA ideal for high-performance applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable functionality even in cold environments, guaranteeing the FPGA's performance in a wide range of operating conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin-silver-copper finishing on the terminals enhances conductivity, corrosion resistance, and solderability, ensuring reliable connections and longevity of the FPGA.

Position Of Terminal: BOTTOM

The terminal's bottom-mounted position simplifies PCB design, soldering, and inspection processes, making this FPGA convenient for manufacturing and assembly procedures.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FPGA can withstand occasional exposure to moisture without compromising its performance, ensuring reliability and functionality in various environments.

Maximum Seated Height: 2.6 mm

The low maximum seated height of 2.6 mm facilitates compact and space-efficient designs, making this FPGA suitable for applications with strict mechanical constraints.

Width: 27 mm

The compact width of 27 mm allows for easy integration into PCB layouts, providing design flexibility and compatibility with standard board dimensions.

Maximum Clock Frequency: 375 MHz

The high maximum clock frequency of 375 MHz enables rapid data processing and execution of complex algorithms, ensuring high-speed performance and responsiveness.

No. of Outputs: 380

The availability of a large number of outputs allows for extensive signal distribution and connectivity options, facilitating seamless integration with multiple external devices and enhancing system functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures efficient soldering and reliable joint formation, optimizing the manufacturing process and minimizing assembly errors.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this FPGA can withstand high-temperature soldering processes, ensuring reliable and robust solder joints for long-term operational stability.

Length: 27 mm

The compact length of 27 mm allows for space-efficient integration into PCB layouts, providing design flexibility and compatibility with standard board dimensions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFE3-70EA-6FN672C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

67000

No. of Inputs:

380

No. of Outputs:

380

Maximum Clock Frequency:

375 MHz

CLB Maximum Delay:

0.379 ns

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFE3-70EA-6FN672C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20