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B4860NXN7QUMD

NXP Semiconductors

B4860NXN7QUMD by NXP Semiconductors

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1020; Package Code: BGA; Package Shape: SQUARE;

Median Price

$661.960

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 447 parts In-Stock

1+ parts

$529.570

100+ parts

$497.800

1k+ parts

$466.020

10k+ parts

-

447

$529.570

$497.800

$466.020

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DigiKey

USA . 447 parts In-Stock

1+ parts

$661.960

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447

$661.960

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Verical

USA . 447 parts In-Stock

1+ parts

$661.962

100+ parts

$622.250

1k+ parts

$582.525

10k+ parts

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447

$661.962

$622.250

$582.525

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Flip Electronics (Authorized)

USA . 48 parts In-Stock

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48

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Distributors (In-Stock)

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Digiode

USA . 3,186 parts In-Stock

1+ parts

$584.146

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3,186

$584.146

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Vyrian

USA . 8,784 parts In-Stock

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Anansix

USA . 2,456 parts In-Stock

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Flip Electronics

USA . 42 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,311 parts In-Stock

1+ parts

$2.596

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1,311

$2.596

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Corohmni

South Africa . 681 parts In-Stock

1+ parts

$21.374

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681

$21.374

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Ampacity Inc.

Singapore . 245 parts In-Stock

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$522.660

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245

$522.660

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Corphita

USA . 1,036 parts In-Stock

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$553.401

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1,036

$553.401

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Microchip USA

USA . 2,180 parts In-Stock

1+ parts

$721.446

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2,180

$721.446

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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UNI Independent Distributors

Spain . 1,806 parts In-Stock

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1,806

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Native Components

USA . 158 parts In-Stock

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$2.289

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158

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$2.289

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Perfect Parts

USA . 2 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1 parts In-Stock

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1

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Technical Specifications

Multi-functional Peripherals B4860NXN7QUMD attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

USB; PCI; I2C

Maximum Clock Frequency:

133.333 MHz

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B1020

JESD-609 Code:

e1

Length:

33 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.93 mm

Maximum Supply Voltage:

1.08 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

33 mm

Trade Compliance

B4860NXN7QUMD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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