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SQUARE Multi-functional Peripherals 196

Multi-functional Peripherals
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MIMX8MQ6CVAHZAB by NXP Semiconductors

MIMX8MQ6CVAHZAB

NXP Semiconductors

The NXP Semiconductors MIMX8MQ6CVAHZAB is a multi-functional peripheral IC with 621 terminals, 81920 RAM words, and a max clock frequency of 40 MHz. It is ideal for industrial applications requiring Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB bus compatibility in a compact square package with a terminal pitch of 0.65 mm.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

e2

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

DRA767PSGACDQ1 by Texas Instruments

DRA767PSGACDQ1

Texas Instruments

DRA767PSGACDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 38.4 MHz. Ideal for automotive applications due to AEC-Q100 screening level and CAN, Ethernet, I2C, SPI, UART, USB bus compatibility.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA767PSGACDRQ1 by Texas Instruments

DRA767PSGACDRQ1

Texas Instruments

DRA767PSGACDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width and 64-bit external data bus width. It operates at a max clock frequency of 38.4 MHz, making it suitable for automotive applications requiring high-speed processing. With a package style of grid array and low profile, this device offers 2.5M RAM words and compatibility with CAN, Ethernet, I2C, SPI, UART, and USB interfaces.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA767PSIGACDQ1 by Texas Instruments

DRA767PSIGACDQ1

Texas Instruments

DRA767PSIGACDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width and 64-bit external data bus width. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and supports various bus compatibilities like CAN, Ethernet, I2C, SPI, UART, and USB. With a max clock frequency of 38.4 MHz, this device features a grid array package style with low profile and fine pitch terminals.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA767PSIGACDRQ1 by Texas Instruments

DRA767PSIGACDRQ1

Texas Instruments

DRA767PSIGACDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 38.4 MHz. Ideal for automotive applications, it features a low profile grid array package style with 784 terminals and operates in temperatures ranging from -40 to 125°C.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA770PJGACDQ1 by Texas Instruments

DRA770PJGACDQ1

Texas Instruments

DRA770PJGACDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width and 64-bit external data bus width. It operates at a max clock frequency of 38.4 MHz, making it suitable for automotive applications requiring high-speed processing and compatibility with CAN, Ethernet, I2C, SPI, UART, and USB interfaces.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA773PSGACDQ1 by Texas Instruments

DRA773PSGACDQ1

Texas Instruments

DRA773PSGACDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width and 64-bit external data bus width. It operates at a max clock frequency of 38.4 MHz, making it suitable for automotive applications requiring high-speed processing. With a package style of grid array and low profile, this device offers advanced features for CAN, Ethernet, I2C, SPI, UART, and USB bus compatibility.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA773PSGACDRQ1 by Texas Instruments

DRA773PSGACDRQ1

Texas Instruments

DRA773PSGACDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width and 64-bit external data bus width. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and supports various bus compatibilities like CAN, Ethernet, I2C, SPI, UART, and USB.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA776PPIGACDQ1 by Texas Instruments

DRA776PPIGACDQ1

Texas Instruments

DRA776PPIGACDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 38.4 MHz. Ideal for automotive applications, it features a low profile grid array package style and compatibility with CAN, Ethernet, I2C, SPI, UART, and USB interfaces.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA776PPIGACDRQ1 by Texas Instruments

DRA776PPIGACDRQ1

Texas Instruments

DRA776PPIGACDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 38.4 MHz. Ideal for automotive applications, it features a low profile grid array package with 784 terminals and operates in temperatures ranging from -40 to 125°C.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA777PSIGACDQ1 by Texas Instruments

DRA777PSIGACDQ1

Texas Instruments

DRA777PSIGACDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 38.4 MHz. Ideal for automotive applications, it features a low profile grid array package style and compatibility with CAN, Ethernet, I2C, SPI, UART, and USB interfaces.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA777PSIGACDRQ1 by Texas Instruments

DRA777PSIGACDRQ1

Texas Instruments

DRA777PSIGACDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width and 64-bit external data bus width. It operates at a max clock frequency of 38.4 MHz, making it suitable for automotive applications requiring high-speed data processing. With a package style of grid array and low profile, this device is ideal for space-constrained environments in the automotive industry.

32

YES

CAN; ETHERNET; I2C; SPI; UART; USB

38.4 MHz

64

S-PBGA-B784

e1

23 mm

3

247

784

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA746PPIGABZQ1 by Texas Instruments

DRA746PPIGABZQ1

Texas Instruments

The Texas Instruments DRA746PPIGABZQ1 is a multi-functional peripheral with 32MHz clock frequency, 512K RAM words, and 32-bit external data bus width. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

32 MHz

32

S-PBGA-B760

e1

23 mm

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

512K

AEC-Q100

1.63 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA746PPIGABZRQ1 by Texas Instruments

DRA746PPIGABZRQ1

Texas Instruments

Multifunction Peripherals; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: LFBGA; Package Shape: SQUARE;

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

32 MHz

32

S-PBGA-B760

e1

23 mm

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

512K

AEC-Q100

1.63 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA756PPIGABZQ1 by Texas Instruments

DRA756PPIGABZQ1

Texas Instruments

DRA756PPIGABZQ1 by Texas Instruments is a multi-functional peripheral with 32MHz clock frequency, 2.5M RAM words, and 32-bit external data bus width. Ideal for automotive applications due to AEC-Q100 screening level and compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

32 MHz

32

S-PBGA-B760

e1

23 mm

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA756PPIGABZRQ1 by Texas Instruments

DRA756PPIGABZRQ1

Texas Instruments

DRA756PPIGABZRQ1 by Texas Instruments is a multi-functional peripheral with 32MHz clock frequency, 2.5M RAM words, and 32-bit external data bus width. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

32 MHz

32

S-PBGA-B760

e1

23 mm

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2.5M

AEC-Q100

1.63 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MIMX8MM2CVTKZAA by NXP Semiconductors

MIMX8MM2CVTKZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM2CVTKZAA is a multi-functional SoC with 288K RAM, suitable for industrial applications. It features a max supply voltage of 1V, operating temperature range from -40 to 105°C, and compatibility with Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB interfaces. This package has a grid array style with 486 terminals in a square shape.

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

S-PBGA-B486

e2

14 mm

3

16

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

288K

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM4CVTKZAA by NXP Semiconductors

MIMX8MM4CVTKZAA

NXP Semiconductors

MIMX8MM4CVTKZAA by NXP Semiconductors is a multi-functional peripheral with a square package and 486 terminals. It operates at a voltage range of 0.9V to 1V and has a max operating temperature of 105°C. This SoC technology is compatible with various bus interfaces such as Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB.

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

S-PBGA-B486

e2

14 mm

3

16

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

288K

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM5CVTKZAA by NXP Semiconductors

MIMX8MM5CVTKZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM5CVTKZAA is a multi-functional SoC with 288K RAM, 486 terminals, and 0.95V nominal voltage. It is suitable for industrial applications requiring Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB bus compatibility. With a temperature range of -40 to 105°C and boundary scan capability, it offers versatile performance in various electronic systems.

24MHZ NOM CRYSTAL FREQ AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

S-PBGA-B486

e2

14 mm

3

16

486

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

288K

1.25 mm

1 V

.9 V

.95 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

DRA752PPGABZQ1 by Texas Instruments

DRA752PPGABZQ1

Texas Instruments

DRA752PPGABZQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and max clock frequency of 32 MHz. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

32 MHz

32

S-PBGA-B760

e1

23 mm

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

512K

AEC-Q100

1.63 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

DRA712BEGCBDRQ1 by Texas Instruments

DRA712BEGCBDRQ1

Texas Instruments

DRA712BEGCBDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 16-bit address bus width, and 512K RAM words. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

32 MHz

32

S-PBGA-B538

e1

17 mm

3

186

538

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

512K

AEC-Q100

1.298 mm

600 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

DRA712BGGCBDQ1 by Texas Instruments

DRA712BGGCBDQ1

Texas Instruments

DRA712BGGCBDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 16-bit address bus width, and 512K RAM words. It is designed for automotive applications, featuring a max clock frequency of 32 MHz and compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

32 MHz

32

S-PBGA-B538

e1

17 mm

3

186

538

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

512K

AEC-Q100

1.298 mm

600 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

DRA712BGGCBDRQ1 by Texas Instruments

DRA712BGGCBDRQ1

Texas Instruments

Multifunction Peripherals; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 538; Package Code: LFBGA; Package Shape: SQUARE;

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

32 MHz

32

S-PBGA-B538

e1

17 mm

3

186

538

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

512K

AEC-Q100

1.298 mm

600 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

LPC47N217N-ABZJ by Microchip Technology

LPC47N217N-ABZJ

Microchip Technology

LPC47N217N-ABZJ by Microchip Technology is a CMOS multi-functional peripheral with 56 terminals in a square chip carrier package. It operates at a nominal voltage of 3.3V and is compatible with PCI and ISA buses. With 13 I/O lines, it is suitable for various applications requiring compact design and low profile components.

NO

PCI; ISA

S-XQCC-N56

e3

8 mm

13

56

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.3 V

YES

CMOS

MATTE TIN

NO LEAD

.5 mm

QUAD

8 mm

CY8C5666AXQ-LP004 by Cypress Semiconductor

CY8C5666AXQ-LP004

Cypress Semiconductor

CY8C5666AXQ-LP004 by Cypress: 33MHz clock, 1.71-5.5V supply, 62 I/O lines. Ideal for industrial applications requiring CMOS technology with I2C, SPI, USB bus compatibility in a compact flatpack package.

0

YES

I2C; I2S, LIN; PS/2; SPI, USB

33 MHz

0

S-PQFP-G100

14 mm

62

100

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.8/5

Not Qualified

32768

524288 Bits

1.6 mm

Other uPs/uCs/Peripheral ICs

5.5 V

1.71 V

3.3 V

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

N

14 mm

MCIMX7D5EVM10SC by NXP Semiconductors

MCIMX7D5EVM10SC

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.1 V;

S-PBGA-B541

19 mm

3

541

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

BALL

.75 mm

BOTTOM

40

19 mm

TDA2HGBRQABCRQ1 by Texas Instruments

TDA2HGBRQABCRQ1

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;

16

32

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.5M

AEC-Q100

2.96 mm

750 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

TDA2SGBRQABCRQ1 by Texas Instruments

TDA2SGBRQABCRQ1

Texas Instruments

TDA2SGBRQABCRQ1 by Texas Instruments is a 32-bit microprocessor with 2.5M RAM words, operating at up to 38.4 MHz clock frequency. Ideal for automotive applications, it features CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB compatibility in a compact square package with 760 terminals and low power mode.

16

32

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.5M

AEC-Q100

2.96 mm

750 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

TDA2SXBTQABCRQ1 by Texas Instruments

TDA2SXBTQABCRQ1

Texas Instruments

TDA2SXBTQABCRQ1 by Texas Instruments is a 32-bit microprocessor with 760 terminals, operating at up to 38.4 MHz. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART and USB bus compatibility. With low power mode and boundary scan feature, it ensures efficient performance in multi-functional peripherals.

16

32

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.5M

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

B4860NXN7QUMD by NXP Semiconductors

B4860NXN7QUMD

NXP Semiconductors

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1020; Package Code: BGA; Package Shape: SQUARE;

16

YES

USB; PCI; I2C

133.333 MHz

64

S-PBGA-B1020

e1

33 mm

3

1020

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

2.93 mm

1.08 V

1.02 V

1.05 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

33 mm

DRA722AHGABCQ1 by Texas Instruments

DRA722AHGABCQ1

Texas Instruments

DRA722AHGABCQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and a max clock frequency of 27 MHz. Ideal for automotive applications, this microprocessor features a CMOS technology, operates at temperatures ranging from -40 to 125 °C, and supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

27 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA722AHGABCRQ1 by Texas Instruments

DRA722AHGABCRQ1

Texas Instruments

DRA722AHGABCRQ1 by Texas Instruments is a multi-functional peripheral with 16-bit address bus width, 32-bit external data bus width, and 512K RAM words. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

27 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA724JGABCRQ1 by Texas Instruments

DRA724JGABCRQ1

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

1

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1000 rpm

.01 mA

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA725LGABCRQ1 by Texas Instruments

DRA725LGABCRQ1

Texas Instruments

DRA725LGABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 38.4 MHz max clock frequency, and 512K RAM words. Ideal for automotive applications, it features a CMOS technology microprocessor with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB compatibility.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA725AGGABCQ1 by Texas Instruments

DRA725AGGABCQ1

Texas Instruments

The Texas Instruments DRA725AGGABCQ1 is a multi-functional peripheral with 760 terminals, 512K RAM words, and a max clock frequency of 38.4 MHz. Ideal for automotive applications, this microprocessor supports various bus compatibilities like CAN, Ethernet, and USB while operating at temperatures ranging from -40 to 125 °C.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA725AGGABCRQ1 by Texas Instruments

DRA725AGGABCRQ1

Texas Instruments

DRA725AGGABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 760 terminals, and 512K RAM words. Ideal for automotive applications, this microprocessor features a max clock frequency of 38.4 MHz and operates in a temperature range from -40 to 125°C.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

MCIMX6G1AVM05AB by NXP Semiconductors

MCIMX6G1AVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e2

14 mm

YES

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G1AVM07AB by NXP Semiconductors

MCIMX6G1AVM07AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e2

14 mm

YES

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

696 rpm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G2DVK05AB by NXP Semiconductors

MCIMX6G2DVK05AB

NXP Semiconductors

MCIMX6G2DVK05AB by NXP Semiconductors is a multi-functional peripheral IC with integrated cache and low power mode. It features an address bus width of 26, external data bus width of 16, and operates at a speed of 528 rpm. Ideal for applications requiring high-speed processing in compact electronic devices.

26

YES

16

FIXED POINT

YES

S-PBGA-B272

9 mm

YES

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G2DVM05AB by NXP Semiconductors

MCIMX6G2DVM05AB

NXP Semiconductors

MCIMX6G2DVM05AB by NXP Semiconductors is a Multi-functional Peripherals IC with 16-bit external data bus width, integrated cache, and low power mode. It operates b/w 0-95 °C and has a max supply voltage of 1.3 V. Ideal for applications requiring high-speed processing in compact devices.

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e1

14 mm

YES

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

MCIMX6G3DVM05AB by NXP Semiconductors

MCIMX6G3DVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

YES

16

FIXED POINT

YES

S-PBGA-B289

e1

14 mm

YES

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

528 rpm

1.3 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

MULTIFUNCTION PERIPHERAL

3530ECBCAMERCURY by Texas Instruments

3530ECBCAMERCURY

Texas Instruments

Texas Instruments 3530ECBCAMERCURY is a multi-functional peripheral with integrated cache and 64K RAM words. Featuring a max clock frequency of 38.4 MHz, it is ideal for industrial applications requiring high-speed processing. With compatibility for various bus types like CAN, I2C, and USB, this microprocessor offers versatile connectivity options.

26

YES

CAN; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

16

FIXED POINT

YES

S-PBGA-B515

e1

14 mm

YES

3

188

515

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

64K

1 mm

600 rpm

1.4175 V

1.2825 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

14 mm

MICROPROCESSOR, RISC

3530ECUSAGRM by Texas Instruments

3530ECUSAGRM

Texas Instruments

Texas Instruments 3530ECUSAGRM is a multi-functional peripheral with integrated cache and 64K RAM words. Featuring a max clock frequency of 38.4 MHz, it is ideal for industrial applications requiring low power mode and compatibility with CAN, I2C, IRDA, PCI, SPI, UART, USB buses.

26

YES

CAN; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

16

FIXED POINT

YES

S-PBGA-B423

e1

16 mm

YES

4

188

423

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

64K

1.4 mm

720 rpm

1.4175 V

1.2825 V

1.35 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

NOT SPECIFIED

16 mm

MICROPROCESSOR, RISC

OMAP3530ECBBALPD by Texas Instruments

OMAP3530ECBBALPD

Texas Instruments

OMAP3530ECBBALPD by Texas Instruments is a multi-functional peripheral with 64K RAM, 16-bit external data bus width, and 38.4 MHz clock frequency. Ideal for industrial applications requiring a microprocessor with low power mode, it supports various bus compatibilities like CAN, I2C, IRDA, PCI, SPI, UART, and USB.

26

YES

CAN; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

16

FIXED POINT

YES

S-PBGA-B515

e1

12 mm

YES

3

188

515

105 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

64K

.9 mm

720 rpm

1.4175 V

1.2825 V

1.35 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MICROPROCESSOR, RISC

OMAP3530ECBBLPD by Texas Instruments

OMAP3530ECBBLPD

Texas Instruments

OMAP3530ECBBLPD by Texas Instruments features 64K RAM, 16-bit external data bus, and 38.4 MHz clock frequency. Ideal for microprocessor applications requiring low power mode and compatibility with CAN, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

26

YES

CAN; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

16

FIXED POINT

YES

S-PBGA-B515

e1

12 mm

YES

3

188

515

90 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

64K

.9 mm

720 rpm

1.4175 V

1.2825 V

1.35 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

NOT SPECIFIED

12 mm

MICROPROCESSOR, RISC

66AK2H06DAAW24 by Texas Instruments

66AK2H06DAAW24

Texas Instruments

The Texas Instruments 66AK2H06DAAW24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It is a microprocessor suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The device operates b/w temperatures of 0 to 85°C and features a terminal pitch of 1mm.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H06DAAW2 by Texas Instruments

66AK2H06DAAW2

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H06DAAWA24 by Texas Instruments

66AK2H06DAAWA24

Texas Instruments

The Texas Instruments 66AK2H06DAAWA24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It operates in industrial temperature grades, featuring a CMOS technology microprocessor suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB bus compatibility. With a package style of grid array and terminal pitch of 1mm, it offers high performance in compact dimensions.

32

YES

ETHERNET; I2C; PCI; SPI; UART; USB

128

S-PBGA-B1517

e1

40 mm

4

32

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

6M

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC