Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT29F32G08ABCABH1-10Z:A
Micron Technology
Micron Technology's MT29F32G08ABCABH1-10Z:A is a 4GX8 SLC NAND flash memory with 4294967296 words capacity. It operates at temperatures from 0 to 70°C, with a max access time of 20 ns. Ideal for commercial applications requiring high memory density and low standby current consumption.
20 ns
YES
NO
R-PBGA-B100
34359738368 bit
FLASH
8
4K
100
4294967296 words
4G
70 Cel
0 Cel
4GX8
PLASTIC/EPOXY
BGA
BGA100,10X17,40
RECTANGULAR
GRID ARRAY
8K
PARALLEL
1.8,3/3.3
Not Qualified
1M
.00001 Amp
Flash Memories
50 mA
CMOS
COMMERCIAL
BALL
1 mm
BOTTOM
SLC NAND TYPE
MT29F64G08AFAAAWP-Z:A
Micron Technology's MT29F64G08AFAAAWP-Z:A is a 3V/3.3V SLC NAND Flash Memory with 8GX8 organization, 8K sectors, and 1M sector size. It operates b/w 0-70°C, has a memory density of 68719476736 bits, and supports parallel interface. Ideal for commercial applications requiring fast access times and low standby current consumption.
R-PDSO-G48
68719476736 bit
48
8589934592 words
8G
8GX8
TSSOP
TSSOP48,.8,20
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
3/3.3
GULL WING
.5 mm
DUAL
MT29F64G08AECABH1-10ITZ:A
MT29F64G08AECABH1-10ITZ:A by Micron Technology is an 8GX8 SLC NAND flash memory with 8K sectors. Operating at -40 to 85 °C, it has a memory density of 68719476736 bit and max access time of 20 ns. Ideal for industrial applications requiring fast, reliable data storage with low standby current consumption.
85 Cel
-40 Cel
INDUSTRIAL
MT29F64G08AECABH1-10Z:A
MT29F64G08AECABH1-10Z:A by Micron Technology is a 8GX8 SLC NAND flash memory with 8K sectors and 1M word sector size. Operating at 0-70 °C, it has a max access time of 20 ns and consumes up to 50 mA current. Ideal for commercial applications requiring high memory density and fast data access.
MT29F128G08AJAAAWP-Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
137438953472 bit
16K
17179869184 words
16G
16GX8
MT29F128G08AKCABH2-10Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Page Size (words): 8K;
MT29F128G08AKCABH2-10ITZ:A
Micron Technology's MT29F128G08AKCABH2-10ITZ:A is a 16GX8 SLC NAND flash memory with 1M sector size and 8K page size. It operates at industrial temperature grade, with parallel interface and 100 terminals in a grid array package. Ideal for applications requiring high-speed data storage and retrieval.
MT29F128G08AMCABH2-10ITZ:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8,3/3.3;
260
30
MT29F128G08AMCABH2-10Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00001 Amp;
MT29F256G08AUCABH3-10ITZ:A
Micron Technology's MT29F256G08AUCABH3-10ITZ:A is a SLC NAND flash memory with 32K sectors, 8K page size, and 1M sector size. It operates at temperatures from -40 to 85°C and has a max access time of 20 ns. Ideal for industrial applications requiring high-density memory with low standby current.
274877906944 bit
32K
MT29F256G08AUCABH3-10Z:A
MT29F2G08ABBFAH4:F
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Toggle Bit: NO;
25 ns
R-PBGA-B63
2147483648 bit
2K
63
268435456 words
256M
256MX8
FBGA
BGA63,10X12,32
GRID ARRAY, FINE PITCH
1.8
128K
.00005 Amp
20 mA
.8 mm
N25Q064A13E14D0E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 108 MHz;
108 MHz
20
100000 Write/Erase Cycles
R-PBGA-B24
67108864 bit
24
8388608 words
8M
8MX8
BGA24,4X6,40
SERIAL
SPI
.0001 Amp
NOR TYPE
HARDWARE/SOFTWARE
M29W128GSH70N6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Sectors/Size: 128;
70 ns
R-PDSO-G56
134217728 bit
16
128
56
8MX16
TSSOP56,.8,20
8/16
M29W128GSL70N6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;
PC28F256P30TFE
Micron Technology's PC28F256P30TFE is a 16Mx16 NOR flash memory with 1.8V supply, operating at -40 to 85°C. It features synchronous operation, 16K/64K sector sizes, and a common flash interface. Ideal for industrial applications requiring fast access times and low standby current.
100 ns
TOP
R-PBGA-B64
e1
13 mm
268435456 bit
1
4,255
64
16777216 words
16M
SYNCHRONOUS
16MX16
TBGA
BGA64,8X8,40
GRID ARRAY, THIN PROFILE
1.8,1.8/3.3
1.2 mm
16K,64K
.00021 Amp
31 mA
2 V
1.7 V
Tin/Silver/Copper (Sn/Ag/Cu)
10 mm
SST39VF3202C-70-4I-B3KE
Microchip Technology
SST39VF3202C-70-4I-B3KE by Microchip: 2MX16 Flash Memory with 3V supply, 70ns access time. Ideal for industrial applications, offers 100K write/erase cycles and operates in asynchronous mode.
TOP BOOT-BLOCK
R-PBGA-B48
8 mm
33554432 bit
3
8,63
2097152 words
2M
ASYNCHRONOUS
2MX16
3-STATE
TFBGA
BGA48,6X8,32
GRID ARRAY, THIN PROFILE, FINE PITCH
4K,32K
45 mA
3.6 V
2.7 V
TIN SILVER COPPER
40
6 mm
N25Q128A13B1240E
N25Q128A13B1240E by Micron Technology is a NOR type flash memory with 16MX8 organization and a memory density of 134217728 bits. It operates at a max clock frequency of 108 MHz and has a min data retention time of 20 years. This flash memory is commonly used in industrial applications for its high endurance of 100000 write/erase cycles.
16MX8
BGA24,5X5,40
N25Q128A13BF840E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
R-PDSO-N8
HVSON
SOLCC8,.3
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
NO LEAD
1.27 mm
N25Q128A13BSF40G
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 16777216 words;
R-PDSO-G16
10.3 mm
SOP
SOP16,.4
SMALL OUTLINE
2.65 mm
7.5 mm
N25Q128A13TF840E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
N25Q128A13TSF40G
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Boot Block: TOP;
N25Q128A23B1240E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Width: 8;
N25Q128A23BF840E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words Code: 16M;
N25Q128A23BSF40G
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
RC28F640P33TF60A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Power Supplies (V): 2.5/3.3;
60 ns
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
e0
4,63
4194304 words
4M
4MX16
2.5/3.3
.002 Amp
28 mA
2.3 V
TIN LEAD SILVER
NAND512W3A2SN6E
Micron's NAND512W3A2SN6E is a 64MX8 SLC NAND flash memory with 536870912-bit density. Operating at 3V, it has a temp range of -40 to 85°C and uses parallel interface with 0.5mm pitch. Ideal for industrial applications, this compact chip measures 18.4mm x 12mm x 1.2mm and features Ni/Pd/Au finish on dual terminals.
e4
18.4 mm
536870912 bit
67108864 words
64M
64MX8
Nickel/Palladium/Gold (Ni/Pd/Au)
12 mm
JS28F128P30BF75A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
75 ns
e3
4,127
.000055 Amp
MATTE TIN
14 mm
PC28F256P30BFE
Micron Technology's PC28F256P30BFE is a 16Mx16 NOR flash memory with 1.8V supply, operating at -40 to 85°C. Featuring synchronous mode, it has 4 sectors of 255 words each and supports common flash interface. Ideal for industrial applications requiring fast access time and low standby current.
ASYNCHRONOUS READ MODE
MTFDCAE001SAF-1D1IT
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; Minimum Operating Temperature: -40 Cel;
R-XXMA-X
36.9 mm
8589934592 bit
FLASH MODULE
1073741824 words
1G
1GX8
UNSPECIFIED
XMA
MICROELECTRONIC ASSEMBLY
5
9.7 mm
.06 Amp
120 mA
5.25 V
4.75 V
26.6 mm
MTFDCAE001SAF-1D1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Supply Voltage (Vsup): 4.75 V;
MTFDCAE002SAF-1B1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Memory Density: 17179869184 bit;
17179869184 bit
2147483648 words
2G
2GX8
MTFDCAE004SAF-1B1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Programming Voltage (V): 5; No. of Functions: 1;
SST39LF401C-55-4C-B3KE
SST39LF401C-55-4C-B3KE by Microchip Technology is a 256Kx16 NOR flash memory with 100000 Write/Erase Cycles. Operating at 3.3V, it offers fast access time of 55ns and features a parallel interface for high-speed data transfer. Ideal for applications requiring reliable non-volatile memory storage in commercial temperature environments.
55 ns
BOTTOM BOOT BLOCK
4194304 bit
1,2,1,7
262144 words
256K
256KX16
3.3
8K,4K,16K,32K
.00002 Amp
30 mA
3 V
SST39LF402C-55-4C-B3KE
SST39LF402C-55-4C-B3KE by Microchip: 256Kx16 NOR Flash Memory with 70°C max temp, 55ns access time, and 100k Write/Erase cycles. Ideal for commercial applications requiring fast data access and high endurance.
TOP BOOT BLOCK
SST39VF402C-70-4I-B3KE
SST39VF402C-70-4I-B3KE by Microchip Technology is a 256Kx16 NOR flash memory with 3V nominal voltage. It features 100,000 write/erase cycles, operates in industrial temperature range (-40 to 85°C), and has a max access time of 70ns. Ideal for applications requiring fast, reliable non-volatile memory storage in compact electronic devices.
RC28F00AM29EWHA
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Power Supplies (V): 3/3.3;
1073741824 bit
1K
64MX16
LBGA
GRID ARRAY, LOW PROFILE
16/32
1.4 mm
.00024 Amp
11 mm
M45PE10S-VMN6P
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
75 MHz
R-PDSO-G8
4.9 mm
1048576 bit
131072 words
128KX8
NOT SPECIFIED
2.7
1.75 mm
3.9 mm
23 ms
M45PE10S-VMP6G
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm;
5 mm
TC58NVG1S3ETAI0
Toshiba
Toshiba's TC58NVG1S3ETAI0 is a 256MX8 flash memory with 2K sectors and 128K word sector size. Operating at 3.3V, it offers fast access time of 25ns and low standby current of 0.00005Amp. Ideal for industrial applications requiring high memory density and reliable performance in a small outline package.
N25Q256A13EF840E
Micron Technology's N25Q256A13EF840E is a NOR type Flash Memory with 256Mx1 organization, operating in synchronous mode at up to 108MHz clock frequency. Ideal for industrial applications, it offers a memory density of 268435456 bits and supports SPI serial bus communication.
256MX1
HSON
SMALL OUTLINE, HEAT SINK/SLUG
.00025 Amp
N25Q256A13EF840F
N25Q256A13EF840F by Micron Technology is a NOR flash memory with 32MX8 organization, SPI serial bus type, and 108 MHz clock frequency. It operates at temperatures ranging from -40 to 85 °C and has an endurance of 100K write/erase cycles. Ideal for industrial applications requiring high-speed data storage in compact devices.
SPI-COMPATIBLE SERIAL BUS INTERFACE
33554432 words
32M
32MX8
NAND128W3AABN6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
35 ns
Matte Tin (Sn)
MTFDDAC128MAM-1J1
FLASH; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Programming Voltage (V): 5; No. of Functions: 1; Package Body Material: UNSPECIFIED;
R-XXMA-N
100.2 mm
MLC NAND TYPE
69.85 mm
MTFDDAC256MAM-1K1
FLASH; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Terminal Form: NO LEAD; Package Body Material: UNSPECIFIED;
MTFDDAK128MAM-1J1
FLASH; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Length: 100.2 mm; Surface Mount: YES; No. of Functions: 1;
7 mm
MTFDDAK256MAM-1K1
FLASH; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Length: 100.2 mm; Surface Mount: YES; Width: 69.85 mm;
MTFDDAK512MAM-1K1
FLASH; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; No. of Functions: 1; Technology: CMOS; Maximum Seated Height: 7 mm;
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