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SST39VF3202C-70-4I-B3KE

Microchip Technology

SST39VF3202C-70-4I-B3KE by Microchip Technology

SST39VF3202C-70-4I-B3KE by Microchip: 2MX16 Flash Memory with 3V supply, 70ns access time. Ideal for industrial applications, offers 100K write/erase cycles and operates in asynchronous mode.

Median Price

$3.360

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 549 parts In-Stock

1+ parts

$3.360

100+ parts

$2.600

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10k+ parts

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549

$3.360

$2.600

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 960 parts In-Stock

1+ parts

$2.860

100+ parts

$2.580

1k+ parts

$2.330

10k+ parts

-

960

$2.860

$2.580

$2.330

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Maritex

Poland . 600 parts In-Stock

1+ parts

$5.096

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600

$5.096

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Chip Stock

USA . 28,650 parts In-Stock

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28,650

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Vyrian

USA . 7,592 parts In-Stock

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7,592

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Corohmni

South Africa . 360 parts In-Stock

1+ parts

$5.121

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-

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360

$5.121

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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LOOK Integrated Logistics

Peru . 7,835 parts In-Stock

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7,835

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NIA Electronics

USA . 7,054 parts In-Stock

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7,054

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Ledger Components

France . 7,054 parts In-Stock

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7,054

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Argo Parts USA

USA . 4,553 parts In-Stock

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4,553

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Montano Global Distributors

Canada . 2,562 parts In-Stock

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2,562

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Continental Prestige Electronics

USA . 1,679 parts In-Stock

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1,679

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LMD Electronica

Estonia . 851 parts In-Stock

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851

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Perfect Parts

USA . 538 parts In-Stock

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538

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of reliable and high-quality flash memory with Microchip Technology's SST39VF3202C-70-4I-B3KE. This versatile product offers unmatched value and benefits for a wide range of applications. Whether you're looking to enhance your industrial systems or boost the performance of your consumer electronics, this flash memory device is the perfect solution. Trust in Microchip Technology's expertise and experience in delivering top-notch technology to meet your needs. Elevate your projects with the exceptional advantages that this product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Operating Mode: ASYNCHRONOUS

Allows for independent operations without requiring synchronization, offering flexibility in usage.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance in challenging environments.

Memory Density: 33554432 bit

Offers a large storage capacity, ideal for storing a vast amount of data.

Endurance: 100000 Write/Erase Cycles

Can sustain a high number of write and erase cycles, prolonging the lifespan of the product.

Technical Specifications

Flash Memory SST39VF3202C-70-4I-B3KE attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Access Time:

70 ns

Additional Features:

TOP BOOT-BLOCK

Boot Block:

TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Sectors/Size:

8,63

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

4K,32K

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

6 mm

Trade Compliance

SST39VF3202C-70-4I-B3KE Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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