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XC2VP7-6FFG672I

Xilinx

XC2VP7-6FFG672I by Xilinx

The Xilinx XC2VP7-6FFG672I is a FPGA with 11088 logic cells, 1232 CLBs, and max clock frequency of 1200 MHz. It uses CMOS technology and has 396 inputs/outputs. Ideal for high-speed applications requiring programmable ICs in compact form factors.

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AZTECH Wire

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Overview

Unlock the limitless potential of your projects with the Xilinx XC2VP7-6FFG672I FPGA. As a leading manufacturer in the industry, Xilinx delivers top-quality products designed to meet your unique needs. With over 11,000 logic cells and a maximum clock frequency of 1200 MHz, this FPGA offers unmatched performance and reliability. Whether you're working on telecommunications, automotive, or industrial applications, the XC2VP7-6FFG672I provides the flexibility and power you need to bring your ideas to life. Experience the difference with Xilinx today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, suitable for various applications.

No. of Logic Cells: 11088

With a high number of logic cells, this FPGA provides ample room for complex designs and calculations.

Surface Mount: YES

Being surface mountable, this FPGA can be easily integrated into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.575 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making this FPGA energy-efficient.

No. of CLBs: 1232

The high number of Configurable Logic Blocks (CLBs) allows for flexible and customized configurations, catering to a wide range of requirements.

Technology Used: CMOS

The use of CMOS technology ensures low power consumption, high noise immunity, and reliable performance in this FPGA.

No. of Inputs: 396

With a large number of inputs, this FPGA can interface with multiple external devices, expanding its versatility and functionality.

Package Shape: SQUARE

The square shape of the package facilitates easy placement and routing, optimizing the layout of the FPGA on the PCB.

Nominal Supply Voltage (V): 1.5

The standard nominal supply voltage of 1.5V ensures compatibility with common power sources, simplifying integration into existing systems.

Power Supplies (V): 1.5,1.5/3.3,2/2.5,2.5

The availability of multiple power supply options allows for flexibility in voltage selection, accommodating different system requirements.

No. of Terminals: 672

The abundant terminals provide ample connectivity options for interfacing with other components, enhancing the versatility of this FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA offers flexibility for reconfiguration and customization, making it adaptable to changing project needs.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact footprint and efficient signal routing, enhancing the performance and reliability of this FPGA.

Minimum Supply Voltage: 1.425 V

The low minimum supply voltage ensures stable operation and improved energy efficiency, making this FPGA suitable for low-power applications.

Pitch Of Terminal: 1 mm

The small pitch of terminals enables high-density mounting, allowing for more components to be packed closely together on the PCB.

Maximum Combinatorial Delay of a CLB: 0.32 ns

The low maximum combinatorial delay of a Configurable Logic Block ensures fast signal processing and high-speed operation in this FPGA.

Organization: 1232 CLBS

The organized structure of 1232 CLBs simplifies the design process and enables efficient utilization of resources in this FPGA.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

The use of tin/silver/copper finishing on terminals provides excellent conductivity and corrosion resistance, ensuring reliable connections in this FPGA.

Position Of Terminal: BOTTOM

The bottom position of the terminals facilitates easy access and soldering during assembly, streamlining the manufacturing process.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that this FPGA has a moderate level of moisture sensitivity, requiring standard handling and storage practices to prevent damage.

Maximum Seated Height: 2.65 mm

With a low maximum seated height, this FPGA is suitable for compact designs where space is limited, offering flexibility in form factor.

Width: 27 mm

The narrow width of this FPGA allows for efficient use of PCB real estate, enabling dense and space-saving circuit layouts.

Maximum Clock Frequency: 1200 MHz

The high maximum clock frequency enables rapid data processing and real-time signal handling, making this FPGA suitable for high-performance applications.

No. of Outputs: 396

The ample number of outputs provides multiple data transmission channels, enhancing the versatility and connectivity of this FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable solder joints and proper component mounting during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C indicates the robustness and durability of this FPGA during soldering processes.

Length: 27 mm

The compact length of this FPGA contributes to a smaller footprint on the PCB, allowing for efficient use of space in electronic designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC2VP7-6FFG672I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

11088

No. of Inputs:

396

No. of Outputs:

396

No. of CLBs:

1232

Maximum Clock Frequency:

1200 MHz

CLB Maximum Delay:

0.32 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1232 CLBS

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies:

1.5,1.5/3.3,2/2.5,2.5 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.65 mm

Package Equivalence Code:

BGA672,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Pitch:

1 mm

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC2VP7-6FFG672I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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