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SST39LF402C-55-4C-B3KE

Microchip Technology

SST39LF402C-55-4C-B3KE by Microchip Technology

SST39LF402C-55-4C-B3KE by Microchip: 256Kx16 NOR Flash Memory with 70°C max temp, 55ns access time, and 100k Write/Erase cycles. Ideal for commercial applications requiring fast data access and high endurance.

Median Price

$1.470

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 5,280 parts In-Stock

1+ parts

$1.470

100+ parts

$1.370

1k+ parts

$1.280

10k+ parts

$1.220

5,280

$1.470

$1.370

$1.280

$1.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$1.452

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$1.452

-

-

-

NAC Semi

USA . 4,320 parts In-Stock

1+ parts

$1.580

100+ parts

$1.430

1k+ parts

$1.290

10k+ parts

-

4,320

$1.580

$1.430

$1.290

-

Vyrian

USA . 4,904 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,904

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,936 parts In-Stock

1+ parts

$1.250

100+ parts

-

1k+ parts

-

10k+ parts

-

4,936

$1.250

-

-

-

Argo Parts USA

USA . 5,394 parts In-Stock

1+ parts

$1.452

100+ parts

-

1k+ parts

-

10k+ parts

-

5,394

$1.452

-

-

-

Continental Prestige Electronics

USA . 4,506 parts In-Stock

1+ parts

$1.452

100+ parts

-

1k+ parts

-

10k+ parts

$1.423

4,506

$1.452

-

-

$1.423

AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$17.490

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$17.490

-

-

-

RGB Technical Solutions

Ukraine . 4,774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,774

-

-

-

-

Overview

Unlock endless possibilities with the Microchip Technology SST39LF402C-55-4C-B3KE Flash Memory. Crafted with precision and expertise, this innovative product offers unparalleled reliability and performance. Ideal for a wide range of applications, this flash memory provides customers with seamless operation and efficient data storage solutions. Experience the value and benefits of cutting-edge technology with the Microchip Technology SST39LF402C-55-4C-B3KE- where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product durable and resistant to impact, prolonging its lifespan.

Nominal Supply Voltage / Vsup (V): 3.3

The optimal supply voltage ensures efficient performance and reliability of the flash memory.

No. of Terminals: 48

Having a large number of terminals allows for a more complex and efficient operation of the flash memory.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this flash memory can withstand harsh environments and perform consistently.

Endurance: 100000 Write/Erase Cycles

The high endurance rating ensures the longevity and reliability of the flash memory, making it suitable for frequent write and erase operations.

Technical Specifications

Flash Memory SST39LF402C-55-4C-B3KE attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Access Time:

55 ns

Additional Features:

TOP BOOT BLOCK

Boot Block:

TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Sectors/Size:

1,2,1,7

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

8K,4K,16K,32K

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

6 mm

Trade Compliance

SST39LF402C-55-4C-B3KE Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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